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1. 发明申请

WO2009143243A1 HIGH TEMPERATURE CERAMIC DIE PACKAGE AND DUT BOARD SOCKET 审中-公开
标题翻译：高温陶瓷包装和被测板插座
公开(公告)号：WO2009143243A1
公开(公告)日：2009-11-26
申请号：PCT/US2009/044676
申请日：2009-05-20
申请人： QUALITAU, INC. , BENSING, Thomas, G. , RAMIREZ, Adalberto, M. , ULLMANN, Jens , HERSCHMANN, Jacob , SYLVIA, Robert, J. , EVANS, Maurice, C.
发明人： BENSING, Thomas, G. , RAMIREZ, Adalberto, M. , ULLMANN, Jens , HERSCHMANN, Jacob , SYLVIA, Robert, J. , EVANS, Maurice, C.
IPC分类号： G01R31/28
CPC分类号： G01R31/2884 , H01L22/32 , H01L2924/0002 , H01L2924/00
摘要： A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one "well" location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).
摘要翻译：提供了一种条形包装，可以接受多达骰子的单个模具。导电路径在其上打印（或以其它方式一体形成）到封装的边缘，并且可以提供互补插座，其与条形封装组合提供电连接到测试电子器件而不使用封装引线。带状包装可以由陶瓷或其他耐温材料制成。条形包装可以具有至少一个“井”位置，其中模具或骰子可以固定到条形包装。带材可以具有构造成用作各个模具外壳（和相关的整体形成的导电路径）之间的隔板的凹口。

2. 发明申请

WO2009002630A1 HIGH TEMPERATURE CERAMIC SOCKET CONFIGURED TO TEST PACKAGED SEMICONDUCTOR DEVICES 审中-公开
标题翻译：配置到测试包装半导体器件的高温陶瓷插座
公开(公告)号：WO2009002630A1
公开(公告)日：2008-12-31
申请号：PCT/US2008/063902
申请日：2008-05-16
申请人： QUALITAU, INC. , YSAGUIRRE, Jose , ULLMANN, Jens , RAMIREZ, Adalberto M. , SYLVIA, Robert J.
发明人： YSAGUIRRE, Jose , ULLMANN, Jens , RAMIREZ, Adalberto M. , SYLVIA, Robert J.
IPC分类号： H05K1/00
CPC分类号： G01R1/0433
摘要： A test socket assembly is for use in testing integrated circuits. A single piece socket is formed substantially of an insulating material and having a plurality of holes formed therein configured to receive a plurality of electrically conductive springs. Each hole of the single piece socket has therein a separate one of the electrically conductive springs. A test socket includes a plurality of pins configured to receive leads of an integrated circuit, the pins of the test socket extending into the plurality of holes of the single piece socket with each pin engaging a spring, wherein the single piece socket is positioned on a circuit board with the plurality of holes being in alignment with electrical contacts on the circuit board such that the plurality of springs are electrically interconnecting the contacts and the plurality of pins. The single-piece socket is comprised substantially of a high-temperature insulating material, such as ceramic.
摘要翻译：测试插座组件用于测试集成电路。单件插座基本上由绝缘材料形成，并且具有形成在其中的多个孔，构造成容纳多个导电弹簧。单件插座的每个孔都具有单独的一个导电弹簧。测试插座包括被配置为接收集成电路的引线的多个引脚，测试插座的引脚延伸到单个插座的多个孔中，每个引脚与弹簧接合，其中单个插座位于所述多个孔与所述电路板上的电触点对准，使得所述多个弹簧将所述触点和所述多个销电连接。单件式插座基本上由诸如陶瓷的高温绝缘材料构成。

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