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    • 8. 发明授权
    • Thin film actuated mirror array
    • 薄膜致动反射镜阵列
    • US6115172A
    • 2000-09-05
    • US106845
    • 1998-06-30
    • Seong-Hoon Jeong
    • Seong-Hoon Jeong
    • G02B26/08G09F9/37H01L49/00G02B26/00
    • G02B26/0841G02B26/0833
    • Thin film AMA is disclosed. The thin film AMA has an active matrix, a supporting member, an actuator, and a reflecting member. The actuator has a bottom electrode, two active layers, and two top electrodes. The actuator has maximum tilting angle due to margins formed between the bottom electrode and the two active layers or between the two active layers and the two top electrodes. Also, the tilting angle of the actuator is increased because the layers of the actuator respectively have proper thicknesses. Therefore, the quality of the picture projected onto a screen is enhanced and the arrangement of the AMA may be more easy.
    • 公开了薄膜AMA。 薄膜AMA具有有源矩阵,支撑构件,致动器和反射构件。 致动器具有底部电极,两个有源层和两个顶部电极。 由于在底部电极和两个有源层之间或两个有源层和两个顶部电极之间形成的边缘,致动器具有最大倾斜角。 此外,致动器的倾斜角度增加,因为致动器的层分别具有适当的厚度。 因此,投影到屏幕上的图像的质量得到提高,并且AMA的布置可能更容易。
    • 10. 发明授权
    • Semiconductor devices having polysilicon gate layer patterns and methods of manufacturing the same
    • 具有多晶硅栅极层图案的半导体器件及其制造方法
    • US08319260B2
    • 2012-11-27
    • US12805400
    • 2010-07-29
    • Deok-Hyung LeeSoo-Jin HongSeong-Hoon Jeong
    • Deok-Hyung LeeSoo-Jin HongSeong-Hoon Jeong
    • H01L21/336
    • H01L21/823807H01L21/823842H01L29/7845
    • In semiconductor devices, methods of forming the same, the semiconductor device include a first gate structure having a first gate oxide layer pattern, a first polysilicon layer pattern containing atoms larger than silicon and a first hard mask layer pattern on substrates under tensile stress. N-type impurity regions are formed under the surface of the substrate on both sides of the first gate structure. A second gate structure having a second gate oxide layer pattern, a second polysilicon layer pattern containing atoms smaller than silicon and a second hard mask layer pattern on substrates under compressive stress. Additionally, P-type impurity regions are formed under the surface of the substrate on both sides of the second gate structure. The semiconductor devices have good device properties.
    • 在半导体器件中,形成半导体器件的方法包括具有第一栅极氧化层图案的第一栅极结构,包含比硅大的原子的第一多晶硅层图案和在拉伸应力下的基板上的第一硬掩模层图案。 在第一栅极结构的两侧的衬底的表面下方形成N型杂质区。 具有第二栅极氧化物层图案的第二栅极结构,在压缩应力下在基底上含有小于硅的原子的第二多晶硅层图案和第二硬掩模层图案。 此外,在第二栅极结构的两侧在基板的表面下方形成P型杂质区。 半导体器件具有良好的器件特性。