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1. 发明申请

US20110198738A1 METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING AT LEAST ONE MICROELECTRONIC DEVICE 有权
标题翻译：用于制造包含最小一个微电子器件的微电子封装的方法
公开(公告)号：US20110198738A1
公开(公告)日：2011-08-18
申请号：US13124198
申请日：2009-10-16
申请人： Peter WIilhelmus Maria Van De Water , Paulus Martinus Catharina Hesen , Roelf Anco Jacob Groenhuis
发明人： Peter WIilhelmus Maria Van De Water , Paulus Martinus Catharina Hesen , Roelf Anco Jacob Groenhuis
IPC分类号： H01L23/495 , H01L21/60 , H01L21/56 , H01L21/78
CPC分类号： H01L23/49562 , H01L21/561 , H01L23/3135 , H01L24/97 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/15747 , H01L2924/00
摘要： A method for manufacturing a microelectronic package (1) comprises the steps of providing at least two members (10, 11, 16) comprising electrically conductive material; providing a microelectronic device (15); placing the electrically conductive members (10, 11, 16) and the microelectronic device (15) in predetermined positions with respect to each other, and establishing electrical connections between each of the electrically conductive members (10, 11, 16) and the microelectronic device (15); and providing a non-conductive material for encapsulating the microelectronic device (15) and a portion of the electrically conductive members (10, 11, 16) connected thereto. The electrically conductive members (10, 11, 16) are intended to be used for realizing contact of the microelectronic device (15) arranged inside the package (1) to the external world. An important advantage of the method having steps as mentioned is that the electrically conductive members (10, 11, 16) as such are provided, wherein it is not necessary to provide a conventional lead frame which has the disadvantage of causing considerable waste of material during its manufacturing process.
摘要翻译：一种制造微电子封装（1）的方法包括以下步骤：提供包括导电材料的至少两个构件（10,11,16）; 提供微电子器件（15）; 将导电构件（10,11,16）和微电子器件（15）相对于彼此放置在预定位置，并且在每个导电构件（10,11,16）和微电子器件之间建立电连接（15）; 以及提供用于封装微电子器件（15）的非导电材料和连接到其上的导电构件（10,11,16）的一部分。导电构件（10,11,16）旨在用于实现布置在封装（1）内部的微电子器件（15）与外部世界的接触。具有所述步骤的方法的一个重要优点是提供了这样的导电构件（10,11,16），其中不需要提供常规的引线框架，其缺点是在其制造工艺。

2. 发明授权

US07858444B2 Electronic device and method of manufacturing thereof 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US07858444B2
公开(公告)日：2010-12-28
申请号：US12391064
申请日：2009-02-23
申请人： Cornelis Gerardus Schriks , Paul Dijkstra , Peter Wilhelmus Maria Van De Water , Roelf Anco Jacob Groenhuis , Johannus Wilhelmus Weekamp
发明人： Cornelis Gerardus Schriks , Paul Dijkstra , Peter Wilhelmus Maria Van De Water , Roelf Anco Jacob Groenhuis , Johannus Wilhelmus Weekamp
IPC分类号： H01L23/02 , H01L23/28
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/486 , H01L23/3107 , H01L23/49827 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L2221/68377 , H01L2224/05571 , H01L2224/05573 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13144 , H01L2224/16 , H01L2924/00013 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15173 , H01L2924/15313 , H01L2924/18301 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.
摘要翻译：该装置具有载体和电气元件。载体具有第一和相对侧，并且设置有连接层，中间层和接触垫。元件存在于第一侧并且耦合到连接层。它至少部分地被封装延伸到中间层中的图案之间的隔离区域中。保护层存在于载体的第二侧，其覆盖接触垫和中间层之间的界面。

3. 发明申请

US20120181678A1 LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY 有权
标题翻译：无铅芯片运输车具有改进的安全性
公开(公告)号：US20120181678A1
公开(公告)日：2012-07-19
申请号：US13007538
申请日：2011-01-14
申请人： Roelf Anco Jacob GROENHUIS , Markus Björn Erik NOREN , Fei-ying WONG , Hei-ming SHIU
发明人： Roelf Anco Jacob GROENHUIS , Markus Björn Erik NOREN , Fei-ying WONG , Hei-ming SHIU
IPC分类号： H01L23/495 , H01L21/66 , H01L23/48
CPC分类号： H01L23/49562 , H01L21/4825 , H01L21/4842 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/78 , H01L22/14 , H01L23/3107 , H01L23/3114 , H01L23/49513 , H01L23/49537 , H01L23/49548 , H01L23/49582 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/48599 , H01L2224/73265 , H01L2224/83805 , H01L2224/83855 , H01L2224/83913 , H01L2224/85913 , H01L2224/97 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2224/85 , H01L2224/83 , H01L2224/48227 , H01L2924/00012 , H01L2224/4554
摘要： Consistent with an example embodiment, there is surface-mountable non-leaded chip carrier for a semiconductor device. The device comprises a first contact. A second contact is relative to the first contact; the second contact has a split therein to provide first and second portions of the second contact arranged relative to one another to lessen tilting of a soldering condition involving attachment of the chip carrier to a printed circuit board.
摘要翻译：与示例性实施例一致，存在用于半导体器件的可表面安装的非引线芯片载体。该装置包括第一接触件。第二个触点相对于第一个触点; 第二接触件在其中分开，以提供相对于彼此布置的第二接触件的第一和第二部分，以减少包括将芯片载体附接到印刷电路板的焊接条件的倾斜。

4. 发明授权

US08183682B2 Methods of packaging a semiconductor die and package formed by the methods 失效
标题翻译：封装半导体芯片和封装形成方法
公开(公告)号：US08183682B2
公开(公告)日：2012-05-22
申请号：US12092126
申请日：2006-10-27
申请人： Paul Dijkstra , Roelf Anco Jacob Groenhuis
发明人： Paul Dijkstra , Roelf Anco Jacob Groenhuis
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/32 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/41 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1319 , H01L2224/16245 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/37147 , H01L2224/40245 , H01L2224/4103 , H01L2224/73253 , H01L2224/73263 , H01L2224/83801 , H01L2224/83851 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/181 , Y10T29/4913 , H01L2924/00014 , H01L2924/00
摘要： A method of packaging a semiconductor die. The method comprises mounting a semiconductor die to a die attach pad on a carrier and electrically coupling an electrode of the semiconductor die and a contact pad on the carrier with a clip carried by a sacrificial substrate. The method further comprises removing the sacrificial substrate to release the clip. The method may be extended to accommodate a carrier having multiple device regions each with a die attach pad and a contact pad for mounting multiple semiconductor die.
摘要翻译：一种封装半导体管芯的方法。该方法包括将半导体管芯安装到载体上的管芯附着焊盘上，并用牺牲基板承载的夹子电连接半导体管芯的电极和载体上的接触焊盘。该方法还包括去除牺牲基板以释放夹子。该方法可以被扩展以容纳具有多个器件区域的载体，每个器件区域具有管芯附接焊盘和用于安装多个半导体管芯的接触焊盘。

5. 发明申请

US20080272475A1 Air Cavity Package for a Semiconductor Die and Methods of Forming the Air Cavity Package 有权
标题翻译：用于半导体模具的空气腔封装和形成空气腔封装的方法
公开(公告)号：US20080272475A1
公开(公告)日：2008-11-06
申请号：US12092121
申请日：2006-10-27
申请人： Paul Dijkstra , Roelf Anco Jacob Groenhuis
发明人： Paul Dijkstra , Roelf Anco Jacob Groenhuis
IPC分类号： H01L23/20 , H01L21/56
CPC分类号： H01L23/055 , H01L21/4832 , H01L21/561 , H01L21/568 , H01L23/3135 , H01L23/315 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49175 , H01L2224/97 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A die package (72) for a semiconductor die (20). A plurality of the die packages (72) are formed on a single carrier (10) by applying a body (55) of molding compound across a carrier (10) with an air cavity (70) defined in the molding compound about each of a plurality of device regions (12) of the carrier (10). After a semiconductor die (20) is attached inside the air cavity (70) of each device region (12) and electrically connected with at least one contact pad (14, 16, 18), a cover (68) is applied to close all of the air cavities (70). Following singulation, each semiconductor die (20) is located inside the sealed air cavity (70) of one die package (72). The molding compound of each die package (72) may be locked against movement relative to the device region (12) of the carrier (10) by locking features (30, 38, 48, 50). The locking features (30, 38, 48, 50) may constitute portions of contact pads (14, 16, 18) used to establish electrical communication paths from the semiconductor die (20) to the environment outside of the package (72).
摘要翻译：一种用于半导体管芯（20）的管芯封装（72）。多个模具封装（72）通过将模制化合物的主体（55）施加到载体（10）上而形成在单个载体（10）上，空腔（70）限定在模制化合物中，载体（10）的多个装置区域（12）。在半导体管芯（20）被安装在每个器件区域（12）的空气腔（70）内并且与至少一个接触焊盘（14,16,18）电连接之后，施加盖子（68）以关闭所有的空气（70）。在单片化之后，每个半导体管芯（20）位于一个管芯封装（72）的密封空气腔（70）的内部。通过锁定特征（30,38,48,50），每个模具包装（72）的模制化合物可被锁定以防止相对于载体（10）的装置区域（12）移动。锁定特征（30,38,48,50）可以构成用于建立从半导体管芯（20）到封装（72）外部的环境的电连通路径的接触焊盘（14,16,18）的部分。

6. 发明申请

US20120286399A1 LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE 审中-公开
标题翻译：用于包装半导体器件的引线框和方法
公开(公告)号：US20120286399A1
公开(公告)日：2012-11-15
申请号：US13466926
申请日：2012-05-08
申请人： Tim BOETTCHER , Sven WALCZYK , Fei-Ying WONG , Pompeo UMALI , Roelf Anco Jacob GROENHUIS , Bernd ROHRMOSER , ChiFai LEE , Markus Bjoern Erik NOREN , PaulPangHing TSANG
发明人： Tim BOETTCHER , Sven WALCZYK , Fei-Ying WONG , Pompeo UMALI , Roelf Anco Jacob GROENHUIS , Bernd ROHRMOSER , ChiFai LEE , Markus Bjoern Erik NOREN , PaulPangHing TSANG
IPC分类号： H01L23/495 , H01L23/544 , H01L21/56
摘要： In one embodiment, a method is provided for packaging a semiconductor die. A leadframe having a die-pad and one or more lead-pads is placed (502) on an assembly surface. The die-pad has a base portion (202) resting on the assembly surface, an upper portion (204) on the base portion extending laterally from the base portion, and a support arm (208) extending from and supporting the upper portion of die-pad. A semiconductor die (206) is wirebonded (504) to a top surface of the upper portion of the die-pad. The semiconductor die is wirebonded (506) to the one or more lead-pads (210). The semiconductor die and leadframe are encased (508) in a package material (802). The package material fills a space between the upper portion of the die-pad and the assembly surface. A portion of the support arm located in a cutting lane is removed (512).
摘要翻译：在一个实施例中，提供了一种用于封装半导体管芯的方法。具有芯片焊盘和一个或多个引线焊盘的引线框架（502）放置在组件表面上。所述模垫具有搁置在所述组装表面上的基部（202），所述基部上的从所述基部侧向延伸的上部（204）和从所述基部延伸并支撑所述模具的上部的支撑臂（208） -垫。将半导体管芯（206）引线接合（504）到芯片焊盘的上部的顶表面。半导体管芯是引线键合（506）到一个或多个引线焊盘（210）。半导体管芯和引线框架（508）封装在封装材料（802）中。包装材料填充模片的上部和组装表面之间的空间。移除位于切割车道中的支撑臂的一部分（512）。

7. 发明申请

US20120112351A1 SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE 审中-公开
标题翻译：半导体器件封装方法和半导体器件封装
公开(公告)号：US20120112351A1
公开(公告)日：2012-05-10
申请号：US13293016
申请日：2011-11-09
申请人： Sven WALCZYK , Roelf Anco Jacob GROENHUIS , Paul Dijkstra , Emiel de BRUIN , Rolf Brenner
发明人： Sven WALCZYK , Roelf Anco Jacob GROENHUIS , Paul Dijkstra , Emiel de BRUIN , Rolf Brenner
IPC分类号： H01L23/48 , H01L21/78
CPC分类号： H01L21/78 , H01L23/3171 , H01L23/3178 , H01L2224/03464 , H01L2224/04026 , H01L2224/0558 , H01L2224/05655 , H01L2224/05666 , H01L2224/06181 , H01L2224/26145 , H01L2224/27013 , H01L2224/32225 , H01L2224/94 , H01L2924/10155 , H01L2924/12036 , H01L2924/1304 , H01L2224/03 , H01L2924/01028 , H01L2924/01047 , H01L2924/01079 , H01L2924/01046
摘要： Disclosed is a method of manufacturing a discrete semiconductor device package (100), comprising providing a wafer comprising a plurality of semiconductor devices (50), each of said semiconductor devices comprising a substrate (110) having a top contact (130) and a bottom contact (150); partially sawing said wafer with a first sawing blade such that the semiconductor devices are partially separated from each other by respective incisions (20); lining said incisions with an electrically insulating film (160); and sawing through said incisions with a second sawing blade such that the semiconductor devices are fully separated from each other. A resulting discrete semiconductor device package (100) and a carrier (200) comprising such a discrete semiconductor device package (100) are also disclosed.
摘要翻译：公开了一种制造分立半导体器件封装（100）的方法，包括提供包括多个半导体器件（50）的晶片，每个所述半导体器件包括具有顶部触点（130）和底部接触（150）; 用第一锯刀部分地锯切所述晶片，使得半导体器件通过相应的切口（20）部分地彼此分离; 用电绝缘膜（160）衬里所述切口; 并且通过所述切口用第二锯切刀锯切，使得所述半导体器件彼此完全分离。还公开了分立半导体器件封装（100）和包括这种分立半导体器件封装（100）的载体（200）。

8. 发明授权

US07944062B2 Air cavity package for a semiconductor die and methods of forming the air cavity package 有权
标题翻译：用于半导体管芯的气腔封装和形成空气腔封装的方法
公开(公告)号：US07944062B2
公开(公告)日：2011-05-17
申请号：US12092121
申请日：2006-10-27
申请人： Roelf Anco Jacob Groenhuis , Paul Dijkstra
发明人： Roelf Anco Jacob Groenhuis , Paul Dijkstra
IPC分类号： H01L23/28
CPC分类号： H01L23/055 , H01L21/4832 , H01L21/561 , H01L21/568 , H01L23/3135 , H01L23/315 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49175 , H01L2224/97 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A die package (72) for a semiconductor die (20). A plurality of the die packages (72) are formed on a single carrier (10) by applying a body (55) of molding compound across a carrier (10) with an air cavity (70) defined in the molding compound about each of a plurality of device regions (12) of the carrier (10). After a semiconductor die (20) is attached inside the air cavity (70) of each device region (12) and electrically connected with at least one contact pad (14, 16, 18), a cover (68) is applied to close all of the air cavities (70). Following singulation, each semiconductor die (20) is located inside the sealed air cavity (70) of one die package (72). The molding compound of each die package (72) may be locked against movement relative to the device region (12) of the carrier (10) by locking features (30, 38, 48, 50). The locking features (30, 38, 48, 50) may constitute portions of contact pads (14, 16, 18) used to establish electrical communication paths from the semiconductor die (20) to the environment outside of the package (72).
摘要翻译：一种用于半导体管芯（20）的管芯封装（72）。多个模具封装（72）通过将模制化合物的主体（55）施加到载体（10）上而形成在单个载体（10）上，空腔（70）限定在模制化合物中，载体（10）的多个装置区域（12）。在半导体管芯（20）被安装在每个器件区域（12）的空气腔（70）内并且与至少一个接触焊盘（14,16,18）电连接之后，施加盖子（68）以关闭所有的空气（70）。在单片化之后，每个半导体管芯（20）位于一个管芯封装（72）的密封空气腔（70）的内部。通过锁定特征（30,38,48,50），每个模具包装（72）的模制化合物可被锁定以防止相对于载体（10）的装置区域（12）移动。锁定特征（30,38,48,50）可以构成用于建立从半导体管芯（20）到封装（72）外部的环境的电连通路径的接触焊盘（14,16,18）的部分。

9. 发明授权

US07247938B2 Carrier, method of manufacturing a carrier and an electronic device 有权
标题翻译：载体，制造载体和电子装置的方法
公开(公告)号：US07247938B2
公开(公告)日：2007-07-24
申请号：US10510588
申请日：2003-04-10
申请人： Roelf Anco Jacob Groenhuis , Paul Dijkstra , Cornelis Gerardus Schriks , Peter Wilhelmus Maria Van De Water
发明人： Roelf Anco Jacob Groenhuis , Paul Dijkstra , Cornelis Gerardus Schriks , Peter Wilhelmus Maria Van De Water
IPC分类号： H01L23/04
CPC分类号： H05K3/062 , A23G3/366 , A23G4/123 , A23L33/135 , A23Y2220/77 , A61K35/747 , C12R1/225 , H01L21/4828 , H01L21/4832 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/1305 , H01L2924/14 , H01L2924/181 , H05K1/185 , H05K2201/0361 , H05K2203/0384 , H05K2203/1469 , H05K2203/1476 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The carrier (30) comprises a first etch mask (14), a first metal layer (11), an intermediate layer (12), a second metal layer (13) and a second etch mask (17). Both the first and the second etch mask (14, 17) can be provided in one step by means of electrochemical plating. After the first metal layer (11) and the intermediate layer (12) have been patterned through the first etch mask (14), an electric element (20) can be suitably attached to the carrier (30) using conductive means. In this patterning operation, the intermediate layer (12) is etched further so as to create underetching below the first metal layer (11). After the provision of an encapsulation (40), the second metal layer (13) is patterned through the second etch mask (17). In this manner, a solderable device (10) is obtained without a photolithographic step during the assembly process.
摘要翻译：载体（30）包括第一蚀刻掩模（14），第一金属层（11），中间层（12），第二金属层（13）和第二蚀刻掩模（17）。可以通过电化学电镀在一个步骤中提供第一和第二蚀刻掩模（14,17）。在通过第一蚀刻掩模（14）对第一金属层（11）和中间层（12）进行了图案化之后，可以使用导电装置将电气元件（20）适当地附接到载体（30）。在该图案化操作中，进一步蚀刻中间层（12），以便在第一金属层（11）的下面产生不规则的凹凸。在提供封装（40）之后，第二金属层（13）通过第二蚀刻掩模（17）构图。以这种方式，在组装过程中获得无可光刻步骤的可焊接装置（10）。

10. 发明授权

US07022588B2 Method of manufacturing an electronic component and electronic component obtained by means of said method 有权
标题翻译：通过所述方法获得的制造电子部件和电子部件的方法
公开(公告)号：US07022588B2
公开(公告)日：2006-04-04
申请号：US10492334
申请日：2002-10-08
申请人： Johan Bosman , Peter Wilhelmus Maria Van De Water , Roelf Anco Jacob Groenhuis
发明人： Johan Bosman , Peter Wilhelmus Maria Van De Water , Roelf Anco Jacob Groenhuis
IPC分类号： H01L21/268
CPC分类号： H01L21/6836 , H01L23/544 , H01L2221/68327 , H01L2223/54406 , H01L2223/54473 , H01L2223/5448 , H01L2924/0002 , Y10S438/975 , H01L2924/00
摘要： The invention relates to a method of manufacturing an electronic component (1), in particular a semiconductor component (1), which is provided with electric connection regions (2), wherein a mark (M), such as a type number, is provided on a surface thereof by means of laser radiation (3).In a method according to the invention, the component (1) is attached with one (4) of its sides (4, 7) to a foil (5) by means of an adhesive layer (6), and the component is provided, on said side (4), with the mark (M) through the foil (5) and the adhesive layer (6). In this manner, a large number of components (1) can be readily provided with a mark (M) without undue handling, and the marking operation can be readily integrated in the complete manufacturing process of the components. Surprisingly it has been found that marking through a radiation-absorbing double layer (5, 6) is very well feasible. The component (1) can be attached to the foil (6) without contact between the electric connection region (2) and the adhesive layer. Preferably, a large number of components (1) are manufactured simultaneously and within a single body (10) that is attached to the foil (5). After the provision of the mark (M), the components (1) are separated from each other.
摘要翻译：本发明涉及一种制造电子部件（1）的方法，特别是具有电连接区域（2）的半导体部件（1）的制造方法，其中提供诸如型号的标记（M）在其表面上通过激光辐射（3）。在根据本发明的方法中，组件（1）通过粘合剂层（6）与其一个（4）侧面（4,7）连接到箔片（5）上，并且提供该部件，在所述一侧（4）上，通过箔（5）和粘合剂层（6）标记（M）。以这种方式，大量的部件（1）可以容易地设置有标记（M），而不会过度的处理，并且标记操作可以容易地集成在部件的完整制造过程中。令人惊奇的是，已经发现通过吸收辐射的双层（5,6）进行标记是非常可行的。组件（1）可以在电连接区域（2）和粘合剂层之间没有接触的情况下附接到箔片（6）。优选地，同时制造大量的部件（1）并且在附接到箔片（5）的单个主体（10）内。在提供标记（M）之后，组件（1）彼此分离。

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