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    • 7. 发明授权
    • Systems and methods for tape flaw and splice avoidance in manufacturing
    • 制造过程中胶带缺陷和接头避免的系统和方法
    • US08158210B2
    • 2012-04-17
    • US11261362
    • 2005-10-28
    • Robert A. Kramp
    • Robert A. Kramp
    • B05D1/26
    • B29C70/30B29C70/386G01N21/89G01N2021/8472
    • Systems and methods for avoidance of tape flaw or splices in manufacturing are disclosed. In one embodiment, a method of applying a tape onto a workpiece includes feeding the tape from a tape supply using a tape application assembly, and applying the tape onto the workpiece using the tape application assembly. Simultaneously with the feeding of the tape, the tape is monitored for a marker indicating a defect within the tape, the marker being spaced apart along the tape from the defect such that the marker arrives prior to the defect. The method further includes detecting the marker, and avoiding the application of a portion of the tape that includes the defect onto the workpiece.
    • 公开了用于避免制造中的磁带缺陷或接头的系统和方法。 在一个实施例中,将带施加到工件上的方法包括使用带应用组件从带供应器馈送带,并使用带应用组件将带施加到工件上。 在带的馈送的同时,对带进行监视以指示带内的缺陷的标记,标记沿着带与缺陷间隔开,使得标记在缺陷之前到达。 该方法还包括检测标记,并避免将包括缺陷的一部分带施加到工件上。