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1. 发明授权

US5939772A Shielded package for magnetic devices 失效
标题翻译：磁性器件屏蔽封装
公开(公告)号：US5939772A
公开(公告)日：1999-08-17
申请号：US962512
申请日：1997-10-31
申请人： Allan T. Hurst , Richard K. Spielberger
发明人： Allan T. Hurst , Richard K. Spielberger
IPC分类号： H01L23/552 , H01L23/58 , H01L23/02 , H01L23/522
CPC分类号： H01L23/585 , H01L23/552 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01025 , H01L2924/01079 , H01L2924/01322 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/3025 , Y10S257/921
摘要： A package for shielding a circuit containing magnetically sensitive materials from external magnetic fields. A shield attached to a base of the package is connected by vias to a first conductive plane. A shield attached to a lid of the package is connected by vias to a second conductive plane. The first shield and the second shield are electrically interconnected. Conductive leads extend from the package and are connected internally to the circuit.
摘要翻译：用于屏蔽含有磁敏感材料的电路与外部磁场的封装。附接到包装的基部的屏蔽件通过通孔连接到第一导电平面。附接到封装盖的屏蔽件通过通孔连接到第二导电平面。第一屏蔽和第二屏蔽电互连。导体引线从封装延伸并在内部连接到电路。

2. 发明授权

US5043533A Chip package capacitor cover 失效
标题翻译：芯片封装电容器盖
公开(公告)号：US5043533A
公开(公告)日：1991-08-27
申请号：US348999
申请日：1989-05-08
申请人： Richard K. Spielberger
发明人： Richard K. Spielberger
IPC分类号： H01L25/00 , H01L23/02 , H01L23/04 , H01L23/057 , H01L23/64
CPC分类号： H01L23/642 , H01L23/04 , H01L23/057 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/19041 , H01L2924/30107 , Y10S257/916
摘要： Disclosed is a cover for a semiconductor chip package. The cover comprises a sealing surface for providing a seal between the cover and a semiconductor chip package. A mounting surface for mounting a capacitor to the surface of cover is provided. The mounting surface comprises metalization including a metalized power pad and a metalized ground pad for mounting at least one capacitor on the surface of the cover.

3. 发明授权

US5036163A Universal semiconductor chip package 失效
标题翻译：通用半导体芯片封装
公开(公告)号：US5036163A
公开(公告)日：1991-07-30
申请号：US612805
申请日：1990-11-13
申请人： Richard K. Spielberger , Thomas J. Dunaway
发明人： Richard K. Spielberger , Thomas J. Dunaway
IPC分类号： H01L23/498 , H01L23/538
CPC分类号： H01L23/498 , H01L23/5382 , H01L2924/0002 , H01L2924/3011
摘要： Disclosed is a semiconductor chip package comprising a plurality of programmable pads located on a surface of the package, each pad being adapted for interconnection with a semiconductor chip. The package also includes a plurality of signal connectors located on a surface of the package. In addition, the package includes a plurality of signal connections, each signal connection providing an electrically conductive path between an individual programmable pad and a corresponding individual signal connector. A plurality of dedicated power or ground connectors are also located on a surface of the package. Conductive paths within the package provide apparatus for selectively connecting any programmable pad to a power or ground connector, any pad so connected also remaining connected to a corresponding signal connector.
摘要翻译：公开了一种半导体芯片封装，其包括位于封装表面上的多个可编程焊盘，每个焊盘适于与半导体芯片互连。封装还包括位于封装表面上的多个信号连接器。此外，封装包括多个信号连接，每个信号连接提供单个可编程焊盘和相应的单独信号连接器之间的导电路径。多个专用电源或接地连接器也位于包装的表面上。封装内的导电路径提供用于选择性地将任何可编程焊盘连接到电源或接地连接器的设备，任何如此连接的焊盘也保持连接到相应的信号连接器。

4. 发明申请

US20080188035A1 SYSTEM AND METHOD FOR SEALING A MEMS DEVICE 有权
标题翻译：用于密封MEMS器件的系统和方法
公开(公告)号：US20080188035A1
公开(公告)日：2008-08-07
申请号：US11672348
申请日：2007-02-07
申请人： Bryan R. Seppala , Harlan L. Curtis , Jon B. DCamp , Richard K. Spielberger
发明人： Bryan R. Seppala , Harlan L. Curtis , Jon B. DCamp , Richard K. Spielberger
IPC分类号： H01L21/00
CPC分类号： B81B7/0041 , B81C2203/0109 , B81C2203/019 , B81C2203/036 , H01L2224/48227 , H01L2924/01322 , H01L2924/1461 , H01L2924/15153 , H01L2924/15321 , H01L2924/16195 , H01L2924/00
摘要： A method for assembling a hermetically sealed package to contain a MEMS die and the hermetically sealed package are presented. The method includes selectively applying a glass mixture to a dome. The dome is heated to a first temperature sufficient to flow the glass mixture. The dome is pressed into contact with a carrier containing the MEMS device, the pressing being maintained at a pressure and for a temporal interval sufficient to flow the glass mixture onto the carrier. The dome is cooled while maintaining contact with the carrier, to a second temperature sufficient to allow the glass mixture to harden into a glass frit thereby to seal the carrier to the dome. The glass frit has a seal width.
摘要翻译：提出了一种用于组装气密封装以容纳MEMS管芯和密封封装的方法。该方法包括选择性地将玻璃混合物施加到圆顶。将圆顶加热至足以使玻璃混合物流动的第一温度。将圆顶压制成与包含MEMS器件的载体接触，该压制保持在足以将玻璃混合物流动到载体上的压力和时间间隔。圆顶被冷却，同时保持与载体的接触，达到足以使玻璃混合物硬化到玻璃料中的第二温度，从而将载体密封到圆顶。玻璃料具有密封宽度。

5. 发明授权

US6005778A Chip stacking and capacitor mounting arrangement including spacers 失效
标题翻译：芯片堆叠和电容器安装布置包括间隔件
公开(公告)号：US6005778A
公开(公告)日：1999-12-21
申请号：US681784
申请日：1996-07-29
申请人： Richard K. Spielberger , Ronald J. Jensen , Charles J. Speerschneider
发明人： Richard K. Spielberger , Ronald J. Jensen , Charles J. Speerschneider
IPC分类号： H01L25/065 , H01L25/16 , H05K7/02 , H01L23/49
CPC分类号： H01L24/49 , H01L25/0657 , H01L25/16 , H05K7/023 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/4847 , H01L2224/4911 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2225/06575 , H01L24/45 , H01L24/50 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/19041 , H01L2924/19104 , H01L2924/19107 , H01L2924/30107
摘要： Chip stacking and capacitor mounting arrangement including a planar spacer separating a first die and a second die. A conductive spacer provides for backside chip grounding in one application and provides for capacitor mounting in another application.
摘要翻译：芯片堆叠和电容器安装布置包括分隔第一管芯和第二管芯的平面间隔件。导电间隔件在一个应用中提供背面芯片接地，并在另一个应用中提供电容器安装。

6. 发明授权

US5101550A Removable drop-through die bond frame 失效
标题翻译：可拆卸的直通芯片键合框架
公开(公告)号：US5101550A
公开(公告)日：1992-04-07
申请号：US736008
申请日：1991-07-25
申请人： Thomas J. Dunaway , Richard K. Spielberger , Lori A. Dicks
发明人： Thomas J. Dunaway , Richard K. Spielberger , Lori A. Dicks
IPC分类号： H01L21/58 , H01L21/60
CPC分类号： H01L24/85 , H01L24/06 , H01L24/29 , H01L24/49 , H01L24/83 , H01L2224/05553 , H01L2224/2919 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/49175 , H01L2224/4943 , H01L2224/83001 , H01L2224/8319 , H01L2224/83805 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15153 , H01L2924/15165 , H01L2924/351 , Y10T29/53257 , Y10T29/53261 , Y10T29/53265
摘要： A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.
摘要翻译：一种用于将半导体芯片精确地定位到半导体封装的管芯接合焊盘区域上的方法和装置。构造框架以与半导体封装模腔的周壁滑动接触。具有宽上开口和较窄下开口的框架中心孔引导将其穿过其中的芯片落入模腔中的精确位置。

7. 发明授权

US5074036A Method of die bonding semiconductor chip by using removable frame 失效
标题翻译：通过使用可移动框架芯片接合半导体芯片的方法
公开(公告)号：US5074036A
公开(公告)日：1991-12-24
申请号：US607246
申请日：1990-10-31
申请人： Thomas J. Dunaway , Richard K. Spielberger , Lori A. Dicks
发明人： Thomas J. Dunaway , Richard K. Spielberger , Lori A. Dicks
IPC分类号： H01L21/58 , H01L21/60
CPC分类号： H01L24/85 , H01L24/29 , H01L24/49 , H01L24/75 , H01L24/83 , H01L2224/05553 , H01L2224/2919 , H01L2224/48091 , H01L2224/48175 , H01L2224/49109 , H01L2224/49175 , H01L2224/4943 , H01L2224/83001 , H01L2224/8319 , H01L2224/83805 , H01L2224/8385 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15153 , H01L2924/15165 , H01L2924/351 , Y10T156/1092 , Y10T29/49121 , Y10T29/49133
摘要： A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.
摘要翻译：一种用于将半导体芯片精确地定位到半导体封装的管芯接合焊盘区域上的方法和装置。构造框架以与半导体封装模腔的周壁滑动接触。具有宽上开口和较窄下开口的框架中心孔引导将其穿过其中的芯片落入模腔中的精确位置。

8. 发明授权

US5010387A Solder bonding material 失效
标题翻译：焊接材料
公开(公告)号：US5010387A
公开(公告)日：1991-04-23
申请号：US274412
申请日：1988-11-21
申请人： Thomas J. Dunaway , Richard K. Spielberger , Lori A. Dicks , Jerald M. Loy
发明人： Thomas J. Dunaway , Richard K. Spielberger , Lori A. Dicks , Jerald M. Loy
IPC分类号： H01L23/10 , B23K35/26 , C22C11/06 , H01L23/488
CPC分类号： B23K35/268 , H01L23/488 , H01L24/50 , H01L2924/01322 , H01L2924/14 , H01L2924/3011 , H01L2924/351 , Y10T428/12701
摘要： Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead. The method invention comprises providing a leadframe comprising at least one of power, ground, and signal conductive elements; and preforming solder material onto one of the conductive elements, the solder bonding material having an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead.

9. 发明授权

US07863720B2 Method and system for stacking integrated circuits 有权
标题翻译：堆叠集成电路的方法和系统
公开(公告)号：US07863720B2
公开(公告)日：2011-01-04
申请号：US10852378
申请日：2004-05-24
申请人： Ronald J. Jensen , Richard K. Spielberger
发明人： Ronald J. Jensen , Richard K. Spielberger
IPC分类号： H01L23/02
CPC分类号： H01L25/50 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/48091 , H01L2224/48227 , H01L2224/731 , H01L2225/0651 , H01L2225/06513 , H01L2225/06555 , H01L2924/01057 , H01L2924/01079 , H01L2924/00014
摘要： A method and system for stacking integrated circuits is described. An integrated circuit stack is formed by stacking integrated circuit pairs. The integrated circuit pairs are formed by connecting an active surface of a first integrated circuit to an active surface of a second integrated circuit using flip chip bonding. The first integrated circuit pair is connected to a substrate using an adhesive. The other integrated circuit pairs are stacked sequentially on the first integrated circuit pair using an adhesive. Wire bonding is used to connect the second integrated circuit in each of the integrated circuit pairs to the substrate.
摘要翻译：描述了用于堆叠集成电路的方法和系统。通过堆叠集成电路对形成集成电路堆叠。通过使用倒装芯片接合将第一集成电路的有源表面连接到第二集成电路的有源表面来形成集成电路对。第一集成电路对使用粘合剂连接到基板。使用粘合剂将其它集成电路对依次堆叠在第一集成电路对上。引线接合用于将每个集成电路对中的第二集成电路连接到基板。

10. 发明授权

US07736946B2 System and method for sealing a MEMS device 有权
标题翻译：用于密封MEMS器件的系统和方法
公开(公告)号：US07736946B2
公开(公告)日：2010-06-15
申请号：US11672348
申请日：2007-02-07
申请人： Bryan R. Seppala , Harlan L. Curtis , Jon B. DCamp , Richard K. Spielberger
发明人： Bryan R. Seppala , Harlan L. Curtis , Jon B. DCamp , Richard K. Spielberger
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/76 , H01L23/12 , H01L23/552 , H01L23/34 , H01L23/00
CPC分类号： B81B7/0041 , B81C2203/0109 , B81C2203/019 , B81C2203/036 , H01L2224/48227 , H01L2924/01322 , H01L2924/1461 , H01L2924/15153 , H01L2924/15321 , H01L2924/16195 , H01L2924/00
摘要： A method for assembling a hermetically sealed package to contain a MEMS die and the hermetically sealed package are presented. The method includes selectively applying a glass mixture to a dome. The dome is heated to a first temperature sufficient to flow the glass mixture. The dome is pressed into contact with a carrier containing the MEMS device, the pressing being maintained at a pressure and for a temporal interval sufficient to flow the glass mixture onto the carrier. The dome is cooled while maintaining contact with the carrier, to a second temperature sufficient to allow the glass mixture to harden into a glass frit thereby to seal the carrier to the dome. The glass frit has a seal width.
摘要翻译：提出了一种用于组装气密封装以容纳MEMS管芯和密封封装的方法。该方法包括选择性地将玻璃混合物施加到圆顶。将圆顶加热至足以使玻璃混合物流动的第一温度。将圆顶压制成与包含MEMS器件的载体接触，该压制保持在足以将玻璃混合物流动到载体上的压力和时间间隔。圆顶被冷却，同时保持与载体的接触，达到足以使玻璃混合物硬化到玻璃料中的第二温度，从而将载体密封到圆顶。玻璃料具有密封宽度。

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