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    • 1. 发明申请
    • COMPUTER COOLING APPARATUS
    • 电脑冷却装置
    • WO2003007372A2
    • 2003-01-23
    • PCT/CA2002/001078
    • 2002-07-15
    • COOLIT SYSTEMS INC.SCOTT, Alexander, Robin, Walter
    • SCOTT, Alexander, Robin, Walter
    • H01L23/473
    • F28F3/12G06F1/20H01L23/473H01L2924/0002H01L2924/00
    • An apparatus for cooling an electronic device that includes a fluid heat exchanger, a chiller, and a pump. The fluid heat exchanger transfers heat from a hot portion of the surface of the electronic device to a fluid and has a body through which the fluid may be circulated. The body has a protrusion having a first surface that may be thermally coupled to the hot portion such that the surface of the body is sufficiently distant from the surface of the electronic device that sufficient ambient air may circulate therebetween so as to substantially prevent condensation from forming on the surface of the electronic device and from forming on and dripping from the heat exchanger when the fluid is cooled to at least the dew point of the ambient air and circulated through the body. A heat-conducting path is provided from the first surface to a region of the body that is thermally coupled to the fluid when the fluid is circulated through the body. The chiller circulates the fluid through a chiller and the fluid heat exchanger.
    • 一种用于冷却包括流体热交换器,冷却器和泵的电子设备的设备。 流体热交换器将热量从电子设备的表面的热部分传递到流体,并且具有可以使流体循环通过的主体。 主体具有突起,其具有可以与热部分热耦合的第一表面,使得主体的表面足够远离电子设备的表面,足够的环境空气可以在其间循环,从而基本上防止冷凝形成 在电子设备的表面上并且当流体被冷却至至少环境空气的露点并循环通过本体时,在热交换器上形成和滴落。 当流体循环通过本体时,导热路径从第一表面提供到主体的热耦合到流体的区域。 冷却器将流体循环通过冷却器和流体热交换器。
    • 2. 发明申请
    • COOLING APPARATUS FOR ELECTRONIC DEVICES
    • 电子设备冷却装置
    • WO03007372A3
    • 2003-07-10
    • PCT/CA0201078
    • 2002-07-15
    • COOLIT SYSTEMS INCSCOTT ALEXANDER ROBIN WALTER
    • SCOTT ALEXANDER ROBIN WALTER
    • F28F3/12G06F1/20H01L23/473H05K7/20
    • F28F3/12G06F1/20H01L23/473H01L2924/0002H01L2924/00
    • An apparatus for cooling an electronic device that includes a fluid heat exchanger, a chiller, and a pump. The fluid heat exchanger transfers heat from a hot portion of the surface of the electronic device to a fluid and has a body through which the fluid may be circulated. The body has a protrusion having a first surface that may be thermally coupled to the hot portion such that the surface of the body is sufficiently distant from the surface of the electronic device that sufficient ambient air may circulate therebetween so as to substantially prevent condensation from forming on the surface of the electronic device and from forming on and dripping from the heat exchanger when the fluid is cooled to at least the dew point of the ambient air and circulated through the body. A heat-conducting path is provided from the first surface to a region of the body that is thermally coupled to the fluid when the fluid is circulated through the body. The chiller circulates the fluid through a chiller and the fluid heat exchanger.
    • 一种用于冷却包括流体热交换器,冷却器和泵的电子设备的设备。 流体热交换器将热量从电子设备的表面的热部分传递到流体,并且具有可以使流体循环通过的主体。 主体具有突起,其具有可以与热部分热耦合的第一表面,使得主体的表面足够远离电子设备的表面,足够的环境空气可以在其间循环,从而基本上防止冷凝形成 在电子设备的表面上并且当流体被冷却至至少环境空气的露点并循环通过本体时,在热交换器上形成和滴落。 当流体循环通过本体时,导热路径从第一表面提供到主体的热耦合到流体的区域。 冷却器将流体循环通过冷却器和流体热交换器。