专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070254408A1 Method of making wirebond electronic package with enhanced chip pad design 失效
标题翻译：制造具有增强的芯片焊盘设计的引线键合电子封装的方法
公开(公告)号：US20070254408A1
公开(公告)日：2007-11-01
申请号：US11822573
申请日：2007-07-09
申请人： David Caletka , Varaprasad Calmidi , Sanjeev Sathe
发明人： David Caletka , Varaprasad Calmidi , Sanjeev Sathe
IPC分类号： H01L21/50
CPC分类号： H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/73265 , H01L2224/83385 , H01L2224/8385 , H01L2224/85447 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/0203 , H05K3/3436 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A method of making a wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow.
摘要翻译：一种制造引线键合电子封装的方法，其包括结合到有机层叠基板的上表面的半导体芯片，该半导体芯片包括位于基板上并由多个导热同心线组成的热材料。这些线在其操作期间形成芯片的热逸出路径，并且可以与其它元件结合操作以延伸热路径。同心线还确保了衬底上足够的结合面积，以防止芯片与衬底分层，这可能与随后的处理（例如焊球重新流动）相关的高温期间可能发生。

2. 发明授权

US07510912B2 Method of making wirebond electronic package with enhanced chip pad design 失效
标题翻译：制造具有增强的芯片焊盘设计的引线键合电子封装的方法
公开(公告)号：US07510912B2
公开(公告)日：2009-03-31
申请号：US11822573
申请日：2007-07-09
申请人： David V. Caletka , Varaprasad V. Calmidi , Sanjeev Sathe
发明人： David V. Caletka , Varaprasad V. Calmidi , Sanjeev Sathe
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/73265 , H01L2224/83385 , H01L2224/8385 , H01L2224/85447 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/0203 , H05K3/3436 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A method of making a wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow.
摘要翻译：一种制造引线键合电子封装的方法，其包括结合到有机层叠基板的上表面的半导体芯片，该半导体芯片包括位于基板上并由多个导热同心线组成的热材料。这些线在其操作期间形成芯片的热逸出路径，并且可以与其它元件结合操作以延伸热路径。同心线还确保了衬底上足够的结合面积，以防止芯片与衬底分层，这可能与随后的处理（例如焊球重新流动）相关的高温期间可能发生。

3. 发明授权

US07510324B2 Method of inspecting articles using imaging inspection apparatus with directional cooling 有权
标题翻译：使用具有定向冷却的成像检查装置检查物品的方法
公开(公告)号：US07510324B2
公开(公告)日：2009-03-31
申请号：US11882473
申请日：2007-08-02
申请人： Ashwinkumar C. Bhatt , Varaprasad V. Calmidi , James J. McNamara, Jr. , Sanjeev Sathe
发明人： Ashwinkumar C. Bhatt , Varaprasad V. Calmidi , James J. McNamara, Jr. , Sanjeev Sathe
IPC分类号： H01J35/12
CPC分类号： G01N23/046 , G01N2223/419
摘要： A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.
摘要翻译：使用成像检查装置检查制品的方法，所述成像检查装置利用多个单独的成像装置将光束引导到其上具有物体的物品上，以根据建立的标准检测物体。该方法涉及对发热成像装置进行增强的冷却，其中风扇将冷却流体引导到多个偏转器上，反过来将导流体引导到所选择的成像装置上。

4. 发明授权

US07354197B2 Imaging inspection apparatus with improved cooling 失效
标题翻译：具有改善冷却效果的成像检测设备
公开(公告)号：US07354197B2
公开(公告)日：2008-04-08
申请号：US11141494
申请日：2005-06-01
申请人： Ashwinkumar C. Bhatt , Varaprasad V. Calmidi , James J. McNamara, Jr. , Sanjeev Sathe
发明人： Ashwinkumar C. Bhatt , Varaprasad V. Calmidi , James J. McNamara, Jr. , Sanjeev Sathe
IPC分类号： H01J35/10 , H01J35/12 , H05G1/02 , G01N23/083
CPC分类号： G01N23/046 , G01N2223/3103 , G01N2223/419 , G01N2223/643 , H01J2235/1262
摘要： An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.
摘要翻译：一种成像检查装置，其利用位于框架上的多个单独的成像装置（例如，X射线计算机断层摄影扫描装置），用于将光束引导到具有其中的物体的物品上，以根据建立的标准检测物体。该装置利用冷却结构为成像装置提供冷却。

5. 发明申请

US20070009084A1 Imaging inspection apparatus with directional cooling 有权
标题翻译：具有定向冷却的成像检测设备
公开(公告)号：US20070009084A1
公开(公告)日：2007-01-11
申请号：US11141349
申请日：2005-06-01
申请人： Ashwinkumar Bhatt , Varaprasad Calmidi , James McNamara , Sanjeev Sathe
发明人： Ashwinkumar Bhatt , Varaprasad Calmidi , James McNamara , Sanjeev Sathe
IPC分类号： G01N23/04
CPC分类号： G01N23/046 , G01N2223/419
摘要： An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure for directing cooling fluid (e.g., air) toward and over the devices, the structure including a fan for directing cooling fluid in a first direction and a plurality of fluid deflectors for deflecting at least part of the fluid toward respective ones of the devices.
摘要翻译：一种成像检查装置，其利用多个单独的成像装置（例如，X射线计算机断层摄影扫描装置），用于将光束引导到具有其中的物体的物品上，以根据建立的标准检测物体。该装置利用冷却结构来引导冷却流体（例如空气）朝向和穿过该装置，该结构包括用于沿第一方向引导冷却流体的风扇和多个流体偏转器，用于使至少部分流体朝向相应的一些设备。

6. 发明授权

US06788859B1 Laminate substrate containing fiber optic cables 失效
标题翻译：含有光纤电缆的层压基板
公开(公告)号：US06788859B1
公开(公告)日：2004-09-07
申请号：US10286732
申请日：2002-10-31
申请人： Voya R. Markovich , Sandeep B. Sane , Sanjeev Sathe
发明人： Voya R. Markovich , Sandeep B. Sane , Sanjeev Sathe
IPC分类号： G02B644
CPC分类号： G02B6/43 , G02B6/3608 , G02B6/4471 , H05K1/0274 , H05K3/4602
摘要： A method and an article made by a method for embedding optical fibers into an organic laminate structure. The optical fiber cabling, along with its cladding, is placed upon a first laminate layer that includes a composite made of silica fillers and a frictionless material such as polytetrafluoroethylene (PTFE). Then a second layer of PTFE material with silica fillers and copper sheeting is placed on top of the PTFE with silica fillers composite. The PTFE material with silica fillers flows about the optical fibers at a temperature approximately fifty degrees above the PTFE with silica fillers material's melting point. This procedure completely encases the optical fibers within an opaque sheath.
摘要翻译：一种通过将光纤嵌入到有机层压结构中的方法制造的方法和制品。光纤布线及其包层放置在第一层压层上，第一层压层包括由二氧化硅填料制成的复合材料和诸如聚四氟乙烯（PTFE）的无摩擦材料。然后将具有二氧化硅填料和铜片的第二层PTFE材料放置在具有二氧化硅填料复合材料的PTFE的顶部上。具有二氧化硅填料的PTFE材料在具有二氧化硅填料材料的熔点的PTFE上方约五十度的温度下围绕光纤流动。该过程完全将光纤包裹在不透明的护套内。

7. 发明申请

US20080144768A1 Method of making an imaging inspection apparatus with improved cooling 有权
标题翻译：制造具有改善的冷却的成像检查装置的方法
公开(公告)号：US20080144768A1
公开(公告)日：2008-06-19
申请号：US12071537
申请日：2008-02-22
申请人： Ashwinkumar C. Bhatt , Varaprasad V. Calmidi , James J. McNamara, , Sanjeev Sathe
发明人： Ashwinkumar C. Bhatt , Varaprasad V. Calmidi , James J. McNamara, , Sanjeev Sathe
IPC分类号： G01N23/04
CPC分类号： G01N23/046 , G01N2223/3103 , G01N2223/419 , G01N2223/643 , H01J2235/1262
摘要： A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.
摘要翻译：一种制造成像检查装置的方法，其包括将多个单独的成像装置（例如，X射线计算机断层摄影扫描装置）定位在框架上，用于将束指向具有其中的物体的物品，以基于建立的标准检测物体。该方法还包括以这样的方式提供冷却结构，以便在设备操作期间将冷却流体引导到成像装置上以冷却它们。

8. 发明申请

US20080029888A1 Solder Interconnect Joints For A Semiconductor Package 审中-公开
标题翻译： A半导体封装的焊接互连接头
公开(公告)号：US20080029888A1
公开(公告)日：2008-02-07
申请号：US11610793
申请日：2006-12-14
申请人： Seungbae Park , Sanjeev Sathe , Aleksander Zubelewicz
发明人： Seungbae Park , Sanjeev Sathe , Aleksander Zubelewicz
IPC分类号： H01L23/488
CPC分类号： B23K3/06 , B23K35/0222 , B23K35/0233 , H01L21/4853 , H01L23/49816 , H01L24/02 , H01L24/11 , H01L24/12 , H01L2224/0401 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H05K1/111 , H05K3/3436 , H05K2201/0373 , H05K2203/0405 , Y02P70/611 , Y02P70/613
摘要： A method and article of fabrication is described featuring a solder layer having a serpentine, interrupted, or interdigitated boundary. The non-planar design of the boundary layer increases the fatigue life of the solder joint by limiting the damage caused by micro-cracking. This irregularity of the solder boundary constrains the propagation of cracks by creating obstacles along the crack path, redirecting the crack away from the intermetallic layer, or by increasing the path along which the crack propagates.
摘要翻译：描述了一种制造方法和制品，其特征在于具有蛇形，中断或交叉的边界的焊料层。边界层的非平面设计通过限制由微裂纹引起的损伤来增加焊点的疲劳寿命。焊料界面的这种不规则性通过在裂纹路径上产生障碍物，将裂纹从金属间层重新导向，或通过增加裂纹传播的路径来限制裂纹的传播。

9. 发明授权

US07253518B2 Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same 失效
标题翻译：具有增强的芯片焊盘设计的Wirebond电子封装，其制造方法以及利用它的信息处理系统
公开(公告)号：US07253518B2
公开(公告)日：2007-08-07
申请号：US11152048
申请日：2005-06-15
申请人： David V. Caletka , Varaprasad V. Calmidi , Sanjeev Sathe
发明人： David V. Caletka , Varaprasad V. Calmidi , Sanjeev Sathe
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/73265 , H01L2224/83385 , H01L2224/8385 , H01L2224/85447 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/0203 , H05K3/3436 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow. A method of making the package is also provided, as is an information handling system (e.g., computer) adapted for utilizing such packages.
摘要翻译：一种引线键合电子封装，其包括结合到有机层叠基板的上表面的半导体芯片，该半导体芯片包括位于基板上并由多个导热同心线组成的热材料。这些线在其操作期间形成芯片的热逸出路径，并且可以与其它元件结合操作以延伸热路径。同心线还确保了衬底上足够的结合面积，以防止芯片与衬底分层，这可能与随后的处理（例如焊球重新流动）相关的高温期间可能发生。还提供了制造包装的方法，以及适于利用这种包装的信息处理系统（例如，计算机）。

10. 发明申请

US20060274891A1 Imaging inspection apparatus with improved cooling 失效
标题翻译：具有改善冷却效果的成像检测设备
公开(公告)号：US20060274891A1
公开(公告)日：2006-12-07
申请号：US11141494
申请日：2005-06-01
申请人： Ashwinkumar Bhatt , Varaprasad Calmidi , James McNamara , Sanjeev Sathe
发明人： Ashwinkumar Bhatt , Varaprasad Calmidi , James McNamara , Sanjeev Sathe
IPC分类号： H01J35/10 , H01J35/12
CPC分类号： G01N23/046 , G01N2223/3103 , G01N2223/419 , G01N2223/643 , H01J2235/1262
摘要： An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.
摘要翻译：一种成像检查装置，其利用位于框架上的多个单独的成像装置（例如，X射线计算机断层摄影扫描装置），用于将光束引导到具有其中的物体的物品上，以根据建立的标准检测物体。该装置利用冷却结构为成像装置提供冷却。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式