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    • 9. 发明申请
    • Light-emitting diode
    • 发光二极管
    • US20060001361A1
    • 2006-01-05
    • US11157171
    • 2005-06-21
    • Sadato ImaiSatoru Kikuchi
    • Sadato ImaiSatoru Kikuchi
    • H01J1/62
    • H01L33/64H01L33/486H01L2224/48091H01L2924/10253H05K1/0204H05K1/021H05K1/182H05K3/0061H05K3/3442H05K2201/09181H05K2201/10106H01L2924/00014H01L2924/00
    • The LED comprises: a base having high thermal conductivity and having a mounting surface for die bonding; a printed circuit board mounted on the base and having a hole to expose a part of the mounting surface of the base and having a protruding portion projecting horizontally outward on the outer periphery of the base; an LED element mounted on the mounting surface of the base exposed in the hole of the printed circuit board; and a resin material sealing the LED element from above; wherein through-holes electrically connected to the LED element are formed at the outer periphery of the protruding portion and an external connection electrode is provided to the upper and lower surfaces of the through-holes. This LED enhances the heat dissipating effect to enable generation of high-luminance light and can also be mounted on either the upper or lower surface of a motherboard.
    • LED包括:具有高导热性并具有用于芯片接合的安装表面的基座; 印刷电路板,其安装在所述基座上并且具有用于露出所述基座的所述安装面的一部分的孔,并具有在所述基座的外周上水平向外突出的突出部; 安装在暴露在印刷电路板的孔中的基座的安装表面上的LED元件; 以及从上方密封LED元件的树脂材料。 其中在所述突出部分的外周形成与所述LED元件电连接的通孔,并且在所述通孔的上表面和下表面设置外部连接电极。 该LED增强了散热效果,能够产生高亮度光,并且也可以安装在母板的上表面或下表面上。