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1. 发明申请

US20140057531A1 Method for grinding wafers by shaping resilient chuck covering 审中-公开
标题翻译：通过成形弹性卡盘覆盖来研磨晶片的方法
公开(公告)号：US20140057531A1
公开(公告)日：2014-02-27
申请号：US13573148
申请日：2012-08-27
申请人： Salman M. Kassir
发明人： Salman M. Kassir
IPC分类号： B24B7/22
CPC分类号： B24B7/228 , B24B53/017
摘要： This method facilitates and improves the production of quality thin wafers by adhering traditional resilient back-grind tape that has been perforated over the area that will contact the wafer on the ceramic porous grind chuck, so as to allow vacuum to be applied to the wafer back surface to hold the wafer for processing. The tape adhering to the chuck is ground with a abrasive grind wheel, bringing the surface of the tape parallel to the chuck surface which was previously ground by the same grinding device. Grinding the tape while it is mounted on the chuck establishes the plane perpendicular to the grind wheel spindle, removes the bumpiness from the perforation holes and evens out the non-uniformity of the tape, resulting in improved wafer back side grinding and thus good site flatness.
摘要翻译：该方法通过粘附在陶瓷多孔研磨卡盘上将接触晶片的区域上穿孔的传统弹性后磨带来促进和改进优质薄晶片的生产，以允许将真空施加到晶片背面表面保持晶片进行处理。粘附在卡盘上的胶带用研磨砂轮研磨，使带的表面平行于先前用相同研磨装置研磨的卡盘表面。在将胶带安装在卡盘上时研磨胶带形成垂直于研磨轮主轴的平面，消除了穿孔中的颠簸并且消除了胶带的不均匀性，从而改进了晶片背面研磨，因此具有良好的现场平面度。

2. 发明授权

US07160808B2 Chuck for supporting wafers with a fluid 有权
标题翻译：卡盘用于支撑流体的晶圆
公开(公告)号：US07160808B2
公开(公告)日：2007-01-09
申请号：US10860381
申请日：2004-06-01
申请人： Salman M. Kassir
发明人： Salman M. Kassir
IPC分类号： C30B25/12 , C30B25/14
CPC分类号： H01L21/30608 , Y10S438/977
摘要： A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a warm solution of KOH to the backside of the wafer while the wafer spins. The wafer may be supported on a rotatable platform adapted to direct the flow of chilled, deionized water underneath the device side of the wafer. The chilled water supports the wafer and protects the devices built-up on the wafer from the corrosive effects of KOH and from thermal damage.
摘要翻译：通过去除晶片衬底的一小部分来减轻薄晶片上的表面应力的方法，通过在晶片旋转的同时将KOH的温溶液施加到晶片的背面来去除衬底。晶片可以被支撑在可旋转的平台上，适于引导冷却的去离子水在晶片的器件侧下方的流动。冷却水支撑晶片，保护晶片上积聚的器件免受KOH的腐蚀和热损伤。

3. 发明授权

US06743722B2 Method of spin etching wafers with an alkali solution 有权
标题翻译：用碱溶液旋转蚀刻晶片的方法
公开(公告)号：US06743722B2
公开(公告)日：2004-06-01
申请号：US10059701
申请日：2002-01-29
申请人： Salman M. Kassir
发明人： Salman M. Kassir
IPC分类号： H01L21304
CPC分类号： H01L21/30608 , Y10S438/977
摘要： A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a solution of KOH to the wafer while the wafer spins.
摘要翻译：通过去除晶片衬底的一小部分来减轻薄晶片上的表面应力的方法，通过在晶片旋转时将KOH溶液施加到晶片来除去衬底。

4. 发明授权

US06638389B2 Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers 有权
标题翻译：将插入物或带施加到用于研磨，抛光或平面化晶片的卡盘或晶片载体的方法
公开(公告)号：US06638389B2
公开(公告)日：2003-10-28
申请号：US10259536
申请日：2002-09-26
申请人： Salman M. Kassir , Alan Strasbaugh
发明人： Salman M. Kassir , Alan Strasbaugh
IPC分类号： B29C6500
CPC分类号： B24B37/30 , H01L21/67132 , Y10T156/1092 , Y10T156/17 , Y10T156/1744
摘要： A tool and method for applying an insert to the face of a chuck so that holes in the insert register with holes in the chuck, includes a removable vacuum chamber that is brought into sealing engagement with the chuck and that is indexed with respect to the chuck by means of locating pins. The removable vacuum chamber includes a stamp on which the insert is mounted and to which the insert is indexed by locating pins. The stamp is advanced until an adhesive surface of the insert contacts the face of the chuck. Thereafter, the vacuum is relieved and the vacuum chamber is removed from the chuck. The tool insures that the holes in the insert register with those in the face of the chuck, and the absence of air within the vacuum chamber prevents air from being trapped between the insert and the face of the chuck.
摘要翻译：一种用于将插入件施加到卡盘的表面的工具和方法，使得插入件中的插入孔中的孔与卡盘中的孔对齐，包括与卡盘密封接合并且相对于卡盘分度的可移除真空室通过定位销。可移除的真空室包括一个印模，插入件安装在该印模上，插入件通过定位销而被引导到该印模上。推进印模直到插入件的粘合表面接触卡盘的表面。此后，释放真空并从卡盘中取出真空室。该工具确保插入件中的孔与卡盘的孔中的孔对准，并且真空室内没有空气防止空气被捕获在插入件和卡盘的表面之间。

5. 发明授权

US06866564B2 Method of backgrinding wafers while leaving backgrinding tape on a chuck 失效
标题翻译：在将研磨胶带留在卡盘上时背面研磨晶片的方法
公开(公告)号：US06866564B2
公开(公告)日：2005-03-15
申请号：US10315746
申请日：2002-12-10
申请人： Alan Strasbaugh , Salman M. Kassir
发明人： Alan Strasbaugh , Salman M. Kassir
IPC分类号： B24B1/00 , B24B37/30 , H01L21/00 , H01L21/304 , H01L21/683
CPC分类号： B24B37/30 , H01L21/67132 , Y10T156/1092 , Y10T156/17 , Y10T156/1744
摘要： A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, and then removed from the tape. A tool for applying tape to a chuck, as described herein, facilitates this method.
摘要翻译：背面研磨晶片的方法，其中将后研磨带或垫施加到卡盘而不是施加到晶片。当每个晶片顺序地放置在带或垫（背景）上，然后从带上取出时，将背面研磨带或垫留在卡盘上。如本文所述的用于将胶带施加到卡盘的工具有助于该方法。

6. 发明授权

US07059942B2 Method of backgrinding wafers while leaving backgrinding tape on a chuck 有权
标题翻译：在将研磨胶带留在卡盘上时背面研磨晶片的方法
公开(公告)号：US07059942B2
公开(公告)日：2006-06-13
申请号：US10717032
申请日：2003-11-18
申请人： Alan Strasbaugh , Salman M. Kassir
发明人： Alan Strasbaugh , Salman M. Kassir
IPC分类号： B24B1/00
CPC分类号： B24B41/061 , B24B7/228 , B24B37/30 , H01L21/67132
摘要： A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed from the tape and then cleaned on the front side and backside. A tool for applying tape to a chuck, as described herein, facilitates this method.
摘要翻译：背面研磨晶片的方法，其中将后研磨带或垫施加到卡盘而不是施加到晶片。当将每个晶片顺序地放置在带或垫上的背景中，背面研磨胶带或垫留在卡盘上，背景在背面漂洗，从带上移除，然后在前侧和背面清洁。如本文所述的用于将胶带施加到卡盘的工具有助于该方法。

7. 发明授权

US06254155B1 Apparatus and method for reliably releasing wet, thin wafers 有权
标题翻译：可靠地释放湿，薄晶片的装置和方法
公开(公告)号：US06254155B1
公开(公告)日：2001-07-03
申请号：US09228113
申请日：1999-01-11
申请人： Salman M Kassir
发明人： Salman M Kassir
IPC分类号： B25J1506
CPC分类号： B25J15/0616 , H01L21/6838
摘要： In a type of end effector used for handling wafers in the semiconductor industry, the wafer is acquired by lowering the end effector until it almost touches the upper side of the wafer and then applying suction to lift the water into contact with a wafer contacting surface on the underside of the end effector. Release of the wafer is accomplished by relieving the suction or replacing it with a small overpressure. Wet thin wafers do not reliably release; the liquid spreads into a thin film between the upper side of the wafer and the wafer contacting surface, and the surface tension of this film causes the thin wet wafer to adhere to the wafer contacting surface. This problem is solved by affixing a sheet of a porous resilient material, such as open cell MYLAR®, to the wafer contacting surface.
摘要翻译：在用于处理半导体工业中的晶片的端部执行器的一种类型中，通过降低端部执行器来获得晶片，直到它几乎接触晶片的上侧，然后施加吸力以将水提升到与晶片接触表面接触末端执行器的下侧。通过减轻吸力或用小的过压来替代晶片来释放晶片。湿薄晶片不能可靠释放; 液体在晶片的上侧和晶片接触表面之间扩散成薄膜，并且该薄膜的表面张力使得薄的湿晶片粘附到晶片接触表面。该问题通过将诸如开孔单元MYLAR的多孔弹性材料片固定到晶片接触表面来解决。

8. 发明授权

US5964646A Grinding process and apparatus for planarizing sawed wafers 失效
标题翻译：用于平面化锯片的研磨工艺和设备
公开(公告)号：US5964646A
公开(公告)日：1999-10-12
申请号：US971642
申请日：1997-11-17
申请人： Salman M Kassir , Thomas A Walsh
发明人： Salman M Kassir , Thomas A Walsh
IPC分类号： B24B7/22 , B24B37/04 , B24B41/06 , B24B1/00
CPC分类号： B24B37/30 , B24B37/04 , B24B41/06 , B24B7/228
摘要： A method and apparatus for planarizing silicon wafers initially having wavy surfaces, such as might result from having been cut from a boule by means of a wire saw. A vacuum is applied to one side of a porous ceramic plate, and a perforated resilient pad is applied to the opposite side of the porous ceramic plate. The resilient pad is affixed to the ceramic plate by a peelable adhesive, and the vacuum extends through the perforations of the resilient pad to permit a wafer to be mounted on the exposed side of the resilient pad. The perforations in the resilient pad are distributed uniformally across the wafer, so that the atmospheric pressure pushing the wafer against the resilient pad is also uniform across the wafer. However, the wafer is not deformed while it is held in place for grinding. Because the wafer is not held in an elastically deformed condition while it is ground, the wafer has no tendency to spring back to its original wavy shape. Once one side of the wafer has been planarized, conventional methods can be employed to planarize the second surface of the wafer and to make uniform its thickness. The method is fully compatible with existing grinding machines and, except for the insertion of the resilient pad, requires no departure from the standard grinding techniques.
摘要翻译：用于平坦化初始具有波状表面的硅晶片的方法和装置，例如可能是由于通过线锯被从毛坯切割而产生的。将真空施加到多孔陶瓷板的一侧，并且穿孔的弹性垫被施加到多孔陶瓷板的相对侧。弹性垫通过可剥离的粘合剂固定到陶瓷板上，并且真空延伸穿过弹性垫的穿孔，以允许将晶片安装在弹性垫的暴露侧上。弹性垫中的穿孔均匀地分布在晶片上，使得将晶片推向弹性垫的大气压在整个晶片上也是均匀的。然而，当晶片保持就位用于研磨时，晶片不变形。由于晶片在被研磨时没有保持在弹性变形状态，所以晶片没有弹回到其原始波浪形状的倾向。一旦晶片的一侧已经被平坦化，可以使用常规方法来平坦化晶片的第二表面并使其厚度均匀。该方法与现有的磨床完全兼容，除了插入弹性垫外，不需要脱离标准磨削技术。

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