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    • 1. 发明授权
    • Interconnection device for connecting test equipment with a circuit
board designed for fine pitch solder lead integrated circuit components
    • 用于将测试设备连接到电路板的互连设备,用于精细节距焊丝集成电路组件
    • US5418469A
    • 1995-05-23
    • US343842
    • 1994-11-23
    • Leonard TurnerMark TroboughAshok KabadiRon Flamm
    • Leonard TurnerMark TroboughAshok KabadiRon Flamm
    • G01R1/073G01R31/00
    • G01R1/07328Y10S439/912
    • An apparatus and method for reliably interconnecting a test device with a circuit board designed for fine pitch solder lead surface mounted components is described. The test equipment interface system of the present invention includes a board interconnect unit, an interposer, and a test device cable. The test device cable is coupled to a test device, which can receive and manipulate signals via the cable. These signals correspond to signals provided by a component being emulated by the present invention. A component being emulated is replaced on the circuit board by the board interconnect unit. The board interconnect unit has leads or pins in a quantity, size, and configuration corresponding to a component being emulated and is typically soldered to a circuit board under test for the purpose of analyzing and debugging the circuitry on the circuit board. The board interconnect unit features a lead frame which is attached to a metal body. The lead frame is used to route or convert the pins into an array of contact pads. The contact pads are relatively widely spaced for better access to and connection with an array of electrically conductive spring pins or contact pins of the interposer. Because the lead frame converts the fine dimension pins to a more widely spaced array of contact pads, the corresponding spring pins of the interposer do not have to be manufactured with the precise dimensional tolerances required for the manufacture of the pins.
    • 描述了一种用于将测试装置与设计用于细间距焊料引线表面安装部件的电路板可靠地互连的装置和方法。 本发明的测试设备接口系统包括板互连单元,插入器和测试设备电缆。 测试设备电缆耦合到可以经由电缆接收和操纵信号的测试设备。 这些信号对应于由本发明仿真的部件提供的信号。 正在仿真的部件由电路板互连单元在电路板上替换。 电路板互连单元具有对应于正在仿真的部件的数量,尺寸和配置的引线或引脚,并且通常被焊接到被测电路板,以分析和调试电路板上的电路。 电路板互连单元具有连接到金属体的引线框架。 引线框架用于将引脚路由或转换为接触焊盘阵列。 接触垫相对较宽地间隔开,以便更好地接触和连接插入件的导电弹簧销或接触针阵列。 因为引线框架将精细尺寸的引脚转换成更广泛间隔的接触焊盘阵列,因此插入器的相应弹簧销不必以制造引脚所需的精确尺寸公差制造。
    • 2. 发明授权
    • Heatsink retention apparatus
    • 散热器固定装置
    • US06829143B2
    • 2004-12-07
    • US10251673
    • 2002-09-20
    • Mark C. RussellRon Flamm
    • Mark C. RussellRon Flamm
    • H05K720
    • H01L23/4006H01L2924/0002H01L2924/00
    • Some disclosed embodiments include a retention apparatus having a unidirectional locking member, the unidirectional locking member defining a bore therethrough, a post disposed through the bore of the unidirectional locking member, wherein the post is adapted to be secured to a support base, and a spring adapted to bias the unidirectional locking member against a device to be retained, wherein the unidirectional locking member is adapted to allow movement of the device in a first direction and to inhibit movement of the device in a second direction opposite to the first direction. The retention apparatus may be used to maintain contact between a heatsink and a processor on a motherboard. Other embodiments are disclosed and claimed.
    • 一些公开的实施例包括具有单向锁定构件的保持装置,单向锁定构件限定穿过其中的孔;穿过单向锁定构件的孔设置的柱,其中柱适于固定到支撑基座,弹簧 适于将所述单向锁定构件偏压抵靠待保持的装置,其中所述单向锁定构件适于允许所述装置沿第一方向移动并且阻止所述装置沿与所述第一方向相反的第二方向运动。 保持装置可以用于保持散热器和母板上的处理器之间的接触。 公开和要求保护其他实施例。
    • 3. 发明授权
    • Interconnection device for connecting test equipment with a circuit
board designed for fine pitch solder lead integrated circuit components
    • 用于将测试设备连接到电路板的互连设备,用于精细节距焊丝集成电路组件
    • US5594356A
    • 1997-01-14
    • US382295
    • 1995-02-01
    • Leonard TurnerMark TroboughAshok KabadiRon Flamm
    • Leonard TurnerMark TroboughAshok KabadiRon Flamm
    • G01R1/073G01R31/02
    • G01R1/07328Y10S439/912
    • An apparatus and method for reliably interconnecting a test device with a circuit board designed for fine pitch solder lead surface mounted components is described. The test equipment interface system of the present invention comprises a board interconnect unit, an interposer, and a test device cable. The test device cable is coupled to a test device, which can receive and manipulate signals via the cable. These signals correspond to signals provided by a component being emulated by the present invention. A component being emulated is replaced on the circuit board by the board interconnect unit. The board interconnect unit has leads or pins in a quantity, size, and configuration corresponding to a component being emulated and is typically soldered to a circuit board under test for the purpose of analyzing and debugging the circuitry on the circuit board. The board interconnect unit comprises a lead frame which is attached to a metal body. The lead frame is used to route or convert the pins into an array of contact pads. The contact pads are relatively widely spaced for better access to and connection with an array of electrically conductive spring pins or contact pins of the interposer. Because the lead frame converts the fine dimension pins to a more widely spaced array of contact pads, the corresponding spring pins of the interposer do not have to be manufactured with the precise dimensional tolerances required for the manufacture of the pins.
    • 描述了一种用于将测试装置与设计用于细间距焊料引线表面安装部件的电路板可靠地互连的装置和方法。 本发明的测试设备接口系统包括板互连单元,插入器和测试设备电缆。 测试设备电缆耦合到可以经由电缆接收和操纵信号的测试设备。 这些信号对应于由本发明仿真的部件提供的信号。 正在仿真的部件由电路板互连单元在电路板上替换。 电路板互连单元具有对应于正在仿真的部件的数量,尺寸和配置的引线或引脚,并且通常被焊接到被测电路板,以分析和调试电路板上的电路。 板互连单元包括附接到金属体的引线框架。 引线框架用于将引脚路由或转换为接触焊盘阵列。 接触垫相对较宽地间隔开,以便更好地接触和连接插入件的导电弹簧销或接触针阵列。 因为引线框架将精细尺寸的引脚转换成更广泛间隔的接触焊盘阵列,因此插入器的相应弹簧销不必以制造引脚所需的精确尺寸公差制造。