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    • 2. 发明专利
    • Improvements in or relating to folding mechanism for use in printing machines
    • GB290105A
    • 1928-05-10
    • GB2754427
    • 1927-10-17
    • CECIL GEORGE QUICKWILLIAM OLIVER WILLIAMSEDWARD THOMAS MORRIS
    • B65H45/16
    • 290,105. Quick, C. G., Williams, W. O., and Morris, E. T. Oct. 17, 1927. Folding paper. - In folding-mechanism for printing-machines of the kind in which the sheets are folded into the bite of folding-rollers 1, 2 by means of a blade carried by a. cylinder 3, means are provided for adjusting the adjacent ends of the rollers 1, 2 so that they can be set out of parallel for completing the folding of a previously folded product, but always remain symmetrical with respect to the folding-blade. The shafts of the rollers 1. 2 are carried at each end by brackets 4, 5 having stems 6, 7 slidably mounted in guides 8, 9. Screwed extensions 11, 12 on the stems 6, 7. are engaged by nuts formed in gear wheels 13, 14 which are secured against longitudinal movement, and mesh with gear wheels 15, 16 on a hand-operated shaft 17. Rotation of of the shaft 17 adjusts adjacent ends of the rollers 1, 2 symmetrically with respect to the folding-blade. The rollers 1. 2 are driven from a gear wheel 20 on the cylinder 3 which engages a gear wheel 21 on the roller 1, coupled by intermediate gear wheels 22 - - 24 to a gear wheel 25 on the roller 2. The tangents at the points of contact between the gear wheels 23, 24, 20 with the gear wheels on the folding-rollers are substantially parallel with the direction of adjustment so that the necessary movement of the rollers does not appreciably move the gear wheels out of mesh.
    • 5. 发明授权
    • A.C. Solid state relay circuit and structure
    • 固态继电器电路及结构
    • US4535251A
    • 1985-08-13
    • US451792
    • 1982-12-21
    • Thomas HermanOliver Williams
    • Thomas HermanOliver Williams
    • H03K17/78H01L27/144H01L29/74H01L29/749H03K17/082H03K17/13H03K17/79G02B27/00
    • H03K17/79H01L27/1443H03K17/0824H03K17/136H01L2224/05553H01L2224/45124H01L2224/45144H01L2224/48091H01L2224/48137H01L2224/48139H01L2224/48227H01L2224/49175H01L2924/13033H01L2924/13091H01L2924/19107
    • A solid state a.c. relay has two separate and indentical power thyristors connected in anti-parallel arrangement. The power thyristors are optically switched, lateral conduction devices with anode and cathode electrodes on the same surface. Both are switched by illuminating their surface by reflected illumination from an LED. Each thyristor is provided with a respective control circuit which includes a MOSFET transistor for clamping its respective thyristor gate wherever the voltage across the thryistor exceeds a given absolute value or whenever there is a high dV/dt transient across the thyristor. The control circuit for the control transistor includes a capacitance divider, one element of which is the distributed capacitance of the control transistor. The control circuit components can be integrated into the same semiconductor chip which contains the respective power thyristor. Each of the two identical power chips and the LED chip are spaced from one another and mounted on an alumina substrate. Two lead wires are stitch-bonded to the electrode pads of the two chips to connect them in anti-parallel relation, and are then stitch-bonded to two respective conductive sections on the alumina substrate. The chips and the LED are covered with a cap having a reflective interior so that illumination from the LED is reflected toward the chip surfaces. The interior of the cap is filled with a transparent plastic. The assembly is housed in either a single in-line pin housing or dual in-line pin housing and the entire housing is suitably encapsulated.
    • 固态a.c. 继电器具有两个独立和独立的功率可控硅,以反并联方式连接。 功率晶闸管是光交换的,具有在相同表面上的阳极和阴极电极的侧向传导器件。 通过从LED的反射照明照亮其表面来切换两者。 每个晶闸管设置有相应的控制电路,该控制电路包括用于钳位其各自的晶闸管栅极的MOSFET晶体管,其中跨越晶闸管的电压超过给定绝对值,或者每当晶闸管上存在高dV / dt瞬态时。 用于控制晶体管的控制电路包括一个电容分压器,其一个元件是控制晶体管的分布电容。 控制电路组件可以集成到包含相应功率晶闸管的相同的半导体芯片中。 两个相同的功率芯片和LED芯片中的每一个彼此间隔开并且安装在氧化铝基板上。 两根引线与两芯片的电极焊盘进行针脚接合,将其以平行的方式连接起来,然后与氧化铝基板上的两个导电部分进行针脚接合。 芯片和LED被具有反射内部的盖子覆盖,使得来自LED的照明被反射到芯片表面。 盖的内部填充有透明塑料。 该组件被容纳在单个直列销外壳或双列直插销外壳中,并且整个壳体被适当地封装。