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    • 1. 发明授权
    • Microlamination method for making devices
    • 微量滴定法制造装置
    • US06793831B1
    • 2004-09-21
    • US09369679
    • 1999-08-05
    • Brian Kevin PaulRichard Budd PetersonTyson Jedd Terhaar
    • Brian Kevin PaulRichard Budd PetersonTyson Jedd Terhaar
    • C25F700
    • B23K20/023Y10T29/30Y10T29/46Y10T156/1043Y10T156/1057Y10T156/12
    • A method for fabricating devices in a pre-assembled state comprising forming plural laminae, registering the laminae, and bonding the laminae one to another is described. The plural laminae contain the substructures and structures of the device. The substructures are coupled to structures and other substructures by fixture bridges in the pre-assembled state. The substructures of the device are dissociated by eliminating the fixture bridges. The plural laminae are registered and bonded to form the device either before or after the fixture bridges are eliminated. The fixture bridges can be eliminated in a variety of ways, including vaporization by electrical current, chemical dissolution, or thermochemical dissociation. One method to selectively bond the laminae together is by microprojection welding. Microprojection welding comprises forming laminae with projections that extend from at least one planar surface of the lamina. Bonding together of laminae at selected regions is accomplished by placing the laminae between electrodes and passing a current through the electrodes. The laminae are bonded together selectively at the sites of the projections. Another method for bonding lamina involve diffusion soldering at reduced bonding pressures and temperatures to minimize flow restriction within or to features.
    • 描述了一种用于在预组装状态下制造器件的方法,包括形成多个层,对齐层,以及将层彼此粘合。 复数层包含设备的子结构和结构。 子结构通过预组装状态下的夹具桥耦合到结构和其他子结构。 通过消除夹具桥离解器件的子结构。 在夹具桥被消除之前或之后,将多个薄片进行登记和粘结以形成该装置。 夹具桥可以以各种方式消除,包括通过电流蒸发,化学溶解或热化学解离。 通过微喷射焊接选择性地将薄片粘合在一起的一种方法。 微投射焊接包括用从板的至少一个平坦表面延伸的突起形成薄片。 通过将薄片放置在电极之间并使电流通过电极来实现在选定区域处粘合在一起的薄片。 薄片在突出部位选择性地结合在一起。 粘合薄层的另一种方法涉及在降低的粘合压力和温度下的扩散焊接,以最小化在特征内或对特征的流动限制。