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    • 3. 发明授权
    • Low viscosity thermally conductive compositions containing spherical thermally conductive particles
    • 含有球形导热颗粒的低粘度导热组合物
    • US06500891B1
    • 2002-12-31
    • US09850757
    • 2001-05-08
    • Philip KroppRobert Cross
    • Philip KroppRobert Cross
    • C08K318
    • C08K3/28C08K3/22
    • The present invention discloses a thermally conductive adhesive composition that is useful for encapsulating electronic parts. More particularly, this invention provides adhesive compositions that have 90% of the alumina particles having an average diameter sufficiently low to maintain the particles in suspension. The thermally conductive compositions of the present invention have a low viscosity and excellent thermal conductivity properties. Also contemplated is an electronic part that is encapsulated with the inventive composition, an article of manufacture having a container with the inventive composition contained therein and a method of manufacturing the inventive thermally conductive adhesive composition.
    • 本发明公开了一种用于封装电子零件的导热粘合剂组合物。 更具体地说,本发明提供粘合剂组合物,其具有90%的具有足够低的平均直径的氧化铝颗粒以保持颗粒处于悬浮状态。 本发明的导热组合物具有低粘度和优异的导热性能。 还考虑了用本发明组合物包封的电子部件,具有其中包含本发明组合物的容器的制品,以及制造本发明的导热粘合剂组合物的方法。