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    • 8. 发明申请
    • SOLID STATE DATA STORAGE ASSEMBLY
    • 固态数据存储装置
    • US20110038123A1
    • 2011-02-17
    • US12542502
    • 2009-08-17
    • Peter R. JanikDarren E. JohnstonGordon A. Harwood
    • Peter R. JanikDarren E. JohnstonGordon A. Harwood
    • H05K7/20B23P11/00
    • H05K5/0256H05K7/20472Y10T29/49826
    • A solid state data storage assembly includes thermal interface material that conducts heat away from electrical components of the assembly. In some examples, the thermal interface material is positioned between a printed circuit board assembly, which includes electrical components, and a cover of a housing of the data storage assembly. The thermal interface material may also provide shock protection for the data storage assembly by at least one of increasing a stiffness of the data storage assembly, absorbing some mechanical loads applied to the data storage assembly or distributing the applied loads. In addition, in some examples, the thermal interface material exhibits some tackiness, such that removal of a thermal interface material from a data storage assembly and subsequent repositioning of the thermal interface material within the data storage assembly may provide a visual indication of tampering.
    • 固态数据存储组件包括将热量从组件的电气部件传导出来的热界面材料。 在一些示例中,热界面材料位于包括电气部件的印刷电路板组件和数据存储组件的壳体的盖之间。 热界面材料还可以通过增加数据存储组件的刚度,吸收施加到数据存储组件的一些机械负载或分配施加的负载中的至少一个来为数据存储组件提供冲击保护。 此外,在一些示例中,热界面材料表现出一些粘性,使得从数据存储组件中移除热界面材料并随后在数据存储组件内重新定位热界面材料可提供篡改的视觉指示。
    • 10. 发明授权
    • Solid state data storage assembly
    • 固态数据存储组件
    • US08199506B2
    • 2012-06-12
    • US12542502
    • 2009-08-17
    • Peter R. JanikDarren E. JohnstonGordon A. Harwood
    • Peter R. JanikDarren E. JohnstonGordon A. Harwood
    • H05K7/20
    • H05K5/0256H05K7/20472Y10T29/49826
    • A solid state data storage assembly includes thermal interface material that conducts heat away from electrical components of the assembly. In some examples, the thermal interface material is positioned between a printed circuit board assembly, which includes electrical components, and a cover of a housing of the data storage assembly. The thermal interface material may also provide shock protection for the data storage assembly by at least one of increasing a stiffness of the data storage assembly, absorbing some mechanical loads applied to the data storage assembly or distributing the applied loads. In addition, in some examples, the thermal interface material exhibits some tackiness, such that removal of a thermal interface material from a data storage assembly and subsequent repositioning of the thermal interface material within the data storage assembly may provide a visual indication of tampering.
    • 固态数据存储组件包括将热量从组件的电气部件传导出来的热界面材料。 在一些示例中,热界面材料位于包括电气部件的印刷电路板组件和数据存储组件的壳体的盖之间。 热界面材料还可以通过增加数据存储组件的刚度,吸收施加到数据存储组件的一些机械负载或分配施加的负载中的至少一个来为数据存储组件提供冲击保护。 此外,在一些示例中,热界面材料表现出一些粘性,使得从数据存储组件中移除热界面材料并随后在数据存储组件内重新定位热界面材料可提供篡改的视觉指示。