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    • 3. 发明申请
    • COMPOSITE SOLDER ARTICLE
    • 复合材料制品
    • WO1990009255A1
    • 1990-08-23
    • PCT/GB1990000234
    • 1990-02-13
    • RAYCHEM LIMITEDRAYCHEM PONTOISE S.A.DELLALE, Jacques
    • RAYCHEM LIMITEDRAYCHEM PONTOISE S.A.
    • B23K35/26
    • B23K35/262B23K35/0222H05K3/3478
    • A composite solder article comprises: (a) a quantity of a base solder which comprises a non-eutectic alloy; and (b) a temperature control component comprising one or more metals and having a melting point that is higher than the solidus temperature of the non-eutectic alloy, the relative quantities and compositions of the two components being such that when the base solder and the temperature control component have been fused together the resulting solder alloy has a smaller solidus/liquidus temperature difference than the base solder. Preferably the temperature control component is formed from a pure metal that is present in the base solder and especially in such an amount that the overall composition is in the region of the eutectic point. The article may be used for forming solder connections to standard electrical conductors and can exhibit a reduced tendency to flow or ''wick'' along the conductor.
    • 复合焊料制品包括:(a)一定量的包含非共晶合金的基底焊料; 和(b)包含一种或多种金属并且具有高于非共晶合金的固相线温度的熔点的温度控制部件,两个部件的相对数量和组成使得当基础焊料和 温度控制组件已经熔合在一起,所得到的焊料合金具有比基底焊料更小的固相/液相线温度差。 优选地,温度控制部件由存在于基底焊料中的纯金属形成,特别是以总组合物处于共晶点的区域的量。 该制品可用于形成与标准电导体的焊接连接,并且可以沿着导体显示出减少的流动趋势或“灯芯”。