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    • 1. 发明公开
    • CONNECTOR SHEET AND MOBILE TYPE ELECTRONIC EQUIPMENT
    • 连接器和移动电子设备
    • KR20070085156A
    • 2007-08-27
    • KR20070017428
    • 2007-02-21
    • POLYMATECH CO LTD
    • KONNO HIDEAKI
    • H01R13/648
    • H01R13/6599H01R13/24H05K1/0215H05K9/0016
    • A connector sheet and a portable electronic device are provided to have a conductive characteristic necessary for removing an electronic wave noise or static electricity, and ground and connect a metal part of a housing with a circuit board by a simple mounting work. A connector sheet electrically connects a metal part(10) composing a housing of an electronic device(9) with ground connection parts of a circuit board embedded in the housing. The connector sheet has connector parts(2,3) in which a sheet part(4) of electric conductivity and a conductive part(5) are installed by one body. The sheet part(4) is mounted in the circuit board to cover the circuit board opposite to the metal part(10). The conductive part(5) has one end contacted to the metal part(10) and the other end contacted to the ground connection parts in an opposite position of the metal part(10) and the ground connection parts in the sheet part(4).
    • 提供连接器片和便携式电子装置以具有去除电子波噪声或静电所需的导电特性,并且通过简单的安装工作将壳体的金属部分与电路板接地并连接。 连接器片将构成电子设备(9)的壳体的金属部件(10)与嵌入在壳体中的电路板的接地连接部分电连接。 连接器片具有连接器部件(2,3),其中导电性片材部分(4)和导电部件(5)由一体安装。 片部分(4)安装在电路板中以覆盖与金属部分(10)相对的电路板。 导电部分(5)具有与金属部分(10)接触的一端,另一端与金属部分(10)相对的接地连接部分和片材部分(4)中的接地连接部分相接触, 。
    • 2. 发明公开
    • THERMALLY CONDUCTIVE ADHESIVE COMPOSITION AND ADHESION METHOD
    • 导电粘合剂和粘合方法
    • KR20080106021A
    • 2008-12-04
    • KR20080048693
    • 2008-05-26
    • POLYMATECH CO LTD
    • ISHIGAKI TSUKASANAKANISHI YUTAKAAOKI HISASHI
    • C09J133/08C09J133/10
    • C09J133/04C08F220/26C09J4/06
    • A thermally conductive adhesive composition is provided to be appropriately used in the application field which is necessary to have the heat conduction from a heating element. A thermally conductive adhesive composition comprises (A) a polymerizable methacrylic compound containing one or more methacrylic monomers and methacrylic oligomers; (B) organic peroxide; (C) thermally conductive filler; and (D) vanadium compound. The volume ratio(alpha) of the polymerizable methacrylic compound(A) to the thermally conductive filler(C), calculated with the equation(1) is 0.40 - 0.65, wherein the equation(1) represents the volume ratio(alpha) = the volume of thermally conductive filler(C) / (the volume of the polymerizable methacrylic compound(A) + the volume of the thermally conductive filler(C)).
    • 提供导热粘合剂组合物,以适当地用于必须具有来自加热元件的热​​传导的应用领域。 导热粘合剂组合物包含(A)含有一种或多种甲基丙烯酸单体和甲基丙烯酸低聚物的可聚合甲基丙烯酸化合物; (B)有机过氧化物; (C)导热填料; 和(D)钒化合物。 用式(1)计算的可聚合甲基丙烯酸系化合物(A)与导热性填料(C)的体积比(α)为0.40〜0.65,式(1)表示体积比(α)= 导热填料体积(C)/(可聚合甲基丙烯酸系化合物(A)的体积+导热性填料(C)的体积)。