会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • METHOD OF AND APPARATUS FOR INK JET PRINTING ADHESIVES
    • 喷墨印刷胶粘剂的方法和装置
    • WO2008091724A1
    • 2008-07-31
    • PCT/US2008/050355
    • 2008-01-07
    • 3M INNOVATIVE PROPERTIES COMPANYBOYD, Scott A.LEE, Jennifer L.SEVERANCE, Richard L.WEAVER, Billy L.
    • BOYD, Scott A.LEE, Jennifer L.SEVERANCE, Richard L.WEAVER, Billy L.
    • B05D1/16B05C3/02
    • B05D1/28B05B7/2483B05D3/042B05D5/10
    • An improved adhesive applicator or fluid delivery system (1) immerses a wire in a reservoir of adhesive for a period of time sufficient to allow the wire to be coated with the adhesive, (2) places the coated wire in close proximity to a designated medium onto which the adhesive will be applied, and (3) directs a stream of gas to contact the coated wire and to thereby cause at least some of the adhesive on the wire to be deposited onto the designated medium. The speed of the wire and the force of the air stream may be digitally controlled by a processor, controller, microprocessor, or other computing device to ensure that a desired image resolution is achieved. Because the fluid delivery system is free of most of the mechanical limitations of traditional ink jet print heads, the system is compatible with adhesive application. When compared to the traditional coating operations for adhesives, the fluid delivery system allows controlled delivery, both in terms of location on the print medium and drop size (and thus coat weight). The system thus allows for greater positional and coat weight control of adhesives on the print medium or substrate, which is especially useful where precise control is desired.
    • 改进的粘合剂施加器或流体输送系统(1)将线浸入粘合剂储存器中足以允许电线被粘合剂涂覆的时间段,(2)将涂覆的电线放置在靠近指定介质 将粘合剂施加到其上,以及(3)引导气流与涂覆的丝接触,从而导致线上的至少一些粘合剂沉积在指定的介质上。 线的速度和空气流的力可由处理器,控制器,微处理器或其他计算设备数字地控制,以确保实现所需的图像分辨率。 由于流体输送系统没有传统喷墨打印头的大部分机械限制,所以该系统与粘合剂应用相兼容。 当与传统的粘合剂涂层操作相比时,流体输送系统允许在打印介质上的位置和液滴尺寸(以及因此涂层重量)方面受到控制的传送。 因此,该系统允许对打印介质或基底上的粘合剂进行更大的位置和涂层重量控制,这在需要精确控制时尤其有用。