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    • 3. 发明授权
    • Protective film forming method
    • 保护膜成型方法
    • US08310788B2
    • 2012-11-13
    • US12232091
    • 2008-09-10
    • Kunihiro UedaHong Xin FangDong WangYoshiyuki KonishiSatoko UenoShigenobu Okada
    • Kunihiro UedaHong Xin FangDong WangYoshiyuki KonishiSatoko UenoShigenobu Okada
    • G11B5/39
    • G11B5/3106C23C16/0272C23C16/26G11B5/3173G11B5/40G11B5/6082
    • To provide a high-quality protection target by forming a protective film that is thin and excellent in corrosion resistance. Provided is a protective film forming method for forming a protective film at least on a surface of a protection target. The method comprises: a base film forming step for forming a base film on the surface of the protection target; and a DLC film forming step for forming a diamond-like carbon film on the base film. The base film forming step forms the base film on the surface of the protection target for a plurality of times by repeating a process of depositing the base film in a prescribed thickness and eliminating a part of or a whole part of the base film. Further, the method comprises, before the DLC film forming step, an insulating layer forming step for forming an insulating layer on the surface of the base film on which the diamond-like carbon film is to be formed.
    • 通过形成薄且耐腐蚀性优异的保护膜来提供高质量的保护目标。 提供了至少在保护对象的表面上形成保护膜的保护膜形成方法。 该方法包括:在保护目标表面上形成基膜的基膜形成步骤; 以及在基膜上形成类金刚石碳膜的DLC膜形成工序。 基底膜形成步骤通过重复以预定厚度沉积基膜的过程,并且去除基膜的一部分或全部而在保护对象的表面上形成基膜多次。 此外,该方法包括在DLC膜形成步骤之前,在要形成类金刚石碳膜的基膜的表面上形成绝缘层的绝缘层形成步骤。