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1. 发明授权

US09179577B2 Flat heat pipe and fabrication method thereof 有权
标题翻译：扁平热管及其制造方法
公开(公告)号：US09179577B2
公开(公告)日：2015-11-03
申请号：US13572176
申请日：2012-08-10
申请人： Seok Hwan Moon
发明人： Seok Hwan Moon
IPC分类号： F28D15/04 , H05K7/20 , F28F1/20 , H01L23/427
CPC分类号： H05K7/20336 , F28D15/0233 , F28D15/046 , F28F1/20 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： Disclosed are a flat heat pipe which has a structure integrated with a heat sink, and a facilitated fabrication method thereof. The flat heat pipe includes: a flat body portion including a plurality of heat sink fins formed on an outer surface thereof, and a plurality of through-holes formed therein and being separated by at least one separation film; and at least one groove formed in at least one surface from among a top surface and a bottom surface of one side portion of each of the plurality of through-holes.
摘要翻译：公开了具有与散热器一体化的结构的扁平热管及其制造方法。扁平热管包括：平坦体部分，其包括形成在其外表面上的多个散热鳍片，以及形成在其中并被至少一个分离膜隔开的多个通孔; 以及形成在所述多个通孔中的每一个的一个侧部的顶表面和底表面中的至少一个表面中的至少一个凹槽。

2. 发明授权

US07971633B2 Loop type micro heat transport device 有权
标题翻译：环型微型热输送装置
公开(公告)号：US07971633B2
公开(公告)日：2011-07-05
申请号：US11577233
申请日：2005-12-09
申请人： Seok Hwan Moon , Gunn Hwang , Sung Weon Kang , Chang Auck Choi
发明人： Seok Hwan Moon , Gunn Hwang , Sung Weon Kang , Chang Auck Choi
IPC分类号： H05K7/20
CPC分类号： H05K7/20336 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.
摘要翻译：本发明提供一种环型微热输送装置，其特征在于，具有：下板，其具有用于在其上表面存储工作流体的储存器，与所述储存器间隔开的蒸发部，蒸发所述工作流体;以及冷凝部，蒸发部分以及与所述下板的上表面接合并形成在与所述蒸发部和所述冷凝部对应的位置的上板，并且包括具有蒸气管的蒸气空间，蒸发部蒸发的蒸汽通过所述蒸气管路被输送到所述蒸发部冷凝部件，其中工作流体循环通过储存器，蒸发部件和冷凝部件。因此，由于其简单的结构有助于使制造简单，并且提高冷却性能并且能够进行长距离的热输送，因此可以显着提高生产率。

3. 发明申请

US20100251826A1 MICRO PIEZORESISTIVE PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF 有权
标题翻译：微型PIEZORESISTIVE压力传感器及其制造方法
公开(公告)号：US20100251826A1
公开(公告)日：2010-10-07
申请号：US12745745
申请日：2008-04-21
申请人： Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
发明人： Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
IPC分类号： G01L9/06 , H01L41/22
CPC分类号： G01L9/0042 , Y10T29/42 , Y10T29/49
摘要： A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.
摘要翻译：提供一种微型半导体型压力传感器及其制造方法。微型半导体型压力传感器通过蚀刻衬底的空腔形成区域以形成多个沟槽来实现，通过热氧化工艺氧化多个沟槽以形成空腔形成氧化物层，形成膜在形成空腔的氧化物层和衬底的上部上形成一层形成材料层，在膜形成材料层中形成多个蚀刻孔，通过多个蚀刻孔去除腔形成氧化物层，以形成埋入腔在所述基板中，在所述膜形成材料层的上部形成膜增强层，以形成用于封闭所述空腔的膜，并且在所述膜的上部形成由压阻材料制成的敏感膜。

4. 发明授权

US08584743B2 Solid type heat dissipation device 有权
标题翻译：固体散热装置
公开(公告)号：US08584743B2
公开(公告)日：2013-11-19
申请号：US12765120
申请日：2010-04-22
申请人： Seok-Hwan Moon , Seung Youl Kang , Kyoung Ik Cho , Moo Jung Chu
发明人： Seok-Hwan Moon , Seung Youl Kang , Kyoung Ik Cho , Moo Jung Chu
IPC分类号： F28F7/00
CPC分类号： F28D15/00 , H01L23/36 , H01L23/373 , H01L2924/0002 , H01L2924/00
摘要： Provided is a solid type heat dissipation device for electronic communication appliances. The solid type heat dissipation device includes a graphite thin plate horizontally transferring heat, a plurality of metal fillers passing through the graphite thin plate to vertically transfer heat, and a plurality of metal thin plates attached to upper and lower surfaces of the graphite thin plate and connected to the metal fillers.
摘要翻译：提供一种用于电子通信设备的固体型散热装置。固体式散热装置包括水平传递热量的石墨薄板，通过石墨薄板的多个金属填料垂直传递热量，以及附着在石墨薄板的上表面和下表面上的多个金属薄板，连接到金属填料。

5. 发明申请

US20130112372A1 FLAT HEAT PIPE AND FABRICATION METHOD THEREOF 有权
标题翻译：平热管及其制造方法
公开(公告)号：US20130112372A1
公开(公告)日：2013-05-09
申请号：US13572176
申请日：2012-08-10
申请人： Seok Hwan MOON
发明人： Seok Hwan MOON
IPC分类号： F28D15/02 , B23P15/26
CPC分类号： H05K7/20336 , F28D15/0233 , F28D15/046 , F28F1/20 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： Disclosed are a flat heat pipe which has a structure integrated with a heat sink, and a facilitated fabrication method thereof. The flat heat pipe includes: a flat body portion including a plurality of heat sink fins formed on an outer surface thereof, and a plurality of through-holes formed therein and being separated by at least one separation film; and at least one groove formed in at least one surface from among a top surface and a bottom surface of one side portion of each of the plurality of through-holes.
摘要翻译：公开了具有与散热器一体化的结构的扁平热管及其制造方法。扁平热管包括：平坦体部分，其包括形成在其外表面上的多个散热鳍片，以及形成在其中并被至少一个分离膜隔开的多个通孔; 以及形成在所述多个通孔中的每一个的一个侧部的顶表面和底表面中的至少一个表面中的至少一个凹槽。

6. 发明申请

US20130098428A1 SUNLIGHT COMPLEX MODULES AND APPARATUSES FOR USING SOLAR ENERGY 审中-公开
标题翻译：使用太阳能的太阳能复合模块和装置
公开(公告)号：US20130098428A1
公开(公告)日：2013-04-25
申请号：US13569507
申请日：2012-08-08
申请人： Ho-Gyeong YUN , Seok-Hwan Moon , Yong-Duck Chung
发明人： Ho-Gyeong YUN , Seok-Hwan Moon , Yong-Duck Chung
IPC分类号： H01L31/058
CPC分类号： H02S40/44 , F24S10/45 , F24S10/75 , F24S10/90 , Y02E10/44 , Y02E10/60
摘要： Provided is a sunlight complex module, which includes a photovoltaic conversion part that generates electrical energy from sunlight,a heat collector board attached to a bottom of the photovoltaic conversion part to collect heat from a portion of the sunlight, which has a wavelength to pass through the photovoltaic conversion part, a heat pipe attached to the heat collector board, and transferring thermal energy collected in the heat collector board, to an outside thereof,and a mold sealed to maintain a vacuum therein. The photovoltaic conversion part, the heat collector board, and the heat pipe are accommodated in the mold.
摘要翻译：提供了一种太阳光复合模块，其包括从太阳光产生电能的光伏转换部分，附接到光伏转换部分的底部的集热板，用于从具有波长通过的一部分太阳光收集热量光电转换部，附着于集热板的热管，将收集在集热板上的热能传递到其外部，密封的模具，以保持真空。光电转换部分，集热板和热管容纳在模具中。

7. 发明授权

US08261617B2 Micro piezoresistive pressure sensor and manufacturing method thereof 有权
标题翻译：微压阻式压力传感器及其制造方法
公开(公告)号：US08261617B2
公开(公告)日：2012-09-11
申请号：US12745745
申请日：2008-04-21
申请人： Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
发明人： Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
IPC分类号： G01L9/06 , B23P17/04
CPC分类号： G01L9/0042 , Y10T29/42 , Y10T29/49
摘要： A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.
摘要翻译：提供一种微型半导体型压力传感器及其制造方法。微型半导体型压力传感器通过蚀刻衬底的空腔形成区域以形成多个沟槽来实现，通过热氧化工艺氧化多个沟槽以形成空腔形成氧化物层，形成膜在形成空腔的氧化物层和衬底的上部上形成一层形成材料层，在膜形成材料层中形成多个蚀刻孔，通过多个蚀刻孔去除腔形成氧化物层，以形成埋入腔在所述基板中，在所述膜形成材料层的上部形成膜增强层，以形成用于封闭所述空腔的膜，并且在所述膜的上部形成由压阻材料制成的敏感膜。

8. 发明申请

US20100258278A1 FLAT PLATE TYPE MICRO HEAT SPREADING DEVICE 审中-公开
标题翻译：平板式微热加热装置
公开(公告)号：US20100258278A1
公开(公告)日：2010-10-14
申请号：US12744673
申请日：2008-04-01
申请人： Seok Hwan Moon , Gunn Hwang
发明人： Seok Hwan Moon , Gunn Hwang
IPC分类号： F28D15/04 , F28D15/00
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A flat plate type heat spreading device is provided. The flat plat type heat spreading device can reduce heat by generating phase transition of liquid by using heat of a heat source so as to solve various problems caused by heat generated in components of electronic devices such as personal computers or mobile phones. Specifically, the flat plate type heat spreading device includes a lower plate for evaporating liquid, a middle plate combined with an upper surface of the lower plate, which separately includes a path through which evaporated vapor passes and a path through which condensed fluid flows into the lower plate, and an upper plate combined with an upper surface of the middle plate, which condenses the evaporated vapor.
摘要翻译：提供了平板式散热装置。平板式散热装置可以通过利用热源的热量产生液体的相变来减少热量，从而解决由诸如个人计算机或移动电话的电子设备的部件中产生的热量所引起的各种问题。具体地说，平板式散热装置包括用于蒸发液体的下板，与下板的上表面组合的中间板，其分别包括蒸发的蒸汽通过的路径和冷凝流体流入的路径下板和与中间板的上表面组合的上板，其冷凝蒸发的蒸气。

9. 发明申请

US20100059212A1 HEAT CONTROL DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：热控制装置及其制造方法
公开(公告)号：US20100059212A1
公开(公告)日：2010-03-11
申请号：US12517344
申请日：2007-10-31
申请人： Seok-Hwan Moon , Gunn Hwang
发明人： Seok-Hwan Moon , Gunn Hwang
IPC分类号： F28F13/00 , B21D53/02
CPC分类号： F28D15/0233 , B23P2700/09 , F28D15/046 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： Provided are a heat control device and a method of manufacturing a heat control device. The method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates.
摘要翻译：提供了一种热控制装置和制造热控装置的方法。制造热封装置的方法，所述热控制装置具有用作通过潜热传递吸收/消散热量的工作流体的路径的外壳和形成在外壳的内壁中的槽，并产生移动工作流体的毛细管力，其中所述方法包括：提供第一和第二模板，每个模板包括具有与所述凹槽相对应的形状的突出部分; 通过在第一和第二模板上沉积金属来形成第一和第二沉积膜; 分别在第一和第二沉积膜上堆叠第一和第二金属板; 从第一和第二金属板烧掉第一和第二模板; 以及通过组合所述第一和第二金属板来形成所述封套。

10. 发明申请

US20090188110A1 MICRO HEAT PIPE WITH POLIGONAL CROSS-SECTION MANUFACTURED VIA EXTRUSION OR DRAWING 审中-公开
标题翻译：微型热管，通过挤压或拉拔制造出具有极性交叉部分
公开(公告)号：US20090188110A1
公开(公告)日：2009-07-30
申请号：US12414595
申请日：2009-03-30
申请人： Seok Hwan Moon , Ho Gyeong Yun , Sang Choon Ko , Gunn Hwang , Tae Goo Choy , Chi Hoon Jun , Youn Tae Kim
发明人： Seok Hwan Moon , Ho Gyeong Yun , Sang Choon Ko , Gunn Hwang , Tae Goo Choy , Chi Hoon Jun , Youn Tae Kim
IPC分类号： B21D53/02
CPC分类号： B23P15/26 , B21C23/085 , B21C37/151 , B21C37/155 , B23P2700/09 , F28D15/0233 , F28D2015/0225 , F28F1/022 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A method for fabricating a metal micro heat pipe with a polygonal cross-section to allow working fluid to flow by capillary force generated at edges of the polygonal of the micro heat pipe. The polygonal cross-section is formed of a single metal layer via a single drawing process. The micro heat pipe is formed of a single metal plate.
摘要翻译：一种用于制造具有多边形横截面的金属微热管的方法，以允许工作流体通过在微热管的多边形的边缘处产生的毛细管力流动。多边形横截面通过单个拉丝工艺由单个金属层形成。微热管由单个金属板形成。

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