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1. 发明授权

US08599539B2 Ceramic chip assembly 有权
标题翻译：陶瓷芯片组装
公开(公告)号：US08599539B2
公开(公告)日：2013-12-03
申请号：US13193836
申请日：2011-07-29
申请人： Sun-Ki Kim , Seong-Jin Lee , Ki-Han Park
发明人： Sun-Ki Kim , Seong-Jin Lee , Ki-Han Park
IPC分类号： H05K7/00 , H05K3/10
CPC分类号： G01K7/16 , G01K1/08 , H01C1/028 , H01C7/008 , H01G2/103 , H01G4/224 , H01G4/236 , H01L2924/0002 , H01L2924/00
摘要： Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.
摘要翻译：提供了一种陶瓷芯片组件，其被配置为经济地且可靠地将金属引线的暴露部分与环境变化绝缘。陶瓷芯片组件包括具有电特性的陶瓷基体，分别设置在陶瓷基体的一对表面上的一对外部电极，陶瓷基体的彼此相对的表面，一对金属引线作为具有分别通过导电性粘接部件，绝缘密封剂密封陶瓷基体，外部电极以及金属引线的第一端部的绝缘密封材料而分别与外部电极电连接和机械连接的第一端的单芯金属引线的端部和连续地形成在绝缘密封剂和从绝缘密封剂露出的金属引线的部分上的绝缘聚合物涂层。

2. 发明授权

US08315763B2 Control apparatus for vehicle 有权
标题翻译：车辆控制装置
公开(公告)号：US08315763B2
公开(公告)日：2012-11-20
申请号：US12535227
申请日：2009-08-04
申请人： Seong Jin Lee
发明人： Seong Jin Lee
IPC分类号： B60R16/023
CPC分类号： B60R25/00
摘要： The present invention relates to a control apparatus for vehicle, and in particular, to a control apparatus for vehicle that is capable of changing an operation mode of body controller of vehicle as well as changing various electronic instruments in the vehicle. In particular embodiments, a control apparatus for vehicle that controls various electronic instruments of vehicle according to the present invention includes a key input unit that receives an operation mode selection signal for one of a plurality of operation modes for a specific body controller; and a multimedia CAN communications unit that sends the operation mode selection signal to a body controller through a gateway, receives and displays an operation mode change confirmation signal from the body controller through the gateway.
摘要翻译：本发明涉及一种用于车辆的控制装置，特别涉及能够改变车辆的车身控制器的操作模式以及改变车辆中的各种电子仪器的车辆控制装置。在具体实施例中，根据本发明的用于控制车辆的各种电子仪器的车辆控制装置包括：键输入单元，其接收用于特定车身控制器的多个操作模式之一的操作模式选择信号; 以及通过网关将操作模式选择信号发送到身体控制器的多媒体CAN通信单元，通过网关从身体控制器接收并显示操作模式改变确认信号。

3. 外观设计

USD661414S1 LED lamp 有权
公开(公告)号：USD661414S1
公开(公告)日：2012-06-05
申请号：US29382057
申请日：2010-12-28
申请人： Ki Tae Kang , Seong Jin Lee
设计人： Ki Tae Kang , Seong Jin Lee

4. 发明申请

US20120026659A1 CERAMIC CHIP ASSEMBLY 有权
标题翻译：陶瓷芯片大会
公开(公告)号：US20120026659A1
公开(公告)日：2012-02-02
申请号：US13193836
申请日：2011-07-29
申请人： SUN-KI KIM , Seong-Jin Lee , Ki-Han Park
发明人： SUN-KI KIM , Seong-Jin Lee , Ki-Han Park
IPC分类号： H05K7/00 , H05K3/10
CPC分类号： G01K7/16 , G01K1/08 , H01C1/028 , H01C7/008 , H01G2/103 , H01G4/224 , H01G4/236 , H01L2924/0002 , H01L2924/00
摘要： Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.
摘要翻译：提供了一种陶瓷芯片组件，其被配置为经济地且可靠地将金属引线的暴露部分与环境变化绝缘。陶瓷芯片组件包括具有电特性的陶瓷基体，分别设置在陶瓷基体的一对表面上的一对外部电极，陶瓷基体的彼此相对的表面，一对金属引线作为具有分别通过导电性粘接部件，绝缘密封剂密封陶瓷基体，外部电极以及金属引线的第一端部的绝缘密封材料而分别与外部电极电连接和机械连接的第一端的单芯金属引线的端部和连续地形成在绝缘密封剂和从绝缘密封剂露出的金属引线的部分上的绝缘聚合物涂层。

5. 外观设计

USD644761S1 LED lamp 有权
公开(公告)号：USD644761S1
公开(公告)日：2011-09-06
申请号：US29382053
申请日：2010-12-28
申请人： Seong Jin Lee , Ki Tae Kang , Do Hyoung Kim
设计人： Seong Jin Lee , Ki Tae Kang , Do Hyoung Kim

6. 发明授权

US08861159B2 Semiconductor device and systems including the same 有权
标题翻译：半导体装置和系统包括它们
公开(公告)号：US08861159B2
公开(公告)日：2014-10-14
申请号：US13227060
申请日：2011-09-07
申请人： Seong-Jin Lee , Jang Seok Choi
发明人： Seong-Jin Lee , Jang Seok Choi
IPC分类号： H01L23/62
CPC分类号： G06F1/22 , H01L2224/16145
摘要： The semiconductor device is provided. The semiconductor device includes a substrate, an electrostatic discharge layer disposed on the substrate and including a plurality of electrostatic discharge circuits, at least one semiconductor chip stacked on the electrostatic discharge layer, and a plurality of vertical electrical connections which pass through the at least one semiconductor chip and the electrostatic discharge layer to connect the at least one semiconductor chip to the semiconductor substrate. The vertical electrical connections are connected to the electrostatic discharge circuits, respectively.
摘要翻译：提供半导体器件。半导体器件包括衬底，设置在衬底上的静电放电层，并且包括多个静电放电电路，堆叠在静电放电层上的至少一个半导体芯片和穿过至少一个的多个垂直电连接半导体芯片和静电放电层，以将至少一个半导体芯片连接到半导体衬底。垂直电气连接分别连接到静电放电电路。

7. 发明授权

US08492770B2 Thin film transistor and method of manufacturing the same 有权
标题翻译：薄膜晶体管及其制造方法
公开(公告)号：US08492770B2
公开(公告)日：2013-07-23
申请号：US13035054
申请日：2011-02-25
申请人： Jae-Woo Park , Je-Hun Lee , Seong-Jin Lee , Yeon-Hong Kim
发明人： Jae-Woo Park , Je-Hun Lee , Seong-Jin Lee , Yeon-Hong Kim
IPC分类号： H01L29/786
CPC分类号： H01L29/04 , H01L29/786
摘要： A thin film transistor includes a gate electrode formed on a substrate, a semiconductor pattern overlapped with the gate electrode, a source electrode overlapped with a first end of the semiconductor pattern and a drain electrode overlapped with a second end of the semiconductor pattern and spaced apart from the source electrode. The semiconductor pattern includes an amorphous multi-elements compound including a II B element and a VI A element or including a III A element and a V A element and having an electron mobility no less than 1.0 cm2/Vs and an amorphous phase, wherein the VI A element excludes oxygen. Thus, a driving characteristic of the thin film transistor may be improved.
摘要翻译：薄膜晶体管包括形成在基板上的栅极电极，与栅电极重叠的半导体图案，与半导体图案的第一端重叠的源电极和与半导体图案的第二端重叠并分开的漏电极源极电极。半导体图案包括包含IIB元素和VIA元素或包含IIIA元素和VA元素并且具有不小于1.0cm 2 / Vs的电子迁移率的无定形多元素化合物和非晶相，其中VI 一个元素排除氧气。因此，可以提高薄膜晶体管的驱动特性。

8. 发明申请

US20120106011A1 SEMICONDUCTOR DEVICE AND SYSTEMS INCLUDING THE SAME 有权
标题翻译：半导体器件和系统，包括它们
公开(公告)号：US20120106011A1
公开(公告)日：2012-05-03
申请号：US13227060
申请日：2011-09-07
申请人： Seong-Jin Lee , Jang Seok Choi
发明人： Seong-Jin Lee , Jang Seok Choi
IPC分类号： H02H9/04 , G06F1/16 , H01L29/861
CPC分类号： G06F1/22 , H01L2224/16145
摘要： The semiconductor device is provided. The semiconductor device includes a substrate, an electrostatic discharge layer disposed on the substrate and including a plurality of electrostatic discharge circuits, at least one semiconductor chip stacked on the electrostatic discharge layer, and a plurality of vertical electrical connections which pass through the at least one semiconductor chip and the electrostatic discharge layer to connect the at least one semiconductor chip to the semiconductor substrate. The vertical electrical connections are connected to the electrostatic discharge circuits, respectively.
摘要翻译：提供半导体器件。半导体器件包括衬底，设置在衬底上的静电放电层，并且包括多个静电放电电路，堆叠在静电放电层上的至少一个半导体芯片和穿过至少一个的多个垂直电连接半导体芯片和静电放电层，以将至少一个半导体芯片连接到半导体衬底。垂直电气连接分别连接到静电放电电路。

9. 外观设计

USD647639S1 LED lamp 有权
公开(公告)号：USD647639S1
公开(公告)日：2011-10-25
申请号：US29382046
申请日：2010-12-28
申请人： Seong Jin Lee , Hyun Gu Kang , Do Hyoung Kim
设计人： Seong Jin Lee , Hyun Gu Kang , Do Hyoung Kim

10. 发明申请

US20100131156A1 CONTROL APPARATUS FOR VEHICLE 有权
标题翻译：车辆控制装置
公开(公告)号：US20100131156A1
公开(公告)日：2010-05-27
申请号：US12535227
申请日：2009-08-04
申请人： Seong Jin Lee
发明人： Seong Jin Lee
IPC分类号： G06F19/00
CPC分类号： B60R25/00
摘要： The present invention relates to a control apparatus for vehicle, and in particular, to a control apparatus for vehicle that is capable of changing an operation mode of body controller of vehicle as well as changing various electronic instruments in the vehicle. In particular embodiments, a control apparatus for vehicle that controls various electronic instruments of vehicle according to the present invention includes a key input unit that receives an operation mode selection signal for one of a plurality of operation modes for a specific body controller; and a multimedia CAN communications unit that sends the operation mode selection signal to a body controller through a gateway, receives and displays an operation mode change confirmation signal from the body controller through the gateway.
摘要翻译：本发明涉及一种用于车辆的控制装置，特别涉及能够改变车辆的车身控制器的操作模式以及改变车辆中的各种电子仪器的车辆控制装置。在具体实施例中，根据本发明的用于控制车辆的各种电子仪器的车辆控制装置包括：键输入单元，其接收用于特定车身控制器的多个操作模式之一的操作模式选择信号; 以及通过网关将操作模式选择信号发送到身体控制器的多媒体CAN通信单元，通过网关从身体控制器接收并显示操作模式改变确认信号。

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