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    • 2. 发明申请
    • SOLAR CELL INTERCONNECTION
    • 太阳能电池互连
    • US20110092014A1
    • 2011-04-21
    • US12786396
    • 2010-05-24
    • Jayna SheatsPhil Stob
    • Jayna SheatsPhil Stob
    • H01L31/18
    • H01L31/022441H01L31/0516Y02E10/50
    • Methods and devices for solar cell interconnection are provided. In one embodiment, the method includes physically alloying the ink metal to the underlying foil (hence excellent adhesion and conductivity with no pre-treatment), and by fusing the solid particles in the ink on the surface (eliminating any organic components) so that the surface is ideally suited for good conductivity and adhesion to an overlayer of finger ink, which is expected to be another adhesive. In some embodiments, contact resistance of conductive adhesives are known to be much lower on gold or silver than on any other metals.
    • 提供太阳能电池互连的方法和装置。 在一个实施方案中,该方法包括将油墨金属物理合金化到下面的箔(因此在没有预处理的情况下具有优异的粘合性和导电性),并且通过将表面上的油墨中的固体颗粒熔融(消除任何有机成分),使得 表面理想地适合于良好的导电性和粘附到指状墨水的覆盖层,预期其是另一种粘合剂。 在一些实施方案中,已知导电粘合剂的接触电阻在金或银上比在任何其它金属上低得多。
    • 3. 发明授权
    • Solar cell interconnection
    • 太阳能电池互连
    • US08247243B2
    • 2012-08-21
    • US12786396
    • 2010-05-24
    • Jayna SheatsPhil Stob
    • Jayna SheatsPhil Stob
    • H01L21/00H01L29/06
    • H01L31/022441H01L31/0516Y02E10/50
    • Methods and devices for solar cell interconnection are provided. In one embodiment, the method includes physically alloying the ink metal to the underlying foil (hence excellent adhesion and conductivity with no pre-treatment), and by fusing the solid particles in the ink on the surface (eliminating any organic components) so that the surface is ideally suited for good conductivity and adhesion to an overlayer of finger ink, which is expected to be another adhesive. In some embodiments, contact resistance of conductive adhesives are known to be much lower on gold or silver than on any other metals.
    • 提供太阳能电池互连的方法和装置。 在一个实施方案中,该方法包括将油墨金属物理合金化到下面的箔(因此在没有预处理的情况下具有优异的粘合性和导电性),并且通过将表面上的油墨中的固体颗粒熔融(消除任何有机组分),使得 表面理想地适合于良好的导电性和粘附到指状墨水的覆盖层,预期其是另一种粘合剂。 在一些实施方案中,已知导电粘合剂的接触电阻在金或银上比在任何其它金属上低得多。