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    • 1. 发明申请
    • THICK-FILM CONDUCTOR CIRCUIT AND PRODUCTION METHOD THEREFOR
    • 厚膜导体电路及其生产方法
    • WO1997050280A1
    • 1997-12-31
    • PCT/JP1996001789
    • 1996-06-27
    • ASAHI KASEI KOGYO KABUSHIKI KAISHAYOSHIDA, KozoSAKABE, Kenichi
    • ASAHI KASEI KOGYO KABUSHIKI KAISHA
    • H05K01/02
    • G03F7/027H01L2924/0002H02K3/26H05K3/205H01L2924/00
    • A thick-film conductor circuit wherein a zinc-containing layer containing 3 to 20 atm% of zinc atoms with respect to copper atoms is formed in a thickness of 0.1 to 5 mu m in an area 5 mu m deep from the surface of a conductor made of a copper, or a thick-film conductor circuit having a rectangular sectional shape in the direction of width of the conductor and having rounded corners (R) at both lower end edge portions. This circuit is formed by using an aluminum plate treated with a zinc-containing basic solution as a conductive substrate, applying a specific liquid photosensitive resin composition to the conductive substrate, exposing a portion, where a resin pattern is to be formed, to high energy rays, dissolving or dispersing and removing an unexposed portion of the photosensitive resin composition by a developing solution to form a desired resin pattern on the conductive substrate, forming a conductor by electrolytic plating by applying a voltage to the conductive substrate while it is immersed in a plating solution, and removing the conductive substrate.
    • 从导电体表面的深度5μm的面积形成厚度为0.1〜5μm的厚度为3〜20atm的锌原子相对于铜原子的含锌层的厚膜导体电路 或者是在导体宽度方向上具有矩形截面形状的厚膜导体电路,并且在两个下端部分都具有圆角(R)。 该电路通过使用由含锌碱性溶液处理的铝板作为导电性基板而形成,将特定的液态感光性树脂组合物涂布在导电性基板上,使形成有树脂图案的部分暴露于高能量 通过显影液溶解或分散除去感光性树脂组合物的未曝光部分,在导电性基材上形成所希望的树脂图案,通过在将导电性基材浸渍在导电性基材中时向导电性基材施加电压而通过电解电镀形成导体 电镀液,去除导电性基板。