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    • 3. 发明申请
    • METHODS OF DECHUCKING AND SYSTEM THEREOF
    • 删除方法及其系统
    • WO2013009794A1
    • 2013-01-17
    • PCT/US2012/046135
    • 2012-07-11
    • LAM RESEARCH CORPORATIONPOVOLNY, Henry, S.
    • POVOLNY, Henry, S.
    • C23C16/00C23F1/00H01T23/00
    • H01L21/6831H01J37/32715H01J37/32788H01J37/32816Y10T29/49764Y10T29/49815Y10T29/49817Y10T29/49822
    • A method for dechucking a substrate from an electrostatic chuck (ESC) in a plasma processing system is provided. The method includes flowing a first gas into a plasma chamber. The method also includes flowing a second gas to a backside of the substrate to create a high pressure buildup of the second gas under the backside. The method further includes reducing a flow of the second gas such that at least a portion is trapped under the substrate backside. The method yet also includes pumping out the plasma chamber to increase a pressure differential between a first pressure that exists under the backside of the substrate and a second pressure that exists in a region above the substrate, wherein the pressure differential enables the substrate to be lifted from the ESC. The method yet also includes removing the substrate from the ESC.
    • 提供了一种用于在等离子体处理系统中从静电卡盘(ESC)去除基板的方法。 该方法包括使第一气体流入等离子体室。 该方法还包括将第二气体流动到衬底的背面,以产生第二气体在背面下方的高压累积。 该方法还包括减少第二气体的流动,使得至少一部分被捕获在衬底背面下方。 该方法还包括泵出等离子体室以增加存在于衬底背面的第一压力与存在于衬底上方的区域中的第二压力之间的压力差,其中压力差使衬底能够被提升 从ESC。 该方法还包括从ESC去除衬底。