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    • 1. 发明授权
    • P-N junction devices with group IV element-doped group III-V compound
semiconductors
    • 具有IV族元素掺杂III-V族化合物半导体的P-N结器件
    • US5268582A
    • 1993-12-07
    • US934840
    • 1992-06-24
    • Rose F. KopfErdmann F. Schubert
    • Rose F. KopfErdmann F. Schubert
    • C30B29/68H01L21/20H01L21/203H01L21/338H01L29/15H01L29/207H01L29/778H01L29/80H01L29/812H01L29/861H01L31/10H01L29/161H01L29/205
    • H01L29/861H01L29/155H01L29/207
    • This invention embodies p-n junction devices comprising Group III-V compound semiconductors in which the p or n or both p and n regions are formed by a superlattice selectively doped with an amphoteric Group IV element dopant selected from carbon, germanium and silicone. The superlattice includes a plurality of periods, each including two layers. Depending on the conductivity type, only one of the layers in the periods forming the superlattice region of said type of conductivity is selectively doped with said dopant, leaving the other layer in these periods undoped. The superlattice is formed by Molecular Beam Epitaxy technique, and the dopant is incorporated into respective layers by delta-doping as in a sheet centrally deposited between monolayers forming the respective layers of the period. Each period includes 5 to 15 monolayers deposited in the two layers in a numerical ratio corresponding to a cation compositional ratio in the compound semiconductor. Low growth temperatures, e.g. ranging from 410.degree. to 450.degree. C. lead to mirror-like surfaces. For a compound semiconductor Ga.sub.0.47 In.sub.0.53 As, the GaAs/InAs ordered superlattices with eight monolayers per period are grown in a ratio of 0.47/0.53. At free carrier concentrations of 10.sup.16 cm.sup. -3, carrier mobilities of 200 and 2300 cm.sup.2 /Vs for p-type and n-type are obtained with carbon as the amphoteric dopant.
    • 本发明体现了包含III-V族化合物半导体的p-n结器件,其中通过选择性掺杂有选自碳,锗和硅树脂的两性IV族元素掺杂剂的超晶格形成p或n或者p和n区。 超晶格包括多个周期,每个周期包括两个层。 根据导电类型,形成所述导电类型的超晶格区域的周期中只有一个层选择性地掺杂有所述掺杂剂,在这些时间段内不再掺杂另一层。 超晶格是通过分子束外延技术形成的,并且掺杂剂通过δ-掺杂结合到相应的层中,如在中间沉积在形成该周期的各个层的单层之间的薄片中。 每个周期包括以对应于化合物半导体中的阳离子组成比的数​​值比在两层中沉积的5至15个单层。 低生长温度,例如 范围从410°至450°C,导致镜面状。 对于化合物半导体Ga 0.47 In 0.53As,以每个周期8个单层的GaAs / InAs有序超晶格以0.47 / 0.53的比例生长。 在1016cm -3的自由载流子浓度下,以碳为两性掺杂剂获得p型和n型的载流子迁移率为200和2300cm2 / Vs。