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    • 4. 发明申请
    • NANOSCALE APPARATUS AND SENSOR WITH NANOSHELL AND METHOD OF MAKING SAME
    • 纳米壳的纳米尺度装置和传感器及其制造方法
    • WO2010087837A1
    • 2010-08-05
    • PCT/US2009/032498
    • 2009-01-29
    • HEWLETT-PACKARD DEVELOPMENT COMPANYQUITORIANO, Nathaniel J.KAMINS, Theodore I.
    • QUITORIANO, Nathaniel J.KAMINS, Theodore I.
    • B82B3/00
    • B81C1/0015B81B2203/0118B81B2203/0361
    • A nanoscale apparatus (100) includes a nanoshell (110) extending from a substrate (102) and an epitaxial connection (120) between the substrate and an end (112) of the nanoshell adjacent to the substrate. A nanoscale sensor (200) includes surfaces (204, 206) extending relatively perpendicular to each other, a nanoshell (210) extending from one of the surfaces, and a detector (220) that monitors motion of the nanoshell relative to another of the surfaces spaced from the nanoshell by a gap (208). A method (300) of making a nanoscale apparatus includes growing (310) a nanowire on a surface; forming (320) a core-shell composite nanostructure; exposing (330) an end of the nanowire opposite to the surface with a FIB; and removing (340) the nanowire core from the exposed end, such that a nanoshell having a hollow region is attached to the surface. A material of the nanoshell (110, 210) excludes sp 2 -bonded carbon materials.
    • 纳米级装置(100)包括从衬底(102)延伸的纳米壳(110)和衬底之间的外延连接(120)和与衬底相邻的纳米壳的端部(112)。 纳米尺度传感器(200)包括彼此相对垂直延伸的表面(204,206),从其中一个表面延伸的纳米壳(210)以及监测纳米壳相对于另一个表面的运动的检测器(220) 与纳米壳间隔开间隙(208)。 制造纳米级装置的方法(300)包括在表面上生长(310)纳米线; 形成(320)核 - 壳复合纳米结构; 用FIB将(330)与该表面相对的纳米线的一端暴露(330) 以及从所述暴露端去除(340)所述纳米线芯,使得具有中空区域的纳米壳附接到所述表面。 纳米壳(110,210)的材料不包括sp2结合的碳材料。
    • 8. 发明申请
    • CAPACITIVELY COUPLING LAYERS OF A MULTILAYER DEVICE
    • 多层设备的电容耦合层
    • WO2008088720A1
    • 2008-07-24
    • PCT/US2008/000367
    • 2008-01-10
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.KAMINS, Theodore, I.STEWART, DuncanQUITORIANO, Nathaniel, J.
    • KAMINS, Theodore, I.STEWART, DuncanQUITORIANO, Nathaniel, J.
    • H05K3/46
    • H01L31/02002G02B6/43H01L2924/0002H01L2924/00
    • A multilayer device (100, 200, 300, 400, 500) includes an electronic device layer (104, 204, 304, 404, 504) a first electrode (110, 210, 410, 510) associated witht electronic layer (104, 204, 304, 404, 504), an optical layer (108, 208, 308, 408, 508), a second electrode (112, 212, 412, 512) associated with the optical layer (108, 208, 308, 408, 508), and an insulator layer (106, 206, 306, 406, 506) provided between the first and second electrodes. The first and second electrodes are capacitively coupled to each other to faciliate electrical communication between the electronic device layer (104, 204, 304, 404, 504) and the optical layer (108, 208, 308, 408, 508) through transmission of an electrical signal between the first and second electrodes. The electrical signal may be transmiited through the insulator layer (106, 206, 306, 406, 506). In additional, the electronic device layer (104, 204, 304, 404, 504 and the optical layer (108, 208, 308, 408, 508) may be in electrical communication with each other through capacitive coupling of the first electrode (110, 210, 410, 510) and the second electrode (112, 212, 412, 512).
    • 多层器件(100,200,300,400,500)包括与电子层(104,204)相关联的第一电极(110,210,410,510)的电子器件层(104,204,304,404,504) ,304,404,504),光学层(108,208,308,408,508),与所述光学层(108,208,308,408,508)508相关联的第二电极(112,212,412,512) )和设置在第一和第二电极之间的绝缘体层(106,206,306,406,506)。 第一和第二电极彼此电容耦合以通过传输电子装置层(104,204,304,504)和光学层(108,208,308,408,508)之间的电通信来促进电子设备层 第一和第二电极之间的电信号。 电信号可以透过绝缘体层(106,206,306,406,506)传输。 另外,电子器件层(104,204,304,404,504)和光学层(108,208,308,408,508)可以通过第一电极(110,104)的电容耦合而彼此电连通, 210,410,510)和所述第二电极(112,212,412,512)。
    • 9. 发明申请
    • PHOTONIC DEVICE AND METHOD OF MAKING SAME
    • 光电装置及其制造方法
    • WO2010126519A1
    • 2010-11-04
    • PCT/US2009/042403
    • 2009-04-30
    • HEWLETT-PACKARD DEVELOPMENT COMPANYCHO, Hans, S.KAMINS, Theodore, I.QUITORIANO, Nathaniel, J.
    • CHO, Hans, S.KAMINS, Theodore, I.QUITORIANO, Nathaniel, J.
    • H01L31/04H01L31/042
    • H01L31/182H01L31/0352Y02E10/546Y02P70/521
    • A photonic device (200) and method (100) of making the photonic device (200) employs preferential etching of grain boundaries of a polycrystalline semiconductor material layer (210). The method (100) includes growing (110) the polycrystalline layer (210) on a substrate (201). The polycrystalline layer includes a transition region (212) of variously oriented grains and a region (214) of columnar grain boundaries (215) adjacent to the transition region. The method further includes preferentially etching (120) the columnar grain boundaries to provide tapered structures (220) of the semiconductor material that are continuous (217) with respective aligned grains (213) of the transition region. The tapered structures are predominantly single crystal. The method further includes forming (140) a conformal semiconductor junction (240) on the tapered structures and providing (160) first and second electrodes. The first electrode (201, 262) is adjacent to the transition region and the second electrode (260) is adjacent to a surface layer of the conformal semiconductor junction.
    • 制造光子器件(200)的光子器件(200)和方法(100)采用对多晶半导体材料层(210)的晶界的优先蚀刻。 方法(100)包括在衬底(201)上生长(110)多晶层(210)。 多晶层包括不同取向晶粒的过渡区域(212)和与过渡区域相邻的柱状晶界(215)的区域(214)。 该方法还包括优先蚀刻(120)柱状晶界以提供与过渡区域的相应对准晶粒(213)连续(217)的半导体材料的锥形结构(220)。 锥形结构主要是单晶。 该方法还包括在锥形结构上形成(140)共形半导体结(240)并提供(160)第一和第二电极。 第一电极(201,262)与过渡区域相邻,第二电极(260)与保形半导体结的表面层相邻。