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    • 1. 发明申请
    • TECHNIQUES FOR TILING ARRAYS OF PIXEL ELEMENTS
    • 用于倾斜像素元件阵列的技术
    • WO2013059757A1
    • 2013-04-25
    • PCT/US2012/061232
    • 2012-10-21
    • SANTA BARBARA INFRARED, INC.
    • LAVEIGNE, Joseph, Donald
    • H01L21/326
    • G01J5/02G01J5/20Y10T29/49002Y10T29/49117
    • Sub-arrays such as tiles or chips (110; 410; 510; 610) having pixel elements (112; 212; 412; 512; 612; 712; 812; 912) arranged on a routing layer (150; 350) or carrier to form a larger array (100). Through-chip vias (128) or the like to the backside of the chip are used for connecting with the pixel elements. Edge features (204, 206, 208) of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. Edge damage tolerance with minimal loss of function may be achieved by moving unit cell circuitry (422; 522; 622) and the electrically active portions (FIGs. 7A,B,C; FIG. 8, FIGs. 9, 9A) of a pixel element away from the tile edge(s) while leaving the optically active portion closer to the edge(s) if minor damage will not cause a complete failure of the pixel. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like. Various architectures (FIGs. 3A,B,C) are disclosed.
    • 具有布置在布线层(150; 350)上的像素元件(112; 212; 412; 512; 612; 712; 812; 912)的子阵列(例如瓦片或芯片)(110; 410; 510; 610) 形成一个较大的阵列(100)。 用于芯片背面的通孔(128)等用于与像素元件连接。 瓦片的边缘特征(204,206,208)可以提供物理对准,机械连接和芯片到芯片通信。 可以通过移动单元电路(422; 522; 622)和像素的电活动部分(图7A,B,C;图8,图9,9A)来实现具有最小功能损失的边缘损伤容限 元件远离瓦片边缘,同时使光学活动部分更靠近边缘,如果轻微损坏将不会导致像素完全失效。 像素元件可以是用于IR图像投影仪的热发射器元件,用于微测辐射热计的热检测器元件,基于LED的发射器,或诸如在可见光,红外和紫外FPAs(焦平面阵列)中发现的量子光子检测器等)。 公开了各种架构(图3A,B,C)。
    • 5. 发明公开
    • Improved blackbody function
    • Verbesserte Blackbodyfunktion
    • EP2793006A2
    • 2014-10-22
    • EP14165090.3
    • 2014-04-17
    • Santa Barbara Infrared Inc.
    • LaVeigne, Joseph D.McHugh, Stephen W.
    • G01J5/52
    • G01J5/0881G01J5/522
    • A blackbody radiometric reference (100, 200, 300, 400, 500, 600) comprising a source plate (102, 302, 402, 502, 602) or a target plate (202), metallic nanoparticles (110, 210) or other high emissivity coating disposed on the plate, and an intermediate coating (112, 212) such as paint. The plate may comprise copper, aluminum or composites thereof. Apparatus capable of functioning as a radiometric or thermometric reference (300, 400). A pre-heater or weakly-coupled area may be disposed around or adjacent a highly thermally uniform area. A groove (420) or perforations (415) extending into a front surface of the source plate defining a weakly-coupled edge portion (404) surrounding a thermally-controlled, optically-active area (402), and connected by bridges (414) or structures (526) thereto. An external probe (620) may be located near the source plate for measuring ambient temperature, for compensating for ambient temperature or for radiative load on the blackbody.
    • 包括源极板(102,302,402,502,602)或靶板(202)的黑体辐射测量参考(100,200,300,400,500,600),金属纳米颗粒(110,210)或其它高 布置在板上的发射率涂层和诸如涂料的中间涂层(112,212)。 该板可以包括铜,铝或其复合材料。 能够用作辐射测量或测温参考的装置(300,400)。 预热器或弱耦合区域可以设置在高度均匀的区域周围或附近。 延伸到源板的前表面中的槽(420)或穿孔(415),其限定围绕热控制的光学有效区域(402)并且由桥(414)连接的弱耦合边缘部分(404) 或结构(526)。 外部探头(620)可以位于源板附近,用于测量环境温度,以补偿环境温度或黑体上的辐射负载。