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1. 发明授权

US6077149A Method and apparatus for surface-grinding of workpiece 失效
标题翻译：工件表面研磨的方法和装置
公开(公告)号：US6077149A
公开(公告)日：2000-06-20
申请号：US953515
申请日：1997-10-17
申请人： Sadayuki Ohkuni , Tadahiro Kato , Hideo Kudo
发明人： Sadayuki Ohkuni , Tadahiro Kato , Hideo Kudo
IPC分类号： B24B7/22 , B24B1/00 , B24B37/04 , B24B41/06 , H01L21/304 , B24B5/04
CPC分类号： B24B37/30 , B24B37/042 , B24B41/068
摘要： In a surface-grinding method for a workpiece, for example a semiconductor wafer, it is possible to correct or improve waviness and bow and to obtain a semiconductor wafer having no thickness dispersion. Besides, wafer processing to higher precision than that conventionally attained is achieved and at the same time simplification of the processing method and thereby reduction of the cost are also achieved. In the present invention, while the workpiece is fixed for supporting at one surface by the fixedly supporting means of a surface-grinding apparatus, the other surface of the workpiece is surface-ground, where the workpiece adheres on the upper surface of a base plate by the aid of adhesive material and the base plate is fixedly supported by the lower surface of itself on the fixedly supporting means.
摘要翻译：在用于工件的表面研磨方法，例如半导体晶片中，可以校正或改善波纹和弯曲并获得没有厚度分散的半导体晶片。此外，实现了比传统获得的更高精度的晶片处理，同时也实现了处理方法的简化，从而降低了成本。在本发明中，当通过表面研磨装置的固定支撑装置将工件固定在一个表面上时，工件的另一个表面被表面磨削，其中工件粘附在基板的上表面上借助于粘合剂材料，底板由固定支撑装置上的自身的下表面固定地支撑。

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