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    • 5. 发明授权
    • High density integrated ultrasonic phased array transducer and a method
for making
    • 高密度集成超声波相控阵传感器及其制造方法
    • US5644085A
    • 1997-07-01
    • US415895
    • 1995-04-03
    • Peter William LorraineVenkat Subramaniam Venkataramani
    • Peter William LorraineVenkat Subramaniam Venkataramani
    • B06B1/06H04R17/00H01L41/08
    • B06B1/0629Y10T29/42
    • The present invention discloses a high density integrated ultrasonic phased array transducer and method for making. The high density integrated ultrasonic phased array includes a backfill material having an array of holes formed therein. Each of the holes are separated a predetermined distance apart from each other and have a predetermined hole depth. Each of the holes contain a conducting material deposited therein forming a high density interconnect with uniaxial conductivity. A piezoelectric ceramic material is bonded to the backfill material at a surface opposite the array of conducting holes. Matching layers are bonded to the piezoelectric ceramic material. The surface opposite the array of conducting holes is cut through a portion of the matching layers, the piezoelectric ceramic material, and the backfill material, forming an array of isolated individual elements each having multiple electrical connections therein.
    • 本发明公开了一种高密度集成超声相控阵变换器及其制造方法。 高密度集成超声波相控阵列包括其中形成有孔阵列的回填材料。 每个孔彼此分开预定的距离并具有预定的孔深度。 每个孔包含沉积在其中的导电材料,形成具有单轴导电性的高密度互连。 压电陶瓷材料在与导电孔阵列相对的表面处结合到回填材料。 匹配层结合到压电陶瓷材料上。 与导电孔阵列相对的表面通过一部分匹配层,压电陶瓷材料和回填材料切割,形成各自具有多个电连接的独立单独元件的阵列。
    • 10. 发明授权
    • Method for making an ultrasonic phased array transducer with an ultralow impedance backing
    • 制造具有超低阻抗背衬的超声波相控阵转换器的方法
    • US06453526B2
    • 2002-09-24
    • US09828261
    • 2001-04-09
    • Peter William LorraineLowell Scott Smith
    • Peter William LorraineLowell Scott Smith
    • H04R1710
    • G10K11/002B06B1/0622B06B1/0629Y10T29/42Y10T29/49005Y10T29/49007Y10T29/4908Y10T29/49155Y10T29/49165Y10T29/49792
    • The present invention discloses an ultrasonic phased array transducer with an ultralow backfill and a method for making. The ultrasonic phased array includes a low density backfill material having an ultralow acoustic impedance. The backfill material is either an aerogel, a carbon aerogel, an xerogel, or a carbon xerogel. A piezoelectric ceramic material and two matching layers are bonded to the backfill material. In one embodiment, a plurality of interconnect vias are formed in the backfill material with conducting material deposited in the vias. A portion of the bonded matching layers, the piezoelectric ceramic material, and the backfill material have isolation cuts therethrough to form an array of electrically and acoustically isolated individual elements. In a second embodiment, the backfill material is bonded to an electronic layer at a face opposite to the piezoelectric ceramic material and the matching layers. Then isolation cuts are made through the matching layers, the piezoelectric ceramic material, and the backfill material, to form an array of electrically and acoustically isolated individual elements.
    • 本发明公开了一种具有超低回填的超声波相控阵变换器及其制造方法。 超声相控阵列包括具有超低声阻抗的低密度回填材料。 回填材料是气凝胶,碳气凝胶,干凝胶或碳干凝胶。 将压电陶瓷材料和两个匹配层结合到回填材料上。 在一个实施例中,在回填材料中形成多个互连通孔,导电材料沉积在通孔中。 粘合匹配层,压电陶瓷材料和回填材料的一部分具有穿过其的隔离切口,以形成电隔离和声隔离的各个元件阵列。 在第二实施例中,回填材料在与压电陶瓷材料和匹配层相对的面处结合到电子层。 然后通过匹配层,压电陶瓷材料和回填材料进行隔离切割,以形成电隔离和声隔离的各个元件的阵列。