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    • 3. 发明申请
    • LASER PROCESSING METHODS FOR PHOTOVOLTAIC SOLAR CELLS
    • 光伏太阳能电池的激光加工方法
    • WO2012092537A2
    • 2012-07-05
    • PCT/US2011/068037
    • 2011-12-30
    • SOLEXEL, INC.MOSLEHI, Mehrdad M.RANA, Virendra V.ANBALAGAN, PranavSARASWAT, Vivek
    • MOSLEHI, Mehrdad M.RANA, Virendra V.ANBALAGAN, PranavSARASWAT, Vivek
    • H01L31/042H01L31/18B23K26/36
    • H01L31/02363B23K26/0624B23K26/40B23K2203/50H01L21/268H01L31/0682H01L31/1804Y02E10/547Y02P70/521
    • Various laser processing schemes are disclosed for producing various types of hetero- junction and homo-junction solar cells. The methods include base and emitter contact opening, selective doping, metal ablation, annealing to improve passivation, and selective emitter doping via laser heating of aluminum. Also, laser processing schemes are disclosed that are suitable for selective amorphous silicon ablation and selective doping for hetero- junction solar cells. Laser ablation techniques are disclosed that leave the underlying silicon substantially undamaged. These laser processing techniques may be applied to semiconductor substrates, including crystalline silicon substrates, and further including crystalline silicon substrates which are manufactured either through wire saw wafering methods or via epitaxial deposition processes, or other cleavage techniques such as ion implantation and heating, that are either planar or textured/three-dimensional. These techniques are highly suited to thin crystalline semiconductor, including thin crystalline silicon films.
    • 公开了用于生产各种类型的异质结和同质结太阳能电池的各种激光加工方案。 这些方法包括基极和发射极接触开口,选择性掺杂,金属烧蚀,退火以改善钝化,以及通过激光加热铝来选择性发射极掺杂。 而且,公开了适用于异质结太阳能电池的选择性非晶硅烧蚀和选择性掺杂的激光加工方案。 公开了激光烧蚀技术,其使下面的硅基本上完好无损。 这些激光加工技术可应用于包括晶体硅衬底的半导体衬底,并且还包括通过线锯切片方法或经由外延沉积工艺或其他切割技术(例如离子注入和加热)制造的晶体硅衬底,其是 无论是平面的还是纹理的/三维的。 这些技术非常适用于薄晶体半导体,包括薄晶体硅薄膜。