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    • 2. 发明授权
    • Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
    • 可互换的加强框架,具有宽度楔形锁,用于电路卡模块
    • US06246582B1
    • 2001-06-12
    • US09223288
    • 1998-12-30
    • Robert D. HabingThomas Allan Odegard
    • Robert D. HabingThomas Allan Odegard
    • H05K720
    • H05K7/1404H05K7/20545Y10T403/76
    • A circuit card module having increased cooling efficiency which comprises at least one printed wiring board (PWB), at least one component mounted on the PWB, a heatsink, an interchangeable frame, and a wedgelock for use with a chassis cold wall. One embodiment of the interchangeable frame comprises a protrusion so that it can be used with a convection-cooled chassis (fully compliant with IEEE 1101.2 Specifications). Another embodiment, for use with conduction-cooled chassis only (partially compliant with IEEE 1101.2 Specifications), is maximally efficient in removing heat as it does not include the protrusion. In the embodiment without the protrusion, the conduction contact area between the chassis cold wall and the frame is increased in width from approximately 0.25″ to approximately 0.35″. In either embodiment, the wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall. In addition, the wedgelock can be enlarged to increase the clamping force over the contact area. The increased wedgelock size approximately doubles the clamping force applied. The net effect of these improvements are a reduction in the thermal resistance per inch of wedgelock length. This, in turn, reduces the module to chassis interface temperature rise of an exemplary 40 W module from 8.3° C. to 4.15° C. The improved thermal resistances and decreased temperature rises boost the reliability of the circuit cards, particularly in the stringent environments experienced in military applications.
    • 具有提高的冷却效率的电路卡模块,其包括至少一个印刷线路板(PWB),安装在所述PWB上的至少一个部件,散热器,可互换框架和用于底盘冷壁的楔形锁定件。 可互换框架的一个实施例包括突起,使得其可以与对流冷却的底盘一起使用(完全符合IEEE 1101.2规范)。 仅用于传导冷却的底盘(部分符合IEEE 1101.2规范)的另一个实施例在除了突起之外最大限度地有效地去除热量。 在没有突起的实施例中,底盘冷壁和框架之间的导电接触面积的宽度从大约0.25“增加到大约0.35”。 在任一实施例中,楔形锁定件安装在框架的一个表面上,使得当安装在传导冷却的底盘中时,相对的框架表面被迫抵靠底盘冷壁。 此外,可以扩大楔形锁,以增加接触面积上的夹紧力。 增加的楔形锁定尺寸使施加的夹紧力大约增加一倍。 这些改进的净效果是每英寸楔形锁定长度的热阻降低。 这反过来又将示例性的40W模块的模块的底盘接口温度从8.3°C降低到4.15°C。改善的热阻和降低的温度升高提高了电路卡的可靠性,特别是在严格的环境中 经验丰富的军事应用。
    • 3. 发明授权
    • Adapter kit to allow extended width wedgelock for use in a circuit card module
    • 适配器套件允许在电路卡模块中使用的扩展宽度楔形锁
    • US06212075B1
    • 2001-04-03
    • US09223289
    • 1998-12-30
    • Robert D. HabingThomas Allan Odegard
    • Robert D. HabingThomas Allan Odegard
    • H05K720
    • H05K7/20545H05K7/1404Y10T403/76
    • An adapter for commercial off-the-shelf (COTS) circuit card modules resulting in increased cooling efficiency. COTS circuit card modules generally have at least one printed wiring board (PWB), at least one component mounted on the PWB, a heatsink or some type of heat path, a frame for supporting the cards, and a wedgelock for use with a conduction-cooled chassis. The adapter increases the cooling efficiency of such COTS modules while allowing them to remain compliant with IEEE 1101.2 Specifications. The invention is efficient in removing heat from the COTS circuit card modules as it increases the conduction contact area between the chassis cold wall and the COTS module. In addition, the adapter allows for the use of an extended width wedgelock to increase the clamping force over the conduction contact area. The extended width wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall. The increased wedgelock size approximately doubles the clamping force applied. The net effect of these improvements are a reduction in the thermal resistance per inch of wedgelock length. This, in turn, reduces the module to chassis interface temperature rise. The improved thermal resistances and decreased temperature rises boost the reliability of the COTS circuit cards, particularly in the stringent environments experienced in military applications.
    • 用于商业现货(COTS)电路卡模块的适配器,从而提高冷却效率。 COTS电路卡模块通常具有至少一个印刷电路板(PWB),安装在PWB上的至少一个组件,散热器或某种类型的热路径,用于支撑卡的框架,以及用于与导电 - 冷却底盘。 适配器提高了这种COTS模块的冷却效率,同时允许它们保持符合IEEE 1101.2规范。 本发明有效地从COTS电路卡模块移除热量,因为它增加了底盘冷壁和COTS模块之间的导电接触面积。 此外,适配器允许使用扩展宽度楔形锁来增加在导电接触区域上的夹紧力。 扩展宽度楔形锁定件安装在框架的一个表面上,使得当安装在传导冷却的底盘中时,相对的框架表面被迫抵靠底盘冷壁。 增加的楔形锁定尺寸使施加的夹紧力大约增加一倍。 这些改进的净效果是每英寸楔形锁定长度的热阻降低。 这反过来又降低了模块到机箱接口的温度上升。 改善的热阻和降低的温度升高提高了COTS电路卡的可靠性,特别是在军事应用中经历的严格环境中。