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1. 发明授权

US5539064A Resist ink composition, printed circuit board produced by using the composition and process for producing the printed circuit board 失效
标题翻译：抗墨油组合物，通过使用印刷电路板的组合物和制造方法制造的印刷电路板
公开(公告)号：US5539064A
公开(公告)日：1996-07-23
申请号：US526983
申请日：1995-09-12
申请人： Soichi Hashimoto , Satoshi Miyayama , Toshiaki Nishimura , Toshikazu Oda
发明人： Soichi Hashimoto , Satoshi Miyayama , Toshiaki Nishimura , Toshikazu Oda
IPC分类号： C08F2/50 , C08F290/00 , C08F290/12 , C08F299/00 , C08F299/02 , C09D11/00 , C09D11/033 , C09D11/10 , C09D11/101 , C09D11/106 , G03F7/004 , G03F7/027 , G03F7/028 , G03F7/032 , G03F7/033 , G03F7/038 , G03F7/20 , H01L21/027 , H05K3/00 , H05K3/28 , C08F283/00 , C08J3/28 , G03C1/725
CPC分类号： G03F7/033 , C08F290/126 , G03F7/0388 , H05K3/287 , Y10S428/901 , Y10T428/31511 , Y10T428/31855
摘要： A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance printed circuits and which comprises an ultraviolet-curable resin obtained by copolymerizing (a) from 5 to 50% by weight of an ethylenically unsaturated monomer of a general formula: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents a hydrogen atom or an alkyl group; n represent an integer of from 1 to 4, and/or glycerol mono(meth)acrylate, (b) from 10 to 90% by weight or glycidyl (meth)acrylate and (c) from 0 to 80% by weight of other ethylenically unsaturated monomers capable of copolymerizing with these (a) and (b), followed by reacting the resulting copolymer with from 0.7 to 1.2 equivalents, relative to one epoxy equivalent of said copolymer, of (meth)acrylic acid and a saturated or unsaturated polybasic acid anhydride; a photopolymerization initiator; a diluent; and a thermosetting epoxy compound.
摘要翻译：即使在低曝光量的情况下，也可以用本发明具有高分散稳定性的稀释碱溶液显影的抗蚀剂油墨组合物可以形成具有优异分辨率的图案，并且可以生产出耐溶剂性优异的固化抗蚀剂膜其特征在于，包括通过使（a）5-50重量％的下列通式的烯键式不饱和单体共聚得到的紫外线固化树脂：其中R 1表示氢原子或甲基; R2表示氢原子或烷基; n表示1至4的整数，和/或甘油单（甲基）丙烯酸酯，（b）10至90重量％或（甲基）丙烯酸缩水甘油酯和（c）0至80重量％的其它烯属能够与这些（a）和（b）共聚的不饱和单体，然后使得到的共聚物相对于所述共聚物的一个环氧当量，0.7-2.2当量的（甲基）丙烯酸和饱和或不饱和多元酸酐; 光聚合引发剂; 稀释剂和热固性环氧化合物。

2. 发明授权

US08694677B2 Retry communication control method and system 失效
标题翻译：重试通信控制方法和系统
公开(公告)号：US08694677B2
公开(公告)日：2014-04-08
申请号：US10523348
申请日：2003-07-30
申请人： Etsuko Koyanagi , Satoshi Miyayama , Naotaka Morita , Shunsuke Mori
发明人： Etsuko Koyanagi , Satoshi Miyayama , Naotaka Morita , Shunsuke Mori
IPC分类号： G06F15/173
CPC分类号： H04L47/32 , H04L47/10 , H04L47/11 , H04L47/20 , H04L47/215 , H04L47/2408 , H04L47/2441 , H04L47/28
摘要： A terminal apparatus firstly transfers packets of a trial class. When the communication quality is insufficient, the terminal apparatus determines after a predetermined period of time whether or not to transfer the trail-class packets again according to a traffic rate of priority-class packets. There are provided a trial-class band capacity not to discard packets of the trial class and a priority-class band capacity not to discard packets of the priority class. Trial-class packets exceeding the former are discarded but the packets that has once become a priority class will not be discarded unless the latter is exceeded.
摘要翻译：终端设备首先传送试用类的分组。当通信质量不足时，终端装置在预定时间段之后确定是否根据优先级分组的业务速率再次传送跟踪级分组。提供了试用级带宽，不丢弃试用类的报文，优先级级别的能力不丢弃优先级的报文。超过前者的试用级数据包将被丢弃，但是一旦成为优先级的数据包将不会被丢弃，除非超过该数据包。

3. 发明申请

US20060168336A1 Re-challenge communication control method and system thereof, packet transfer enabled/disabled decision method, packet transfer device, packer transfer system, packet monitoring method, call control device, monitor device, and program 失效
标题翻译：重新挑战通信控制方法及其系统，分组转移使能/禁止判定方法，分组传送装置，封隔器传送系统，分组监视方法，呼叫控制装置，监视装置和程序
公开(公告)号：US20060168336A1
公开(公告)日：2006-07-27
申请号：US10523348
申请日：2003-07-30
申请人： Etsuko Koyanagi , Satoshi Miyayama , Naotaka Morita , Shunsuke Mori
发明人： Etsuko Koyanagi , Satoshi Miyayama , Naotaka Morita , Shunsuke Mori
IPC分类号： G06F15/173
CPC分类号： H04L47/32 , H04L47/10 , H04L47/11 , H04L47/20 , H04L47/215 , H04L47/2408 , H04L47/2441 , H04L47/28
摘要： A terminal apparatus firstly transfers packets of a trial class. When the communication quality is insufficient, the terminal apparatus determines after a predetermined period of time whether or not to transfer the trail-class packets again according to a traffic rate of priority-class packets. There are provided a trial-class band capacity not to discard packets of the trial class and a priority-class band capacity not to discard packets of the priority class. Trial-class packets exceeding the former are discarded but the packets that has once become a priority class will not be discarded unless the latter is exceeded.
摘要翻译：终端设备首先传送试用类的分组。当通信质量不足时，终端装置在预定时间段之后确定是否根据优先级分组的业务速率再次传送跟踪级分组。提供了试用级带宽，不丢弃试用类的报文，优先级级别的能力不丢弃优先级的报文。超过前者的试用级数据包将被丢弃，但是一旦成为优先级的数据包将不会被丢弃，除非超过该数据包。

4. 发明授权

US5916736A Process of manufacturing a printed circuit board with plated landless through-holes by the use of a filling material 失效
标题翻译：通过使用填充材料制造具有镀覆无通孔的印刷电路板的工艺
公开(公告)号：US5916736A
公开(公告)日：1999-06-29
申请号：US637888
申请日：1996-04-25
申请人： Katsuo Doi , Satoshi Miyayama , Toshikazu Oda
发明人： Katsuo Doi , Satoshi Miyayama , Toshikazu Oda
IPC分类号： C08F2/50 , C08K5/12 , G03F7/027 , G03F7/032 , G03F7/095 , H05K3/00 , H05K3/06 , H05K3/42 , G03C5/00
CPC分类号： H05K3/0094 , C08K5/12 , G03F7/027 , G03F7/032 , G03F7/0955 , H05K2201/0209 , H05K2201/0959 , H05K2203/0759 , H05K3/0076 , H05K3/064 , H05K3/427 , Y10T428/24917
摘要： A process of manufacturing a printed circuit board having plated landless through-holes involves filling a radiation curable putty material in through-holes plated with copper in a substrate, exposing the material under radiation of light in order to cure the material, placing a liquid resist on the substrate surface, covering a mask over the resist, exposing the resist layer by using a mask having a circuit pattern, developing the resist, etching the substrate surface, and removing the cured putty material in the through-holes and the remaining portion of the resist. The filling material composition used in the process comprises hydrophthalic mono ester compound as a component (A), a catalyst for promoting photo polymerization of a vinyl group in the mono ester as a component (B), a highly transparent rosin having a Hazen color tone of 300 or less for the improvement of cure depth of the material after exposure of light as a component (C), and a powder of at least one extender selected from polyethelene, nylon, polyester, talc, silica, aluminum hydroxide, titanium oxide, barium sulfate, kaolinite, calcium carbonate, and phthalocyanine as a component (D).
摘要翻译：一种制造具有电镀无置入通孔的印刷电路板的方法包括在基板上镀铜的通孔中填充可辐射固化油灰材料，在光照射下曝光该材料以固化该材料，在基板表面上，在抗蚀剂上覆盖掩模，通过使用具有电路图案的掩模曝光抗蚀剂层，显影抗蚀剂，蚀刻基板表面，以及去除通孔中的固化的腻子材料，以及其余部分抗拒。该方法中使用的填充材料组合物包含作为组分（A）的亲水性单酯化合物，用于促进作为组分（B）的单酯中的乙烯基的光聚合的催化剂，具有Hazen色调的高透明松香为了提高作为（C）成分的光的曝光后的材料的固化深度，为300以下的粉末，以及选自聚乙烯，尼龙，聚酯，滑石，二氧化硅，氢氧化铝，氧化钛，硫酸钡，高岭石，碳酸钙和酞菁作为组分（D）。

5. 发明授权

US06315927B1 Photosensitive conductive paste 有权
标题翻译：感光导电膏
公开(公告)号：US06315927B1
公开(公告)日：2001-11-13
申请号：US09535644
申请日：2000-03-24
申请人： Masahiro Kubota , Michiaki Iha , Shizuharu Watanbe , Satoshi Miyayama , Toshikazu Oda
发明人： Masahiro Kubota , Michiaki Iha , Shizuharu Watanbe , Satoshi Miyayama , Toshikazu Oda
IPC分类号： H01B122
CPC分类号： G03F7/0047 , G03F7/0048 , G03F7/027 , H05K1/092
摘要： There is disclosed a photosensitive conductive paste comprising a water- or alkali-soluble acidic-functional-group-containing organic binder, a photosensitive organic component, an organic solvent, a conductive powder such as iron or copper, and a mono-ol compound having a boiling point of about 178° C. or higher such as dipropylene glycol monoethyl ether and/or a diol compound such as pentamethylene glycol. The photosensitive conductive paste has excellent storage stability and can be developed consistently.
摘要翻译：公开了一种含有水溶性或碱溶性的含酸性官能团的有机粘合剂，感光性有机成分，有机溶剂，导电粉末如铁或铜的感光性导电糊，以及具有约178℃以上的沸点，例如二丙二醇单乙醚和/或二醇化合物如五亚甲基二醇。感光性导电糊具有优异的保存稳定性，可以一致地开发。

6. 发明授权

US5821279A Filling material composition used for a process of manufacturing a printed circuit board with plated through-holes 失效
标题翻译：用于制造具有电镀通孔的印刷电路板的方法的填充材料组合物
公开(公告)号：US5821279A
公开(公告)日：1998-10-13
申请号：US638896
申请日：1996-04-25
申请人： Katsuo Doi , Satoshi Miyayama , Toshikazu Oda
发明人： Katsuo Doi , Satoshi Miyayama , Toshikazu Oda
IPC分类号： C08F2/50 , C08K5/12 , G03F7/027 , G03F7/032 , G03F7/095 , H05K3/00 , H05K3/06 , H05K3/42 , C08K3/18 , C08K3/36
CPC分类号： H05K3/0094 , C08K5/12 , G03F7/027 , G03F7/032 , G03F7/0955 , H05K2201/0209 , H05K2201/0959 , H05K2203/0759 , H05K3/0076 , H05K3/064 , H05K3/427 , Y10T428/24917
摘要： A radiation curable filling material is used for a process of manufacturing a printed circuit board having plated landless through-holes. The material is filled in the through-holes and solidified in the through-holes via a photo polymerization to protect plated through-hole interior from an etching solution. The composition comprises a hydrophthalic acid monoester compound as a component (A); a catalyst for promoting photo polymerization of a vinyl group in the mono ester as a component (B); a highly transparent rosin having a Hazen color tone of 300 or less for the improvement of filling material transmission by radiation as a component (C), a powder of extender as a competent (D). The photo polymerization reaction occurs at the vinyl group of the hydrophthalic mono ester with the presence of the catalyst for promoting the photo polymerization. The rate of the reaction is enhanced by adding a vinyl compound such as an acrylate. The superior transmission of the highly transparent rosin enables to increase cure depth of the filling material.
摘要翻译：可辐射固化的填充材料用于制造具有电镀无地通孔的印刷电路板的工艺。将该材料填充在通孔中，并通过光聚合固化在通孔中，以保护电镀通孔内部免受蚀刻溶液的影响。该组合物包含作为组分（A）的邻苯二甲酸单酯化合物; 用于促进单酯中乙烯基作为组分（B）的光聚合的催化剂; 具有300或更小的Hazen色调的高透明松香用于通过作为组分（C）的辐射改善填充材料透射，作为能力（D）的增量剂的粉末。光聚合反应发生在邻苯二甲酸单酯的乙烯基上，存在促进光聚合的催化剂。通过加入乙烯基化合物如丙烯酸酯来提高反应速率。高透明松香的优越透过能够增加填充材料的固化深度。

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