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1. 发明专利

AU2014101380A4 SC-MH (The solar cube for micro-grid hub) 未知
公开(公告)号：AU2014101380A4
公开(公告)日：2015-01-15
申请号：AU2014101380
申请日：2014-11-14
申请人： TANG RICHARD ZHAO KUN MR
发明人： TANG RICHARD ZHAO KUN
IPC分类号： H02S10/12 , F03D1/00 , F03D3/00 , H01L31/00
摘要： Patent Application Abstract for Patent SC-MH (The solar cube for micro-grid hub) Abstract In the 21st century, mankind is faced with: Energy & resources are running out and climate change could lead to the extinction of overall life on earth which are profound & pressing danger mess & dilemma , Human urgent need no polluting no sequelae & carbon free also huge clean energy or called future energy. Earth humanity may have the opportunity to evolve into galactic civilization and even cosmic civilization, the invention patent for the future energies of humanity can survive to 210 centuries have provided a feasible solution. The basic defects of the photovoltaic silicon substrate cells for direct solar utilization are: the first one is the "heat induced bad", the second one is that the real working hours is very few, and the third one is that the photo-electricity conversion efficiency is very low. The basic defects of the WTG for indirect solar utilization are: the first one is the "wind induced bad" defects, second one is that the actual working hour is very short, and the third one is that the WTG generating power amount to transmit to grid is actually very small, and its true efficiency between 5-25% of the assert power also excessive depending on wind field condition. By combining the other two inventions of this invention's author, the M-PIN PVSC (Multiple PIN Composition Silicon PV Cells for Solar Concentrator) and the MGCTC (Multiplex Gradient Curve Trough Concentrator), Panel Of CPV-T-ATC(Panel Of Concentrator PV-thermal of System with Automatic temperature control)is constructed. It can eliminate the basic defects of PV silicon substrate cells. Not only the domestic hot water with about 50 "C can be supplied, but also the best photo-electricity conversion efficiency can be increased over 50% because the M-PIN SPVSC cells can work in the optimum working temperature between 60 to 70 'C besides winter. This invention Integrates the PV new technology and the IWTS (Innovation wind turbines systems) wind energy new technology which has breakthrough improvements. It can provide a high quality electrical energy with stable amount of total annual hours and provide a clean hydrogen-based energy, which can provide a feasible choice for environment-friendly basic energy. [01] According to this invention's claims in items [0002] to [ 0014 ] & [0027]. [01.1] Based on the "electricity damper multiplier effect" , the IWTS (Innovative wind turbines systems) rated power running entry point can be designed in a very low wind speed range, and the rated power running exit point of the IWTS can be designed in a very high wind speed range. Thus, the WTG operation range with wind speed change can be expanded several times. [01.2] Based on that the"electricity damper multiplier effect" can cause the double variable-speed control device of the IWTS to respond properly to adapt wind speed change, the rated power operation range of IWTS can be expanded several times. [01.3] Because the rated power operation range of IWTS can be expanded several times, the Mr. (Richard) Zhao Kun TANG / Add: NO. 68 Famell St. WestRyde NSW 2114 Mail: austangcn(amail.com/hotmailcom Mobile: (Australia) 0404248933/ (China) 0086-13816709498 Patent Application amount of the annual operating hours of wind power generator rated power can also be expanded several times. [01.4] Based on that the "electricity damper multiplier effect" will cause the double variable-speed control device of the IWTS to respond properly to adapt wind speed change, the amount of the annual operating hours of IWTS will be higher than the total amount of the full year hours by 80%. [01.5] Based on that the "electricity damper multiplier effect" can cause the double variable-speed control device of the IWTS to respond properly to adapt wind speed change, the greater design freedom about entry point and exit point of IWTS operation possible there is. Thus the excessive dependence on the IWTS wind field will be greatly reduced. It caused the widespread installation of IWTS possible [02] According to this invention's claims in items [0023] [0025 ]& [0027 ] to [ 0036]. [02.1] Based on a combination system of the solar PV cell and the IWTS system, when there are sufficient compression hydrogen storages, the SC-MH (The solar cube for micro-grid hub) system can become a stable microgrid hub. [02.2] By using the system of this invention, it is possible to build up solar panel and IWTS combination systems on roof of dwelling, to electrolyze water to produce hydrogen, and then to combine the hydrogen fuel cell and inverter. And thus it is possible to construct a microgrid hub which is complementary, at day and night also shine and rain, stable and with the total amount of annual hours of rated power supply. also it can be achieved 5-50 KW. [02.3] By using the system of this invention, it is possible to build up solar panel and IWTS combination systems in farms, small towns and offshore islands, to electrolyze water to produce hydrogen, and to work with combined cycle gas turbine generator sets. And thus it is possible to construct a microgrid hub which is complementary, at day and night also shine and rain, stable and with the total amount of annual hours of rated power supply. [02.4] By using the system of this invention, it is possible to build up solar panel and IWTS combination systems on the two sides of the high way, to electrolyze water to produce hydrogen, and to work with combined cycle gas turbine generator sets. And thus it is possible to construct a main electricity power supply plant which is complementary, at day and night also shine and rain, stable and with the total amount of annual hours of rated power supplyalso it can be achieved 5-20 k - KW Per km. [03] According to this invention's claims in items [0014], [0015] & [0044] [03.1] Based on the "electricity damper multiplier effect " , which can normally electrolyze water to produce hydrogen in every wind speed range and with any wind speed change, it is possible to completely utilize wind energy and also generate large amount of hydrogen. And thus this provides the basis for in-depth development of clean hydrogen -based fuels. Mr. (Richard) Zhao Kun TANG / Add: NO. 68 Farnell St. WestRyde NSW 2114 Mail: austangcnQgmail.com/hotmail.com Mobile: (Australia) 0404248933 / (China) 0086-13816709498 Patent Application [03.2] By using the system of this invention, it is possible to convert present gas stations to the solar panel and WTG combination systems, to electrolyze water to produce hydrogen, and to production of hydrogen -based fuels. And thus electricity and fuel can be supplied local solutions. [04] According to this invention's claims in items [0038]-[0040] [04.1] Based on this invention, it is possible to build up solar panels and IWTS combination systems, to electrolyze water to produce hydrogen, and to work with combined cycle gas turbine generator sets. The available heat of generators can utilized to produce local hot water and heating steam. [04.2] Based on this invention, it is possible to build up solar photovoltaic cell and wind power generator combination systems, to produce hydrogen, and to work with combined cycle gas turbine generator sets. The available heat of generators can be utilized to produce hot water and steam for vegetable growing greenhouses and livestock-raisings local solutions in winter. [05] According to this invention's claims in items [0046] to [ 0052 ] [05.1] According to the preliminary calculation, the return on investment efficiency of the M-PIN PVSC with the MGCTC and effective automatic temperature control, which is invented also by this invention author, is five to ten times higher than one of the present silicon substrate solar cells. [05.2] According to the preliminary calculation, the investment return efficiency of this invention's cube solar energy utilization, which is a clean energy conversion system combining the photovoltaic new technology and the wind energy greatly improving technology, is two to six times higher than the one of present WTG. Fossil energy exhausting, environment pollution and excessive greenhouse gas emission are bring the Earth, the home of human-being, to destruction. The current green energy development is inseparable from overzealous government subsidies, but provides a malicious development opportunity for the green rogues. This invention is intended to provide a possible choice to completely reduce the cost of solar energy utilization and the feasibility to completely utilize solar energy as a basic energy. The "golden sunshine" will go from the lyrics into the life of modern human being. Mr. (Richard) Zhao Kun TANG / Add: NO. 68 Farell St. WestRyde NSW 2114 Mail: Atangenpgmail.com/hotmail.com : Mobile: (Australia) 0404248933 / (China) 0086-13816709498 Patent Application Graph33 for diagram & Note 34 Graph34 for diagram & Note 34 Mr. (Richard) Zhao Kun TANG/ Add: NO. 68 Faell St WestRyde NSW 2114 Mail: austangcn .mail. com/hotmail comn 80 Mobile: (Australia) 040424R933 (China) 0086-13816709498

2. 发明专利

AU2012101765A4 M-PIN-SPVSC (Multiple PIN Composition Silicon Super PV Cells for Solar Concentrator) 未知
公开(公告)号：AU2012101765A4
公开(公告)日：2013-05-02
申请号：AU2012101765
申请日：2012-12-03
申请人： TANG RICHARD ZHAO KUN MR
发明人： TANG RICHARD ZHAO KUN
IPC分类号： H01L31/00
摘要： A semiconductor material which has relatively wide band-gap and efficient broad spectrum solar radiation absorption, is low doped as a substrate strip. After considering the adaptation, which is related to Ec & Ev, the crystal lattice mismatch & eutectic point and thermal expansion data, and also practicability and process conditions, a proper semiconductor material B with narrow band-gap can be selected. It is highly doped as N-type and P* type and cladding as an ultra-fine wire sieve, and then integrate with upper and bottom surfaces of the substrate. On two sides of this substrate, there are permanent strong magnetic strips. Patent Application Spectral Response Characteristics of Solar Cell GaAs 1F c $ - 140 o 4 -- 60 tO 40 300 400 500 600 700 800 900 1000 1100 1200 AA Wavlength (nm) Graph7 for diagram & Note 8 100 -09 15 200) 250 Graph8 for diagram & Note9 Mr. (Richard) Zhao Kun TANG / Add: NO. 68 Farnell St. WestRyde NSW 2114 Mail: austangcn@gmail.com/hotmail.com Mobile: (Australia) 0404248933 / (China) 0086-13816709498

3. 发明授权

US07602616B2 Method and apparatus for assembling multi-core dice using sockets with multiple sets of front side bus contacts 有权
标题翻译：使用带多组前端总线接点的插座组装多芯骰子的方法和装置
公开(公告)号：US07602616B2
公开(公告)日：2009-10-13
申请号：US11385134
申请日：2006-03-20
申请人： Richard Zhao
发明人： Richard Zhao
IPC分类号： H01R12/16
CPC分类号： H05K7/1092 , H01R12/714 , H01R12/88
摘要： An embodiment of the present invention is a technique to assemble multi-core dice. A first socket has first N sets of front side bus (FSB) contacts to house a first package having first 2N dice. Each of the first 2N dice has M cores. N and M are positive integers. A first chipset has 2N FSB signal groups interfacing to the first package via the first N sets of FSB contacts using first N FSB signal groups of the 2N FSB signal groups.
摘要翻译：本发明的一个实施例是一种组装多芯骰子的技术。第一插座具有前N组前端总线（FSB）触点，以容纳具有第一2N芯片的第一封装。每个2N骰子都有M个核心。 N和M是正整数。第一芯片组具有2N个FSB信号组，其通过使用2N个FSB信号组的前N个FSB信号组，经由前N组FSB触点与第一封装相接口。

4. 发明授权

US06390475B1 Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die 失效
标题翻译：机电散热垫片，用于冲击和振动保护，以及裸露裸片上的EMI抑制
公开(公告)号：US06390475B1
公开(公告)日：2002-05-21
申请号：US09387048
申请日：1999-08-31
申请人： Michael Z. Eckblad , Russell S. Aoki , Chia-Pin Chiu , Correy D. Cooks , Richard Zhao
发明人： Michael Z. Eckblad , Russell S. Aoki , Chia-Pin Chiu , Correy D. Cooks , Richard Zhao
IPC分类号： F16J1502
CPC分类号： H05K9/0015 , F16J15/064 , H01L23/4093 , H01L23/552 , H01L23/562 , H01L23/585 , H01L2924/0002 , Y10S277/915 , Y10S277/919 , H01L2924/00
摘要： A method and assembly for utilizing a gasket to protect an exposed die from damage, such as chipping and cracking, caused by external forces such as shock, vibrations, installation and/or handling, as well as to prevent electromagnetic interference (EMI) emissions from the exposed die.
摘要翻译：一种用于利用垫圈来保护暴露的模具免受诸如冲击，振动，安装和/或处理之类的外部力引起的破裂和破裂的方法和组件，以及防止电磁干扰（EMI）暴露的模具。

5. 发明申请

US20160181682A1 DEVICES AND METHODS TO REDUCE DIFFERENTIAL SIGNAL PAIR CROSSTALK 有权
标题翻译：减少差异信号对CROCSTALK的装置和方法
公开(公告)号：US20160181682A1
公开(公告)日：2016-06-23
申请号：US14573434
申请日：2014-12-17
申请人： Chong Richard Zhao , Xiaoning Ye
发明人： Chong Richard Zhao , Xiaoning Ye
IPC分类号： H05K1/02 , H01P3/08 , H05K1/11
CPC分类号： H05K1/0216 , H01P3/026 , H05K1/0219 , H05K1/0245 , H05K1/111 , H05K1/115 , H05K1/116
摘要： Generally discussed herein are systems, apparatuses, and methods that relate to reducing crosstalk in a differential signal pair. According to an example, a device may include a first pair of differential signal lines comprising a first signal line and a second signal line proximate the first signal line, the first signal line and the second signal line separated from each other along a first line, and a second pair of differential signal lines comprising a third signal line proximate a fourth signal, the third signal line and the fourth signal separated from each other along a second line generally perpendicular to the first line.
摘要翻译：这里通常讨论的是减少差分信号对中的串扰的系统，装置和方法。根据示例，设备可以包括第一对差分信号线，包括第一信号线和靠近第一信号线的第二信号线，第一信号线和第二信号线沿着第一线彼此分离，以及第二对差分信号线，包括靠近第四信号的第三信号线，所述第三信号线和所述第四信号沿着大致垂直于所述第一线的第二线彼此分离。

6. 发明申请

US20070290323A1 On-die termination method for multi-chip packages 有权
标题翻译：多芯片封装的片上端接方法
公开(公告)号：US20070290323A1
公开(公告)日：2007-12-20
申请号：US11453786
申请日：2006-06-14
申请人： Richard Zhao , Chris Mozak
发明人： Richard Zhao , Chris Mozak
IPC分类号： H01L23/52
CPC分类号： H01L23/66 , H01L25/0655 , H01L2224/48137 , H01L2224/4917 , H01L2224/49175 , H01L2924/00
摘要： An on-die termination method to support a multi-chip package routing topology is described. The on die termination method may increase the surface area on the substrate such that larger size die or more memory may be mounted thereto. The on-die termination method may include a semiconductor package that features on die termination bumps coupled to a semiconductor die's bus terminals, which couples the semiconductor die to an on-die termination pin coupled in the motherboard. An alternative on-die termination method includes a semiconductor die, within the multi-chip CPU package, designated as an end agent from which a single on die termination bump is coupled to an on-die termination pin.
摘要翻译：描述了支持多芯片封装路由拓扑的片上终端方法。芯片端接方法可以增加衬底上的表面积，使得可以在其上安装更大尺寸的裸片或更多的存储器。片上端接方法可以包括半导体封装，其具有耦合到半导体管芯的总线端子的管芯端接凸起，半导体管芯端子将半导体管芯耦合到耦合在母板中的管芯端子引脚。替代的管芯端接方法包括在多芯片CPU封装内的半导体管芯，其被指定为终端代理，单个管芯端接凸块从该半导体管芯连接到管芯上的端接引脚。

7. 外观设计

USD758127S1 Container cap 有权
公开(公告)号：USD758127S1
公开(公告)日：2016-06-07
申请号：US29502712
申请日：2014-09-18
申请人： Richard Zhao
设计人： Richard Zhao

8. 发明授权

US07602056B2 On-die termination method for multi-chip packages 有权
标题翻译：多芯片封装的片上端接方法
公开(公告)号：US07602056B2
公开(公告)日：2009-10-13
申请号：US11453786
申请日：2006-06-14
申请人： Richard Zhao , Chris Mozak
发明人： Richard Zhao , Chris Mozak
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/66 , H01L25/0655 , H01L2224/48137 , H01L2224/4917 , H01L2224/49175 , H01L2924/00
摘要： An on-die termination method to support a multi-chip package routing topology is described. The on die termination method may increase the surface area on the substrate such that larger size die or more memory may be mounted thereto. The on-die termination method may include a semiconductor package that features on die termination bumps coupled to a semiconductor die's bus terminals, which couples the semiconductor die to an on-die termination pin coupled in the motherboard. An alternative on-die termination method includes a semiconductor die, within the multi-chip CPU package, designated as an end agent from which a single on die termination bump is coupled to an on-die termination pin.
摘要翻译：描述了支持多芯片封装路由拓扑的片上终端方法。芯片端接方法可以增加衬底上的表面积，使得可以在其上安装更大尺寸的裸片或更多的存储器。片上端接方法可以包括半导体封装，其具有耦合到半导体管芯的总线端子的管芯端接凸起，半导体管芯端子将半导体管芯耦合到耦合在母板中的管芯端子引脚。替代的管芯端接方法包括在多芯片CPU封装内的半导体管芯，其被指定为终端代理，单个管芯端接凸块从该半导体管芯连接到管芯上的端接引脚。

9. 发明申请

US20070216018A1 Assembling multi-core dice using sockets with multiple sets of front side bus contacts 有权
标题翻译：使用带多组前端总线接点的插座组装多芯骰子
公开(公告)号：US20070216018A1
公开(公告)日：2007-09-20
申请号：US11385134
申请日：2006-03-20
申请人： Richard Zhao
发明人： Richard Zhao
IPC分类号： H01L23/48
CPC分类号： H05K7/1092 , H01R12/714 , H01R12/88
摘要： An embodiment of the present invention is a technique to assemble multi-core dice. A first socket has first N sets of front side bus (FSB) contacts to house a first package having first 2N dice. Each of the first 2N dice has M cores. N and M are positive integers. A first chipset has 2N FSB signal groups interfacing to the first package via the first N sets of FSB contacts using first N FSB signal groups of the 2N FSB signal groups.
摘要翻译：本发明的一个实施例是一种组装多芯骰子的技术。第一插座具有前N组前端总线（FSB）触点，以容纳具有第一2N芯片的第一封装。每个2N骰子都有M个核心。 N和M是正整数。第一芯片组具有2N个FSB信号组，其通过使用2N个FSB信号组的前N个FSB信号组，经由前N组FSB触点与第一封装相接口。

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