会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明申请
    • MOUNTING STRUCTURE OF ELECTRONIC CIRCUIT UNIT
    • 电子电路单元安装结构
    • US20100315183A1
    • 2010-12-16
    • US12813225
    • 2010-06-10
    • Satoru Matsuzaki
    • Satoru Matsuzaki
    • H03J1/00H05K5/00
    • H05K5/0247H01R12/77H01R24/52H04N5/655
    • A mounting structure of an electronic circuit unit includes a circuit board provided with a high frequency circuit, a metallic casing mounted on the circuit board to cover the high frequency circuit, an F type connector fixed to the casing and protruding approximately perpendicularly to the circuit board, and a flexible cable having one end portion connected to the circuit board. In a state in which the F type connector passes through a mounting hole formed through a set-side panel to protrude outward, at least one of the casing and the F type connector is fixed to the set-side panel by a fixing member, and the other end portion of the flexible cable is connected to a mother board.
    • 电子电路单元的安装结构包括设置有高频电路的电路板,安装在电路板上以覆盖高频电路的金属壳体,固定到壳体并大致垂直于电路板突出的F型连接器 以及具有连接到电路板的一个端部的柔性电缆。 在F型连接器通过设置侧面板形成的安装孔向外突出的状态下,壳体和F型连接器中的至少一个通过固定部件固定在固定侧面板上, 柔性电缆的另一端部连接到母板。
    • 8. 发明授权
    • Jumper chip component and mounting structure therefor
    • 跳线芯片组件及其安装结构
    • US06949819B2
    • 2005-09-27
    • US10322134
    • 2002-12-17
    • Shuji SaitoSatoru Matsuzaki
    • Shuji SaitoSatoru Matsuzaki
    • H01R12/57H01R31/08H05K3/22H01L23/48
    • H01R31/08H01R12/526H05K3/222
    • A jumper chip component of the present invention includes a connection conductor formed of a conductive layer over an upper face and opposite side faces of an insulating substrate, and a conductive material formed of a conductive layer between plates of the insulating substrate and on a side face at the corner of the insulating substrate so as not to be electrically connected to the connection conductor. Since the conductive material formed between the plates of the insulating substrate opposes the connection conductor formed on the upper face of the insulating substrate, the connection conductor formed on the upper face of the insulating substrate and a second conductive pattern disposed under the insulating substrate are shielded from each other by the conductive material, and good isolation is possible.
    • 本发明的跳片组件包括由绝缘基板的上表面和相对侧面上的导电层形成的连接导体,以及由绝缘基板的板之间的导电层形成的导电材料和侧面 在绝缘基板的角部处,以便不与连接导体电连接。 由于形成在绝缘衬底的板之间的导电材料与形成在绝缘衬底的上表面上的连接导体相对,所以形成在绝缘衬底的上表面上的连接导体和设置在绝缘衬底之下的第二导电图案被屏蔽 由导电材料彼此相互隔离,并且可以进行良好的隔离。