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1. 发明申请

US20150372211A1 LIGHT EMITTING DIODE PACKAGE 审中-公开
标题翻译：发光二极管封装
公开(公告)号：US20150372211A1
公开(公告)日：2015-12-24
申请号：US14628197
申请日：2015-02-20
申请人： Pei-Song Cai , Junpeng Shi , Xinghua Liang , Jeff Guan , Chen-Ke Xu
发明人： Pei-Song Cai , Junpeng Shi , Xinghua Liang , Jeff Guan , Chen-Ke Xu
IPC分类号： H01L33/64 , H01L33/54 , H01L25/075
摘要： This application relates to a packaging structure, particularly to a light emitting diode package structure.
摘要翻译：本申请涉及封装结构，特别涉及发光二极管封装结构。

2. 发明申请

US20120235198A1 LIGHT EMITTING DIODE PACKAGE STRUCTURE 有权
标题翻译：发光二极管封装结构
公开(公告)号：US20120235198A1
公开(公告)日：2012-09-20
申请号：US13421522
申请日：2012-03-15
申请人： Pei-Song Cai , Tzu-Pu Lin , Szu-Wei Fu
发明人： Pei-Song Cai , Tzu-Pu Lin , Szu-Wei Fu
IPC分类号： H01L33/52 , H01L33/60
CPC分类号： H01L33/46 , H01L33/50 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014
摘要： The invention provides a light emitting diode package structure, including: a light emitting diode chip formed on a substrate; a composite coating layer formed on the light emitting diode chip, wherein the composite coating layer comprises a first coating layer and a second coating layer, and the composite coating layer has a reflectivity greater than 95% at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the light emitting diode chip; and an encapsulation housing covering the light emitting diode chip, wherein the encapsulation housing comprises a wavelength transformation material.
摘要翻译：本发明提供了一种发光二极管封装结构，包括：形成在衬底上的发光二极管芯片; 形成在所述发光二极管芯片上的复合涂层，其中所述复合涂层包括第一涂层和第二涂层，并且所述复合涂层在500-800nm波长处具有大于95％的反射率; 形成在所述基板上的杯体，其中所述杯体围绕所述发光二极管芯片; 以及覆盖所述发光二极管芯片的封装壳体，其中所述封装壳体包括波长转换材料。

3. 发明授权

US08803170B2 Light source module having LEDs 有权
标题翻译：具有LED的光源模块
公开(公告)号：US08803170B2
公开(公告)日：2014-08-12
申请号：US13570560
申请日：2012-08-09
申请人： Pei-Song Cai , Yong-Hong Liao , Tzu-Pu Lin , Yun-Yi Tien , Jian-Chin Liang
发明人： Pei-Song Cai , Yong-Hong Liao , Tzu-Pu Lin , Yun-Yi Tien , Jian-Chin Liang
IPC分类号： H01L33/50
CPC分类号： F21K9/00 , F21Y2113/13 , F21Y2115/10 , H05B33/0857
摘要： A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor.
摘要翻译：光源模块包括基板，第一LED封装和第二LED封装。第一和第二LED封装设置在基板上。第一LED封装包括第一蓝色LED芯片和第一荧光体。第一蓝色LED芯片在蓝色光的波长范围内发光。第一荧光体用于转换从第一蓝色LED芯片发射的光的一部分的波长。第二LED封装包括第二蓝色LED芯片和第二荧光体。第二蓝色LED芯片在蓝光的波长范围内发光。第二荧光体用于转换从第二蓝色LED芯片发射的光的一部分的波长。与第二荧光体相关联的波长大于与第一荧光体相关联的波长。

4. 发明申请

US20120264239A1 LIGHT-TUNING METHOD 审中-公开
标题翻译：调光方法
公开(公告)号：US20120264239A1
公开(公告)日：2012-10-18
申请号：US13446196
申请日：2012-04-13
申请人： Pei-Song Cai , Yun-Yi Tien , Tzu-Pu Lin
发明人： Pei-Song Cai , Yun-Yi Tien , Tzu-Pu Lin
IPC分类号： H01L33/44
CPC分类号： G02B5/20 , H01J61/40 , H01L33/44 , H01L33/50
摘要： A light-tuning method is provided. In the method, a filter material is first selected for filtering out unwanted light of a specific wavelength to obtain a transmittance spectrum. The transmittance spectrum is multiplied by an eye sensitivity function to obtain a filtered spectrum. The filtered spectrum has a wavelength range between 450 nm and 650 nm. According to a full width at half maximum (FWHM) wavelength range of the filtered eye sensitivity function, a phosphor is selected and a light-emitting spectrum of the phosphor is determined so that between the light-emitting spectrum of the phosphor and the filtered eye sensitivity function is an optimal matching degree.
摘要翻译：提供了一种调光方法。在该方法中，首先选择滤光材料以滤出特定波长的不想要的光以获得透射光谱。将透射光谱乘以眼睛灵敏度函数以获得滤波光谱。经滤波的光谱具有在450nm和650nm之间的波长范围。根据过滤的眼睛灵敏度函数的半峰全宽（FWHM）波长范围，选择荧光体，并且确定荧光体的发光光谱，使得在荧光体的发光光谱和滤光眼之间灵敏度函数是最优匹配度。

5. 发明授权

US08735894B2 Light emitting diode package structure 有权
标题翻译：发光二极管封装结构
公开(公告)号：US08735894B2
公开(公告)日：2014-05-27
申请号：US13421522
申请日：2012-03-15
申请人： Pei-Song Cai , Tzu-Pu Lin , Szu-Wei Fu
发明人： Pei-Song Cai , Tzu-Pu Lin , Szu-Wei Fu
IPC分类号： H01L33/00
CPC分类号： H01L33/46 , H01L33/50 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014
摘要： The invention provides a light emitting diode package structure, including: a light emitting diode chip formed on a substrate; a composite coating layer formed on the light emitting diode chip, wherein the composite coating layer comprises a first coating layer and a second coating layer, and the composite coating layer has a reflectivity greater than 95% at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the light emitting diode chip; and an encapsulation housing covering the light emitting diode chip, wherein the encapsulation housing comprises a wavelength transformation material.
摘要翻译：本发明提供了一种发光二极管封装结构，包括：形成在衬底上的发光二极管芯片; 形成在所述发光二极管芯片上的复合涂层，其中所述复合涂层包括第一涂层和第二涂层，并且所述复合涂层在500-800nm波长处具有大于95％的反射率; 形成在所述基板上的杯体，其中所述杯体围绕所述发光二极管芯片; 以及覆盖所述发光二极管芯片的封装壳体，其中所述封装壳体包括波长转换材料。

6. 发明申请

US20130240921A1 LIGHT SOURCE MODULE 有权
标题翻译：光源模块
公开(公告)号：US20130240921A1
公开(公告)日：2013-09-19
申请号：US13570560
申请日：2012-08-09
申请人： Pei-Song Cai , Yong-Hong Liao , Tzu-Pu Lin , Yun-Yi Tien , Jian-Chin Liang
发明人： Pei-Song Cai , Yong-Hong Liao , Tzu-Pu Lin , Yun-Yi Tien , Jian-Chin Liang
IPC分类号： H01L33/50
CPC分类号： F21K9/00 , F21Y2113/13 , F21Y2115/10 , H05B33/0857
摘要： A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor.
摘要翻译：光源模块包括基板，第一LED封装和第二LED封装。第一和第二LED封装设置在基板上。第一LED封装包括第一蓝色LED芯片和第一荧光体。第一蓝色LED芯片在蓝色光的波长范围内发光。第一荧光体用于转换从第一蓝色LED芯片发射的光的一部分的波长。第二LED封装包括第二蓝色LED芯片和第二荧光体。第二蓝色LED芯片在蓝光的波长范围内发光。第二荧光体用于转换从第二蓝色LED芯片发射的光的一部分的波长。与第二荧光体相关联的波长大于与第一荧光体相关联的波长。

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