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    • 2. 发明授权
    • Relative humidity sensor with integrated signal conditioning
    • 具有集成信号调理功能的相对湿度传感器
    • US06724612B2
    • 2004-04-20
    • US10192451
    • 2002-07-09
    • Richard A. DavisSteve R. FooteRon FosterRichard A. Kirkpatrick, II
    • Richard A. DavisSteve R. FooteRon FosterRichard A. Kirkpatrick, II
    • H01G438
    • G01D5/24G01N27/225
    • Methods of and systems providing high reliability relative humidity sensors having integrated signal conditioning are described, providing a series capacitive circuit including a humidity-sensitive dielectric, a common top plate and first and second bottom plates associated with a first and second capacitor, respectively. Changes in humidity affect the humidity-sensitive dielectric thereby causing changes in the capacitive value of said series capacitive circuit. The system includes a common top plate; a common humidity-sensitive dielectric formed under said common top plate; a first series capacitor Cx1 including a first bottom plate formed under said common humidity-sensitive dielectric opposite said common top plate; a second series capacitor Cx2 including a second bottom plate formed under said common humidity-sensitive dielectric opposite said common top plate; wherein said first series capacitor Cx1 and said second series capacitor Cx2 commonly share said dielectric and commonly share said common top plate and are arranged in a series capacitor circuit configuration within a semiconductor system. A sampling voltage source can provide a fixed voltage through said series capacitive circuit.
    • 描述了提供具有集成信号调理的高可靠性相对湿度传感器的方法和系统,其分别提供包括与第一和第二电容器相关联的湿度敏感电介质,公共顶板以及第一和第二底板的串联电容电路。 湿度的变化影响湿敏电介质,从而引起所述串联电容电路的电容值的变化。 该系统包括一个共同的顶板; 形成在所述公共顶板下方的共同的湿度敏感电介质; 第一串联电容器Cx1,包括形成在与所述公共顶板相对的所述公共温度敏感电介质下方的第一底板; 第二串联电容器Cx2,包括形成在与所述公共顶板相对的所述公共温度敏感电介质下方的第二底板; 其中所述第一串联电容器Cx1和所述第二串联电容器Cx2共同共享所述电介质并共同共享所述公共顶板并且被布置在半导体系统内的串联电容器电路配置中。 采样电压源可以通过所述串联电容电路提供固定电压。