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1. 发明授权

US07235148B2 Selectively roughening conductors for high frequency printed wiring boards 有权
标题翻译：高频印刷电路板选用粗糙导体
公开(公告)号：US07235148B2
公开(公告)日：2007-06-26
申请号：US10616341
申请日：2003-07-09
申请人： Richard Allen Day , Kevin Taylor Knadle , Kristen Ann Stauffer
发明人： Richard Allen Day , Kevin Taylor Knadle , Kristen Ann Stauffer
IPC分类号： B32B37/00
CPC分类号： H05K1/0242 , H05K3/382 , H05K3/384 , H05K3/385 , H05K3/429 , H05K2201/09309 , H05K2203/0315 , H05K2203/0361 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T428/24917 , Y10T428/24942
摘要： A printed wiring board is formed from two or more layers, one of which has circuit lines formed thereon, and wherein the surfaces of the circuit lines are roughened only in areas that require good copper to laminate adhesion. The remainder of the circuit line surfaces are smooth. Thus, those areas for propagation of the signal on signal lines have the circuit lines smooth to maximize the signal propagation effect, while those areas where the signal propagation is not critical are rough, which improves the adhesion of one layer to another. On the voltage planes, the surface in those regions opposite the smooth surfaces of the signal planes is smooth. Thus, these areas of the voltage planes can be maintained smooth while the other areas of the surface of the voltage planes can be roughened, providing good adhesion to the adjoining dielectric material.
摘要翻译：印刷电路板由两层或多层形成，其中一层具有形成在其上的电路线，并且其中电路线的表面仅在需要良好铜以覆盖层压粘合的区域中粗糙化。电路线路表面的其余部分是光滑的。因此，用于信号线上的信号传播的那些区域具有平滑的电路线以使信号传播效应最大化，而信号传播不重要的那些区域是粗糙的，这改善了一层到另一层的粘附。在电压平面上，与信号平面光滑表面相反的区域中的表面是平滑的。因此，电压平面的这些区域可以保持平滑，而电压平面表面的其它区域可以被粗糙化，从而为邻接的介电材料提供良好的附着力。

2. 发明授权

US06596384B1 Selectively roughening conductors for high frequency printed wiring boards 有权
标题翻译：高频印刷电路板选用粗糙导体
公开(公告)号：US06596384B1
公开(公告)日：2003-07-22
申请号：US10119458
申请日：2002-04-09
申请人： Richard Allen Day , Kevin Taylor Knadle , Kristen Ann Stauffer
发明人： Richard Allen Day , Kevin Taylor Knadle , Kristen Ann Stauffer
IPC分类号： B32B300
CPC分类号： H05K1/0242 , H05K3/382 , H05K3/384 , H05K3/385 , H05K3/429 , H05K2201/09309 , H05K2203/0315 , H05K2203/0361 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T428/24917 , Y10T428/24942
摘要： A printed wiring board is formed from two or more layers, one of which has circuit lines formed thereon, and wherein the surfaces of the circuit lines are roughened only in areas that require good copper to laminate adhesion. The remainder of the circuit line surfaces are smooth. Thus, those areas for propagation of the signal on signal lines have the circuit lines smooth to maximize the signal propagation effect, while those areas where the signal propagation is not critical are rough, which improves the adhesion of one layer to another. On the voltage planes, the surface in those regions opposite the smooth surfaces of the signal planes is smooth. Thus, these areas of the voltage planes can be maintained smooth while the other areas of the surface of the voltage planes can be roughened, providing good adhesion to the adjoining dielectric material.
摘要翻译：印刷电路板由两层或多层形成，其中一层具有形成在其上的电路线，并且其中电路线的表面仅在需要良好铜以覆盖层压粘合的区域中粗糙化。电路线路表面的其余部分是光滑的。因此，用于信号线上的信号传播的那些区域具有平滑的电路线以使信号传播效应最大化，而信号传播不重要的那些区域是粗糙的，这改善了一层到另一层的粘附。在电压平面上，与信号平面光滑表面相反的区域中的表面是平滑的。因此，电压平面的这些区域可以保持平滑，而电压平面表面的其它区域可以被粗糙化，从而为邻接的介电材料提供良好的附着力。

3. 发明授权

US06485892B1 Method for masking a hole in a substrate during plating 失效
标题翻译：在电镀期间掩蔽基板中的孔的方法
公开(公告)号：US06485892B1
公开(公告)日：2002-11-26
申请号：US09465593
申请日：1999-12-17
申请人： Lawrence Robert Blumberg , Norman A. Card, Jr. , Richard Allen Day , Stephen J. Fuerniss , John Joseph Konrad , Jeffrey McKeveny , Timothy L. Wells
发明人： Lawrence Robert Blumberg , Norman A. Card, Jr. , Richard Allen Day , Stephen J. Fuerniss , John Joseph Konrad , Jeffrey McKeveny , Timothy L. Wells
IPC分类号： G03C556
CPC分类号： H05K3/0094 , H05K3/243 , H05K2201/0959 , H05K2203/0156 , H05K2203/066 , H05K2203/082 , H05K2203/1394
摘要： Through-holes in a substrate are masked during plating of the substrate by substantially filling the through-holes with a liquid material, followed by applying a photoimageable material to an external surface of the substrate, forming a predetermined pattern in the photoimageable material, circuitizing the predetermined pattern and then removing both the photoimageable material and the liquid material from the through-holes.
摘要翻译：在基板的电镀期间，通过用液体材料基本上填充通孔来掩蔽衬底中的通孔，然后将光可成像材料施加到衬底的外表面，在可光成象的材料中形成预定的图案，然后从通孔中除去可光成像材料和液体材料。

4. 发明授权

US06210862B1 Composition for photoimaging 有权
标题翻译：光成像用组合物
公开(公告)号：US06210862B1
公开(公告)日：2001-04-03
申请号：US09150824
申请日：1998-09-10
申请人： Richard Allen Day , David John Russell , Donald Herman Glatzel
发明人： Richard Allen Day , David John Russell , Donald Herman Glatzel
IPC分类号： G03F7004
CPC分类号： C08G59/38 , C08G59/687 , G03F7/038 , G03F7/0385 , H05K3/287 , Y10S428/901
摘要： According to the present invention, an improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of an difunctional epoxy resin. Since the photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns. The photosensitive cationically polymerizable non-brominated epoxy based solder mask has a glass transition temperature greater than about 100° C., preferably greater than about 110° C. The solder mask dries to a tack-free film; thus, artwork used in the photoimaging process will not stick to the dried soldermask film. The polyol resin which is a condensation product of epichlorohydrin and bisphenol A, has a weight average molecular weight of between about 40,000 and 130,000. The polyepoxy resin is an epoxidized multi-functional bisphenol A formaldehyde novolak resin having a weight average molecular weight of 4,000 to 10,000. The epoxidized diglycidyl ether of bisphenol A has two epoxide groups per molecule, a melting point of between about 80° C. and about 110° C. and a weight average molecular weight of between about 600 and 2,500. The invention also relates to a cationically polymerized solder mask.
摘要翻译：根据本发明，提供了一种改进的可光成像的可阳离子聚合的环氧基焊接掩模，其包含非溴化环氧树脂体系和每100份树脂体系约0.1至约15重量份的阳离子光引发剂。非溴化环氧树脂体系具有由约10重量％至约80重量％的具有环氧官能团的多元醇树脂组成的固体; 约0重量％至约90重量％的聚环氧树脂; 和约25重量％至约85重量％的双官能环氧树脂。由于光敏阳离子聚合型环氧基焊接掩模不含溴，所以特别有利的是废物处理化学品中的卤素或焚烧废料电路板中的卤素受到环境问题的限制。光敏阳离子聚合的非溴化环氧基焊料掩模具有大于约100℃，优选大于约110℃的玻璃化转变温度。焊料掩模干燥成无粘性膜; 因此，在光成像过程中使用的艺术品不会粘附在干燥的焊接膜上。作为表氯醇和双酚A的缩合物的多元醇树脂的重均分子量为约40,000〜130,000。聚环氧树脂是重均分子量为4000〜10000的环氧化多官能双酚A甲醛酚醛清漆树脂。双酚A的环氧化二缩水甘油醚每分子具有两个环氧基团，熔点在约80℃至约110℃之间，重均分子量约为600-2,500。本发明还涉及阳离子聚合的焊接掩模。

5. 发明授权

US06576382B2 Composition for photoimaging 有权
标题翻译：光成像用组合物
公开(公告)号：US06576382B2
公开(公告)日：2003-06-10
申请号：US10142018
申请日：2002-05-09
申请人： Richard Allen Day , David John Russell , Donald Herman Glatzel
发明人： Richard Allen Day , David John Russell , Donald Herman Glatzel
IPC分类号： G03F7004
CPC分类号： C08G59/38 , C08G59/687 , G03F7/038 , G03F7/0385 , H05K3/287 , Y10S428/901
摘要： An improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of a difunctional epoxy resin. The photosensitive cationically polymerizable epoxy based system is especially useful as a solder mask and does not contain bromine.
摘要翻译：提供了一种改进的可光成像的可阳离子聚合的环氧基焊料掩模，其包含非溴化环氧树脂体系和每100份树脂体系约0.1至约15重量份的阳离子光引发剂。非溴化环氧树脂体系具有由约10重量％至约80重量％的具有环氧官能团的多元醇树脂组成的固体; 约0重量％至约90重量％的聚环氧树脂; 和约25重量％至约85重量％的双官能环氧树脂。光敏阳离子聚合型环氧系统特别适用于焊接掩模，不含溴。

6. 发明授权

US06180317B2 Composition for photoimaging 失效
标题翻译：光成像用组合物
公开(公告)号：US06180317B2
公开(公告)日：2001-01-30
申请号：US07793889
申请日：1991-11-18
申请人： Robert David Allen , Richard Allen Day , Donald Herman Glatzel , William Dinan Hinsberg , John Richard Mertz , David John Russell , Gregory Michael Wallraff
发明人： Robert David Allen , Richard Allen Day , Donald Herman Glatzel , William Dinan Hinsberg , John Richard Mertz , David John Russell , Gregory Michael Wallraff
IPC分类号： G03C1725
CPC分类号： G03F7/038
摘要： An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60° C. and about 110° C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
摘要翻译：提供了一种改进的可光成像的可阳离子聚合的环氧基涂料，适用于各种基材，包括用双氰胺固化的环氧玻璃层压板。该材料包括基本上由约10重量％至约80重量％的多元醇树脂组成的环氧树脂体系，多元醇树脂是分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 和约35重量％至72重量％的软化点在约60℃至约110℃之间且分子量为约600至2,500之间的溴化双酚A的环氧化缩水甘油醚。任选地，可以向树脂体系中加入第三树脂。向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂，其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于，对于2.0密耳厚的膜，在330至700nm区域中的光的吸光度小于0.1。任选地，可加入光敏剂如苝及其衍生物或蒽及其衍生物。

7. 发明授权

US5747223A Composition for photoimaging 失效
标题翻译：光成像用组合物
公开(公告)号：US5747223A
公开(公告)日：1998-05-05
申请号：US677230
申请日：1996-07-09
申请人： Robert D. Allen , Richard Allen Day , Donald Herman Glatzel , William Dinan Hinsberg , John Richard Mertz , David John Russell , Gregory Michael Wallraff
发明人： Robert D. Allen , Richard Allen Day , Donald Herman Glatzel , William Dinan Hinsberg , John Richard Mertz , David John Russell , Gregory Michael Wallraff
IPC分类号： G03C5/00 , G03F7/038 , H05K3/28
CPC分类号： G03F7/038 , H05K3/287
摘要： An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60.degree. C. and about 110.degree. C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
摘要翻译：提供了一种改进的可光成像的可阳离子聚合的环氧基涂料，适用于各种基材，包括用双氰胺固化的环氧玻璃层压板。该材料包括基本上由约10重量％至约80重量％的多元醇树脂组成的环氧树脂体系，多元醇树脂是分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 和约35重量％至72重量％的软化点为约60℃至约110℃，分子量为约600至2,500的溴化双酚A的环氧化缩水甘油醚。任选地，可以向树脂体系中加入第三树脂。向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂，其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于，对于2.0密耳厚的膜，在330至700nm区域中的光的吸光度小于0.1。任选地，可加入光敏剂如苝及其衍生物或蒽及其衍生物。

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