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    • 3. 发明申请
    • METHOD FOR CREATING SERIAL CONNECTED OLED-DEVICES
    • 用于创建串联连接的OLED器件的方法
    • WO2011073856A1
    • 2011-06-23
    • PCT/IB2010/055665
    • 2010-12-08
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBHSCHWAB, Holger
    • SCHWAB, Holger
    • H01L51/52H01L51/56
    • H01L51/56H01L27/3204H01L2251/5361
    • By the invention it is proposed a method of preparing a serial connection of OLED-devices, comprising the steps of providing a carrier substrate; depositing a first electrode material layer on said carrier substrate; depositing a layer of an organic optoelectronic active material on said first electrode material layer; depositing a second electrode material layer on said organic optoelectronic active material layer; ablating at least the second electrode material layer and the organic optoelectronic active material layer at least in selected areas to build a trench forming separated OLED-devices on the carrier surface; electrically interconnecting neighboring OLED-devices by connecting the anode of a first OLED-device to the cathode of a neighboring second OLED-device, wherein in the steps of depositing the organic optoelectronic active material layer and the cathode layer, the carrier substrate surface is covered over its entire functional area with said layers, and wherein the electrical interconnection of the neighboring OLED-devices is performed by at least partially filling the trenches built in the ablating step with an electrical conductive material. Furthermore, an illuminant is provided comprising serial connected OLED-devices.
    • 通过本发明,提出了一种制备OLED器件的串行连接的方法,包括以下步骤:提供载体衬底; 在所述载体衬底上沉积第一电极材料层; 在所述第一电极材料层上沉积有机光电活性材料层; 在所述有机光电活性材料层上沉积第二电极材料层; 至少在选定的区域中至少烧蚀所述第二电极材料层和所述有机光电活性材料层,以在所述载体表面上建立形成分离的OLED器件的沟槽; 通过将第一OLED器件的阳极连接到相邻的第二OLED器件的阴极来电连接相邻的OLED器件,其中在沉积有机光电活性材料层和阴极层的步骤中,覆盖载体衬底表面 在其整个功能区域上具有所述层,并且其中相邻OLED器件的电互连通过用导电材料至少部分地填充在烧蚀步骤中内置的沟槽来进行。 此外,提供了包括串联连接的OLED器件的发光体。
    • 4. 发明申请
    • MULTI-DEVICE OLED
    • 多器件OLED
    • WO2012049580A1
    • 2012-04-19
    • PCT/IB2011/054292
    • 2011-09-29
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBHSCHWAB, HolgerVAN ELSBERGEN, VolkerBOERNER, Herbert, FriedrichRAASCH, DetlefHARTMANN, Sören
    • SCHWAB, HolgerVAN ELSBERGEN, VolkerBOERNER, Herbert, FriedrichRAASCH, DetlefHARTMANN, Sören
    • H01L27/32H01L51/52
    • H01L51/52H01L27/3209H01L51/5203H01L51/56
    • The invention describes a multi-device OLED (1) comprising a device layer stack (100) comprising a bottom electrode (11), a top electrode (14), at least one inter electrode (13) and plurality of active layers (120, 121), wherein the bottom electrode (11) is applied to a substrate (10), and each active layer (120, 121) is enclosed between two electrodes (11, 13, 14); a current distribution means (500) comprising a current distribution layer (51, 53, 54) for each electrode (11, 13, 14) of the device layer stack (100); a plurality of openings (110, 130) extending from the top electrode (14) into the device layer stack (100), wherein each opening (110, 130) exposes a contact region (111, 131) of an electrode (11, 13); and a plurality of electrical connectors (41, 42), wherein an electrical connector (41, 42) extends into an opening (110, 130) to electrically connect the electrode (11, 13) exposed by that opening (110, 130) to the current distribution layer (53, 54) for that electrode (11, 13). The invention also describes a method of manufacturing such a multi-device OLED. The invention further describes a method of driving such a multi-device OLED, which method comprises applying a voltage across at least one pair (51, 53, 53, 54) of current distribution layers (51, 53, 54) of the current distribution means (500) to stimulate the corresponding active layer (120, 121) of a device of the multi-device OLED (1).
    • 本发明描述了一种多器件OLED(1),其包括包括底电极(11),顶电极(14),至少一个内电极(13)和多个有源层(120)的器件层堆叠(100) 121),其中所述底部电极(11)被施加到基板(10),并且每个有源层(120,121)被包围在两个电极(11,13,14)之间; 电流分布装置(500),其包括用于装置层堆叠(100)的每个电极(11,13,14)的电流分布层(51,53,54); 从顶部电极(14)延伸到器件层叠层(100)中的多个开口(110,130),其中每个开口(110,130)暴露电极(11,13)的接触区域(111,131) ); 以及多个电连接器(41,42),其中电连接器(41,42)延伸到开口(110,130)中以将由该开口(110,130)暴露的电极(11,13)电连接到 用于该电极(11,13)的电流分布层(53,54)。 本发明还描述了制造这种多器件OLED的方法。 本发明还描述了一种驱动这种多器件OLED的方法,该方法包括在电流分布的电流分布层(51,53,54)的至少一对(51,53,53,54)上施加电压 用于刺激多器件OLED(1)的器件的相应有源层(120,121)的装置(500)。
    • 6. 发明申请
    • OLED DEVICE AND METHOD OF MANUFACTURING THE SAME
    • OLED器件及其制造方法
    • WO2012007875A1
    • 2012-01-19
    • PCT/IB2011/052987
    • 2011-07-06
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.PHILIPS INTELLECTUAL PROPERTY&STANDARDS GMBHSCHWAB, Holger
    • SCHWAB, Holger
    • H01L51/52
    • H01L51/5246H01L51/5203H01L2251/5361
    • The invention describes a method of manufacturing an OLED device (10), which method comprises applying a number of conductive strips (4) onto a substrate (1); forming a series of openings (40) in at least one conductive strip (4) along a sealing path (5) to expose the substrate (1) in those openings (40); applying a line of sealant (50, 51) along the sealing path (5) to enclose an organic layer (2) bounded by the conductive strips (4); and placing a cover lid (3) onto the sealant (50, 51) to encapsulate the OLED device (10). The invention also describes an OLED device (10), comprising a number of conductive strips (4) applied onto a substrate (1), wherein at least one conductive strip (4) comprises a series of openings (40) exposing the substrate (1) along a sealing path (50); an organic layer (2) deposited on the substrate (1) within a region bounded by the conductive strips (4); a cover (3) for sealing the OLED device (10); and a line of sealant (50, 51) applied along the sealing path (5), which sealant (50, 51) adheres at least to the cover lid (3) and to the substrate (1) exposed in the openings (40) of a conductive strip (4).
    • 本发明描述了一种制造OLED器件(10)的方法,该方法包括将多个导电条(4)施加到衬底(1)上; 在沿着密封路径(5)的至少一个导电条(4)中形成一系列开口(40),以露出所述开口(40)中的基板(1)。 沿密封通道(5)施加一排密封剂(50,51)以封闭由导电条(4)限定的有机层(2); 以及将盖盖(3)放置在所述密封剂(50,51)上以封装所述OLED装置(10)。 本发明还描述了一种OLED器件(10),其包括施加到衬底(1)上的多个导电条(4),其中至少一个导电条(4)包括暴露衬底(1)的一系列开口(40) )沿着密封路径(50); 在由导电条(4)限定的区域内沉积在基底(1)上的有机层(2); 用于密封所述OLED装置(10)的盖(3); 以及沿密封通道(5)施加的密封剂(50,51)线,该密封剂(50,51)至少粘附到盖盖(3)和暴露在开口(40)中的基板(1) 的导电条(4)。