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1. 发明申请

US20100302543A1 METHOD OF MANUFACTURING OPTICAL RECEIVER MODULE AND APPARATUS FOR MANUFACTURING THE SAME 审中-公开
标题翻译：制造光接收机模块的方法及其制造方法
公开(公告)号：US20100302543A1
公开(公告)日：2010-12-02
申请号：US12767225
申请日：2010-04-26
申请人： Yusuke Kurihara , Shigeru Moribayashi
发明人： Yusuke Kurihara , Shigeru Moribayashi
IPC分类号： G01B11/14
CPC分类号： G02B6/4225 , G02B6/3809 , G02B6/4206 , G02B6/4292
摘要： The core adjusting process includes a procedure of searching for the position in which the photocurrent of the light-receiving element reaches its peak in each of the X-, Y-, and Z-directions. In the searching procedure, the light emitted from a multimode fiber of a MCP is gathered by a lens and is transmitted to the light-receiving element. A check is then made to determine whether, at in both directions of the search direction, there exist a first and second attenuation positions in which the photocurrent shows a predetermined attenuation relative to a peak value in a search range. If there exist the attenuation positions, a peak position is determined to be a position located within a second predetermined range from the middle point between the attenuation positions, and the relative positions of the receptacle and the CAN package are adjusted to the peak position.
摘要翻译：核心调整处理包括搜索在X，Y和Z方向中的每一个中光接收元件的光电流达到其峰值的位置的过程。在搜索过程中，从MCP的多模光纤发射的光被透镜收集并被传输到光接收元件。然后进行检查以确定在搜索方向的两个方向上是否存在第一和第二衰减位置，其中光电流相对于搜索范围中的峰值显示预定的衰减。如果存在衰减位置，则峰值位置被确定为位于距离衰减位置之间的中点的第二预定范围内的位置，并且插座和CAN封装的相对位置被调整到峰值位置。

2. 发明申请

US20090010296A1 Optical transceiver module and method for manufacturing same 审中-公开
标题翻译：光收发模块及其制造方法
公开(公告)号：US20090010296A1
公开(公告)日：2009-01-08
申请号：US11979695
申请日：2007-11-07
申请人： Yasuhei Shimada , Shigeru Moribayashi , Takao Yamazaki
发明人： Yasuhei Shimada , Shigeru Moribayashi , Takao Yamazaki
IPC分类号： H01S5/026 , B29D11/00
CPC分类号： G02B6/4204 , H01S5/02284
摘要： An optical transceiver module and a method for manufacturing thereof, which are adopted for providing a reduced manufacturing cost and an improved signal quality, are achieved. The optical transceiver module 1 includes a VCSEL 13 that is capable of emitting light; a thermoplastic resin layer 22 provided on the VCSEL 13 and transparent to the above-described light; a copper foil 21, provided in the thermoplastic resin layer 22 and the resin layer, and having an opening 21a that is transparent to light; a dimple 22a, provided in a surface of the thermoplastic resin layer 22 in a side opposite to the VCSEL 13; and a lens provided in the dimple. The dimple 22a is located above the opening 21a.
摘要翻译：实现了用于提供降低的制造成本和改善的信号质量的光收发器模块及其制造方法。光收发器模块1包括能够发光的VCSEL 13; 设置在VCSEL 13上且对上述光透明的热塑性树脂层22; 设置在热塑性树脂层22和树脂层中的铜箔21，具有对光透明的开口部21a; 在与VCSEL 13相反的一侧设置在热塑性树脂层22的表面的凹部22a; 以及设置在凹坑中的透镜。凹坑22a位于开口21a的上方。

3. 发明申请

US20070210400A1 Optical unit featuring both photoelectric conversion chip and semiconductor chip wrapped with flexible sheet 失效
标题翻译：光电单元具有光电转换芯片和半导体芯片，包裹柔性片
公开(公告)号：US20070210400A1
公开(公告)日：2007-09-13
申请号：US11708142
申请日：2007-02-20
申请人： Shigeru Moribayashi , Yoshiaki Morishita , Kowashi Taketomi , Takao Yamazaki , Shinji Watanabe , Ichiro Hatakeyama
发明人： Shigeru Moribayashi , Yoshiaki Morishita , Kowashi Taketomi , Takao Yamazaki , Shinji Watanabe , Ichiro Hatakeyama
IPC分类号： H01L31/00
CPC分类号： G02B6/4249 , G02B6/4214 , G02B6/4232 , G02B6/425 , G02B6/4292 , G02B6/43 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12032 , H01S5/02248 , H01S5/02272 , H01S5/02276 , H01S5/02284 , H01S5/02292 , H01S5/183 , H01L2924/00
摘要： In an optical unit including a photoelectric conversion chip adapted to be optically connected to an optical fiber, and a semiconductor chip for driving the photoelectric conversion chip, both the photoelectric conversion chip and the semiconductor chip are wrapped with a flexible sheet, to thereby produce an enveloper enveloping the photoelectric conversion chip and the semiconductor chip therein. At least a part of the enveloper is formed as a transparent area for allowing an optical connection between the optical fiber and the photoelectric conversion chip.
摘要翻译：在包括适于与光纤光学连接的光电转换芯片的光学单元和用于驱动光电转换芯片的半导体芯片中，光电转换芯片和半导体芯片都用柔性片包裹，从而产生封装光电转换芯片和其中的半导体芯片。至少一部分加热器形成为允许光纤和光电转换芯片之间的光学连接的透明区域。

4. 发明授权

US08328436B2 Optical module 有权
标题翻译：光模块
公开(公告)号：US08328436B2
公开(公告)日：2012-12-11
申请号：US12727369
申请日：2010-03-19
申请人： Kazuhiro Mitamura , Shigeru Moribayashi , Junichi Shimizu , Hideyuki Yamada , Shunsuke Okamoto , Masahiko Takeda , Shigeki Asahi , Hiroki Itakura
发明人： Kazuhiro Mitamura , Shigeru Moribayashi , Junichi Shimizu , Hideyuki Yamada , Shunsuke Okamoto , Masahiko Takeda , Shigeki Asahi , Hiroki Itakura
IPC分类号： G02B6/36
CPC分类号： G02B6/4207 , G02B6/4206
摘要： An optical module includes a receptacle for receiving an optical connector attached to a distal end of an optical fiber, and a lens body having a contact surface coming into contact with the distal end of the optical fiber when the receptacle receives the optical connector. The lens body has the contact surface and an opposing surface opposing the contact surface, and further has a columnar base held by the receptacle, a lens portion formed on the opposing surface integrally with the base, and a flat portion. The lens portion is surrounded by the flat portion and is off-centered with respect to the base.
摘要翻译：光学模块包括用于接收附接到光纤远端的光学连接器的插座和当插座接收光学连接器时具有与光纤的远端接触的接触表面的透镜主体。透镜体具有接触表面和与接触表面相对的相对表面，并且还具有由插座保持的柱状基部，与基部一体形成在相对表面上的透镜部分和平坦部分。透镜部分被平坦部分包围，并且相对于基部偏心。

5. 发明申请

US20100239212A1 OPTICAL MODULE 有权
标题翻译：光学模块
公开(公告)号：US20100239212A1
公开(公告)日：2010-09-23
申请号：US12727369
申请日：2010-03-19
申请人： KAZUHIRO MITAMURA , SHIGERU MORIBAYASHI , JUNICHI SHIMIZU , HIDEYUKI YAMADA , SHUNSUKE OKAMOTO , MASAHIKO TAKEDA , SHIGEKI ASAHI , HIROKI ITAKURA
发明人： KAZUHIRO MITAMURA , SHIGERU MORIBAYASHI , JUNICHI SHIMIZU , HIDEYUKI YAMADA , SHUNSUKE OKAMOTO , MASAHIKO TAKEDA , SHIGEKI ASAHI , HIROKI ITAKURA
IPC分类号： G02B6/43
CPC分类号： G02B6/4207 , G02B6/4206
摘要： An optical module includes a receptacle for receiving an optical connector attached to a distal end of an optical fiber, and a lens body having a contact surface coming into contact with the distal end of the optical fiber when the receptacle receives the optical connector. The lens body has the contact surface and an opposing surface opposing the contact surface, and further has a columnar base held by the receptacle, a lens portion formed on the opposing surface integrally with the base, and a flat portion. The lens portion is surrounded by the flat portion and is off-centered with respect to the base.
摘要翻译：光学模块包括用于接收附接到光纤远端的光学连接器的插座和当插座接收光学连接器时具有与光纤的远端接触的接触表面的透镜主体。透镜体具有接触表面和与接触表面相对的相对表面，并且还具有由插座保持的柱状基部，与基部一体形成在相对表面上的透镜部分和平坦部分。透镜部分被平坦部分包围，并且相对于基部偏心。

6. 发明授权

US07504701B2 Optical unit featuring both photoelectric conversion chip and semiconductor chip wrapped with flexible sheet 失效
标题翻译：光电单元具有光电转换芯片和半导体芯片，包裹柔性片
公开(公告)号：US07504701B2
公开(公告)日：2009-03-17
申请号：US11708142
申请日：2007-02-20
申请人： Shigeru Moribayashi , Yoshiaki Morishita , Kowashi Taketomi , Takao Yamazaki , Shinji Watanabe , Ichiro Hatakeyama
发明人： Shigeru Moribayashi , Yoshiaki Morishita , Kowashi Taketomi , Takao Yamazaki , Shinji Watanabe , Ichiro Hatakeyama
IPC分类号： H01L31/00
CPC分类号： G02B6/4249 , G02B6/4214 , G02B6/4232 , G02B6/425 , G02B6/4292 , G02B6/43 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12032 , H01S5/02248 , H01S5/02272 , H01S5/02276 , H01S5/02284 , H01S5/02292 , H01S5/183 , H01L2924/00
摘要： In an optical unit including a photoelectric conversion chip adapted to be optically connected to an optical fiber, and a semiconductor chip for driving the photoelectric conversion chip, both the photoelectric conversion chip and the semiconductor chip are wrapped with a flexible sheet, to thereby produce an enveloper enveloping the photoelectric conversion chip and the semiconductor chip therein. At least a part of the enveloper is formed as a transparent area for allowing an optical connection between the optical fiber and the photoelectric conversion chip.
摘要翻译：在包括适于与光纤光学连接的光电转换芯片的光学单元和用于驱动光电转换芯片的半导体芯片中，光电转换芯片和半导体芯片都用柔性片包裹，从而产生封装光电转换芯片和其中的半导体芯片。至少一部分加热器形成为允许光纤和光电转换芯片之间的光学连接的透明区域。

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