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1. 发明授权

US08968289B2 Microwave spacers and methods of use 有权
标题翻译：微波垫片和使用方法
公开(公告)号：US08968289B2
公开(公告)日：2015-03-03
申请号：US12910442
申请日：2010-10-22
申请人： Robert B. Cunningham , Gene H. Arts , Timothy A. Turley , Richard W. Wetz , Chad M. Nelson
发明人： Robert B. Cunningham , Gene H. Arts , Timothy A. Turley , Richard W. Wetz , Chad M. Nelson
IPC分类号： A61B18/18 , A61B17/34
CPC分类号： A61B18/1815 , A61B2017/3411 , A61B2018/1869
摘要： Disclosed is a spacer, configured to position microwave energy delivery devices, including a housing, with a housing body and a compression body, and at least one compression mechanism. The housing body forms a housing body cavity and a plurality of housing device apertures. The compression body forms a plurality of compression body apertures that each correspond to a housing device aperture. The compression body slideably engages the housing body cavity and at least a portion of the compression body is positioned within the compression body cavity. A compression mechanism is positioned between the housing body and the compression body and configured to provide a biasing force between the housing body and the compression body. In a first position the housing device apertures are misaligned with the compression body apertures and in the second position the housing apertures are aligned with the compression body apertures forming a plurality of aligned apertures.
摘要翻译：公开了一种间隔件，其构造成将包括壳体的微波能量输送装置与壳体和压缩体定位，以及至少一个压缩机构。壳体形成壳体体腔和多个壳体装置孔。压缩体形成多个压缩体孔，每个孔对应于壳体装置孔。压缩体可滑动地接合壳体体腔，压缩体的至少一部分位于压缩体腔内。压缩机构位于壳体和压缩体之间，并被构造成在壳体和压缩体之间提供偏置力。在第一位置，壳体装置孔与压缩体孔不对准，并且在第二位置，壳体孔与压缩体孔对准，形成多个对准的孔。

2. 发明授权

US07446411B2 Semiconductor structure and method of assembly 有权
标题翻译：半导体结构及组装方法
公开(公告)号：US07446411B2
公开(公告)日：2008-11-04
申请号：US11257784
申请日：2005-10-24
申请人： Brian W. Condie , Lakshminarayan Viswanathan , Richard W. Wetz
发明人： Brian W. Condie , Lakshminarayan Viswanathan , Richard W. Wetz
IPC分类号： H01L23/10
CPC分类号： H01L23/10 , H01L23/047 , H01L23/053 , H01L23/057 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/83 , H01L24/85 , H01L25/072 , H01L25/50 , H01L2223/6644 , H01L2224/16 , H01L2224/29111 , H01L2224/29116 , H01L2224/29144 , H01L2224/2929 , H01L2224/29299 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/49 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85 , H01L2224/92247 , H01L2924/00011 , H01L2924/00013 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/157 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00014 , H01L2924/01025 , H01L2924/01026 , H01L2924/3512 , H01L2924/00 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/83205
摘要： A semiconductor structure (100, 900) includes a substrate (110) having a surface (111) and also includes one or more semiconductor chips (120) located over the substrate surface. The semiconductor structure further includes an electrical isolator structure (340) located over the substrate surface, where the electrical isolator structure includes one or more electrical leads (341, 342) and an organic-based element (343) molded to the electrical leads. The semiconductor structure also includes a solder element (350) coupling together the electrical isolator structure and the substrate surface.
摘要翻译：半导体结构（100,900）包括具有表面（111）的衬底（110），并且还包括位于衬底表面上方的一个或多个半导体芯片（120）。半导体结构还包括位于衬底表面上的电隔离器结构（340），其中电隔离器结构包括一个或多个电引线（341,342）和模制到电引线的有机元件（343）。半导体结构还包括将电隔离器结构和衬底表面耦合在一起的焊料元件（350）。

3. 发明申请

US20100331834A1 Ablation Probe Fixation 审中-公开
标题翻译：消融探针固定
公开(公告)号：US20100331834A1
公开(公告)日：2010-12-30
申请号：US12493302
申请日：2009-06-29
申请人： Darion Peterson , Joseph D. Brannan , Kenlyn S. Bonn , Richard W. Wetz , Francesca Rossetto , Ian Smith
发明人： Darion Peterson , Joseph D. Brannan , Kenlyn S. Bonn , Richard W. Wetz , Francesca Rossetto , Ian Smith
IPC分类号： A61B18/14
CPC分类号： A61B18/1477 , A61B90/50 , A61B2018/1425 , A61B2018/1869 , A61B2090/508
摘要： An ablation probe fixation apparatus for securing an ablation probe to tissue is disclosed. The ablation probe fixation apparatus includes a base having a top surface and a skin-contacting bottom surface, wherein the base includes an adhesive layer disposed on the skin-contacting bottom surface. The fixation apparatus also includes a fixation member coupled to the top surface of the base. The base and the fixation member include an aperture defined therein for insertion of the ablation probe therethrough.
摘要翻译：公开了一种用于将消融探针固定到组织的消融探针固定装置。消融探针固定装置包括具有顶表面和与皮肤接触的底表面的基部，其中基部包括设置在皮肤接触的底表面上的粘合剂层。固定装置还包括联接到基座的顶表面的固定构件。基部和固定构件包括限定在其中的孔，用于通过其插入消融探针。

4. 发明授权

US07429790B2 Semiconductor structure and method of manufacture 有权
标题翻译：半导体结构及制造方法
公开(公告)号：US07429790B2
公开(公告)日：2008-09-30
申请号：US11257783
申请日：2005-10-24
申请人： Brian W. Condie , Lakshminarayan Viswanathan , Richard W. Wetz
发明人： Brian W. Condie , Lakshminarayan Viswanathan , Richard W. Wetz
IPC分类号： H01L23/10
CPC分类号： H01L23/13 , H01L23/10 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45111 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/49 , H01L2224/73265 , H01L2224/92 , H01L2224/92247 , H01L2924/01007 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/01025 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor structure (100) includes a substrate (110) having a first surface (111) with a mold lock feature (101). The semiconductor structure also includes a semiconductor chip (120) located over the first surface of the substrate. The semiconductor structure further includes an electrical isolator structure (340) located over the first surface of the substrate. The electrical isolator structure includes an electrical lead (341, 342) and an electrically insulative element (343) molded to the electrical lead. An optional portion (444) of the electrical isolator structure is located in the mold lock feature. The semiconductor structure additionally includes an adhesive element (450) located between and coupling the electrical isolator structure and the first surface of the substrate.
摘要翻译：半导体结构（100）包括具有模具锁定特征（101）的第一表面（111）的基板（110）。半导体结构还包括位于衬底的第一表面上方的半导体芯片（120）。半导体结构还包括位于衬底的第一表面上方的电隔离器结构（340）。电隔离器结构包括电引线（341,342）和模制到电引线上的电绝缘元件（343）。电隔离器结构的可选部分（444）位于模具锁定特征中。半导体结构还包括位于电隔离器结构和衬底的第一表面之间的耦合的粘合元件（450）。

5. 发明申请

US20120101487A1 Microwave Spacers and Methods of Use 有权
标题翻译：微波隔离器和使用方法
公开(公告)号：US20120101487A1
公开(公告)日：2012-04-26
申请号：US12910442
申请日：2010-10-22
申请人： Robert B. Cunningham , Gene H. Arts , Timothy A. Turley , Richard W. Wetz , Chad M. Nelson
发明人： Robert B. Cunningham , Gene H. Arts , Timothy A. Turley , Richard W. Wetz , Chad M. Nelson
IPC分类号： A61B18/18
CPC分类号： A61B18/1815 , A61B2017/3411 , A61B2018/1869
摘要： Disclosed is a spacer, configured to position microwave energy delivery devices, including a housing, with a housing body and a compression body, and at least one compression mechanism. The housing body forms a housing body cavity and a plurality of housing device apertures. The compression body forms a plurality of compression body apertures that each correspond to a housing device aperture. The compression body slideably engages the housing body cavity and at least a portion of the compression body is positioned within the compression body cavity. A compression mechanism is positioned between the housing body and the compression body and configured to provide a biasing force between the housing body and the compression body. In a first position the housing device apertures are misaligned with the compression body apertures and in the second position the housing apertures are aligned with the compression body apertures forming a plurality of aligned apertures.
摘要翻译：公开了一种间隔件，其构造成将包括壳体的微波能量输送装置与壳体和压缩体定位，以及至少一个压缩机构。壳体形成壳体体腔和多个壳体装置孔。压缩体形成多个压缩体孔，每个孔对应于壳体装置孔。压缩体可滑动地接合壳体体腔，压缩体的至少一部分位于压缩体腔内。压缩机构位于壳体和压缩体之间，并被构造成在壳体和压缩体之间提供偏置力。在第一位置，壳体装置孔与压缩体孔不对准，并且在第二位置，壳体孔与压缩体孔对准，形成多个对准的孔。

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