专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07903431B2 Electromagnetic interference shielding apparatus 有权
标题翻译：电磁干扰屏蔽装置
公开(公告)号：US07903431B2
公开(公告)日：2011-03-08
申请号：US11763157
申请日：2007-06-14
申请人： Gerald Robert English , Paul Crotty , Joseph Boetto
发明人： Gerald Robert English , Paul Crotty , Joseph Boetto
IPC分类号： H05K9/00
CPC分类号： H05K9/0032
摘要： A shielding apparatus is disclosed suitable for use in providing electromagnetic interference shielding for an electrical component on a substrate. The shielding apparatus includes a frame that is at least partially drawn in construction and is configured for installation to the substrate. Side walls of the frame generally surround the electrical component, and a cover is attachable to the frame for substantially covering the electrical component. The cover includes an upper surface having an inverted embossment formed therein, and a cover member extending generally downwardly from the upper surface adjacent the inverted embossment. The inverted embossment and cover member define a guide for guiding and receiving at least part of the frame into the guide when the cover is attached to the frame. The guide is configured to help facilitate and generally hold the cover in electrical contact with the frame when the cover is attached to the frame.
摘要翻译：公开了一种适用于为基板上的电气部件提供电磁干扰屏蔽的屏蔽装置。屏蔽装置包括至少部分地在结构上绘制并被构造成用于安装到基板的框架。框架的侧壁通常围绕电气部件，并且盖子可附接到框架以基本上覆盖电气部件。所述盖包括其上形成有倒置的压纹的上表面，以及从所述上表面大致向下延伸的盖构件，所述盖构件邻近所述倒置的压花。倒置的压花和盖构件限定了一个引导件，用于当盖子附接到框架时将框架的至少一部分引导和接纳到引导件中。该引导件构造成当盖子附接到框架时有助于便于和大体上保持盖子与框架电接触。

2. 发明申请

US20080310139A1 ELECTROMAGNETIC INTERFERENCE SHIELDING APPARATUS 有权
标题翻译：电磁干扰屏蔽装置
公开(公告)号：US20080310139A1
公开(公告)日：2008-12-18
申请号：US11763157
申请日：2007-06-14
申请人： Gerald Robert English , Paul Crotty , Joseph Boetto
发明人： Gerald Robert English , Paul Crotty , Joseph Boetto
IPC分类号： H05K9/00
CPC分类号： H05K9/0032
摘要： A shielding apparatus is disclosed suitable for use in providing electromagnetic interference shielding for an electrical component on a substrate. The shielding apparatus includes a frame that is at least partially drawn in construction and is configured for installation to the substrate. Side walls of the frame generally surround the electrical component, and a cover is attachable to the frame for substantially covering the electrical component. The cover includes an upper surface having an inverted embossment formed therein, and a cover member extending generally downwardly from the upper surface adjacent the inverted embossment. The inverted embossment and cover member define a guide for guiding and receiving at least part of the frame into the guide when the cover is attached to the frame. The guide is configured to help facilitate and generally hold the cover in electrical contact with the frame when the cover is attached to the frame.
摘要翻译：公开了一种适用于为基板上的电气部件提供电磁干扰屏蔽的屏蔽装置。屏蔽装置包括至少部分地在结构上绘制并被构造成用于安装到基板的框架。框架的侧壁通常围绕电气部件，并且盖子可附接到框架以基本上覆盖电气部件。所述盖包括其上形成有倒置的压纹的上表面，以及从所述上表面大致向下延伸的盖构件，所述盖构件邻近所述倒置的压花。倒置的压花和盖构件限定了一个引导件，用于当盖子附接到框架时将框架的至少一部分引导和接纳到引导件中。该引导件构造成当盖子附接到框架时有助于便于和大体上保持盖子与框架电接触。

3. 发明授权

US08279624B2 Board level electromagnetic interference (EMI) shields with through hole latching mechanisms 有权
标题翻译：板级电磁干扰（EMI）屏蔽带通孔锁定机构
公开(公告)号：US08279624B2
公开(公告)日：2012-10-02
申请号：US12793246
申请日：2010-06-03
申请人： Paul Crotty
发明人： Paul Crotty
IPC分类号： H05K5/00
CPC分类号： H01R13/6594 , H01R13/6271 , H01R13/6582 , H05K9/0028 , Y10T29/49908
摘要： Disclosed herein are exemplary embodiments of EMI shielding apparatus (e.g., one-piece shields, multi-piece shields, frames, etc.) having one or more latching members insertable into openings or holes in a substrate (e.g., printed circuit board, etc.) and engagable to the substrate. The engagement of the latching members with the substrate mechanically attaches the EMI shielding apparatus to the substrate.
摘要翻译：本文公开了具有一个或多个可插入基板（例如，印刷电路板等）中的开口或孔中的锁定构件的EMI屏蔽装置（例如，一体式屏蔽件，多件式屏蔽件，框架等）的示例性实施例。）并且可与衬底接合。闩锁构件与基底的接合将EMI屏蔽装置机械地附接到基底。

4. 发明申请

US20110299262A1 BOARD LEVEL ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDS WITH THROUGH HOLE LATCHING MECHANISMS 有权
标题翻译：板级电磁干扰（EMI）带有通孔式锁紧机构
公开(公告)号：US20110299262A1
公开(公告)日：2011-12-08
申请号：US12793246
申请日：2010-06-03
申请人： Paul Crotty
发明人： Paul Crotty
IPC分类号： H05K9/00 , B23P11/00
CPC分类号： H01R13/6594 , H01R13/6271 , H01R13/6582 , H05K9/0028 , Y10T29/49908
摘要： Disclosed herein are exemplary embodiments of EMI shielding apparatus (e.g., one-piece shields, multi-piece shields, frames, etc.) having one or more latching members insertable into openings or holes in a substrate (e.g., printed circuit board, etc.) and engagable to the substrate. The engagement of the latching members with the substrate mechanically attaches the EMI shielding apparatus to the substrate.
摘要翻译：本文公开了具有一个或多个可插入基板（例如，印刷电路板等）中的开口或孔中的锁定构件的EMI屏蔽装置（例如，一体式屏蔽件，多件式屏蔽件，框架等）的示例性实施例。）并且可与衬底接合。闩锁构件与基底的接合将EMI屏蔽装置机械地附接到基底。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式