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    • 1. 发明授权
    • HEMT with epitaxial narrow bandgap source/drain contacts isolated from
wide bandgap layer
    • 具有从宽带隙层隔离的外延窄带隙源极/漏极触点的HEMT
    • US4714948A
    • 1987-12-22
    • US839826
    • 1986-03-13
    • Takashi MimuraSatoshi Hiyamizu
    • Takashi MimuraSatoshi Hiyamizu
    • H01L21/331H01L21/338H01L29/06H01L29/73H01L29/778H01L29/80H01L29/812H01L29/205
    • H01L29/0653H01L29/7781H01L29/7787H01L29/80
    • The present invention is related to an improvement of a high-electron mobility transistor (HEMT) which has an undoped GaAs layer and an N-doped AlGaAs layer a heterojunction formed between the undoped GaAs layer and the N-doped AlGaAs layer, respectively a gate electrode on the N-doped AlGaAs layer, and an electron-storing layer formed in proximity to the heterojunction due to the difference in electron affinity between the undoped GaAs layer and the N-doped AlGaAs layer. The known HEMT has a disadvantage in that during the formation of the source and drain regions by means of, for example, thermal diffusion, the impurities of the N-doped AlGaAs layer may diffuse into the undoped GaAs layer through the heterojunction so that the mobility of the electrons in the electron-storing layer is lessened. This disadvantage is removed in the present invention by the provision of a conduction layer formed by the epitaxial growth of highly-doped GaAs. The known HEMT also has a disadvantage in that the source electrode or the drain electrode is electrically connected to the N-doped AlGaAs layer so that the electrons in this layer may lessen the mobility. This disadvantage is also eliminated in the present invention by the provision of an insulating layer. The heterojunction may be formed between Gallium Aluminum Arsenide and Gallium Arsenide, Gallium Aluminum Arsenide and Germanium, Gallium Arsenide and Germanium, Cadmium Telluride and Indium Antimonide, or Gallium Antimonide and Indium Arsenide.
    • 本发明涉及高电子迁移率晶体管(HEMT)的改进,该高电子迁移率晶体管(HEMT)具有未掺杂的GaAs层和N掺杂的AlGaAs层,在未掺杂的GaAs层和N掺杂的AlGaAs层之间形成异质结,分别为栅极 由于未掺杂的GaAs层和N掺杂的AlGaAs层之间的电子亲和力的差异,在N掺杂的AlGaAs层上的电极以及形成在异质结附近的电子存储层。 已知的HEMT的缺点在于,在通过例如热扩散形成源极和漏极区域期间,N掺杂的AlGaAs层的杂质可以通过异质结扩散到未掺杂的GaAs层中,使得迁移率 的电子存储层中的电子减少。 通过提供通过高掺杂GaAs的外延生长形成的导电层,在本发明中消除了这个缺点。 已知的HEMT还具有以下缺点:源电极或漏电极与N掺杂的AlGaAs层电连接,使得该层中的电子可以降低迁移率。 通过设置绝缘层,本发明也消除了这个缺陷。 异质结可以在砷化镓铝和砷化镓,砷化镓铝和锗,砷化镓和锗,碲化镉和铟锑酸盐,或镓锑酸盐和砷化铟之间形成。
    • 5. 发明授权
    • High electron mobility single heterojunction semiconductor devices and
methods for production thereof
    • 高电子迁移率单异质结半导体器件及其制造方法
    • US4799088A
    • 1989-01-17
    • US286863
    • 1981-07-27
    • Satoshi HiyamizuToshio Fujii
    • Satoshi HiyamizuToshio Fujii
    • H01L21/203H01L29/778
    • H01L21/02395H01L21/02463H01L21/02546H01L21/02631H01L29/7783
    • A high electron mobility single heterojunction semiconductor devices having a layer configuration comprising a N-type AlGaAs layer grown on an undoped GaAs layer grown on an undoped AlGaAs layer grown on a semiconductor substrate containing an impurity producing a deep level. The undoped AlGaAs layer has at least three functions including (a) a getter for the deep level impurity which may be diffused from the substrate during an annealing process, (b) a buffer improving the crystal condition of the undoped GaAs layer, and (c) a test layer grown for the purpose of predetermining the intensity of molecular or ion beams for each of Al, Ga, As and dopants e.g. Si. This allows annealing processes and ion implantation processes to be introduced to the method for production of this type of semiconductor devices without reducing the electron mobility thereof.
    • 一种高电子迁移率单异质结半导体器件,其具有包括生长在含有产生深度杂质的杂质的半导体衬底上生长的未掺杂的AlGaAs层上的未掺杂的GaAs层上生长的N型AlGaAs层的层状结构。 未掺杂的AlGaAs层具有至少三种功能,包括(a)在退火过程中可能从衬底扩散的深层杂质的吸气剂,(b)改善未掺杂的GaAs层的晶体状态的缓冲液,和(c )生长的测试层,用于预先确定Al,Ga,As和掺杂剂中的每一个的分子或离子束的强度,例如 Si。 这允许将退火工艺和离子注入工艺引入到生产这种类型的半导体器件的方法中,而不降低其电子迁移率。