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    • 1. 发明专利
    • Method for forming unit including three-dimensional surface pattern, and use of the same
    • 用于形成包括三维表面图案的单元的方法及其使用
    • JP2010272877A
    • 2010-12-02
    • JP2010152462
    • 2010-07-02
    • Oerlikon Trading Ag Trubbachエルリコン トレーディング アクチェンゲゼルシャフト,トリューブバハ
    • GRABHER PATRICKHEINE-KEMPKENS CLAUSBISCHOFBERGER ROGER
    • H01L21/027G03F7/00G03F7/26G03F7/40G03F7/42
    • G03F7/0007G03F7/40G03F7/405G03F7/42G03F7/422G03F7/425
    • PROBLEM TO BE SOLVED: To provide a method for forming a unit including a three-dimensional surface pattern, and to provide use of the same.
      SOLUTION: In a first processing step, a photoresist is applied to a base layer 3. A predetermined masking exposure 13 is executed to a photoresist layer 9 in a second processing step. In a third processing step, a part of the photoresist layer 9 is removed by development such that an initial surface pattern having sacrificial layer regions 25 is obtained. In a fourth processing step, coatings 29, 31 covering the initial surface pattern are applied, especially by a sputtering method, preferably as an alternating layer system. In a fifth processing step, energy is applied to the initial surface pattern in order to destabilize the sacrificial layer regions 25. In a sixth processing step, a high-pressure liquid jet 33 is made to act on the initial surface pattern at a predetermined processing temperature, whereby at least partial parts of the coatings 29 covering the sacrificial layer regions 25 are mechanically removed or at least broken off in order to provide the final surface pattern.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种形成包括三维表面图案的单元的方法,并提供其使用。 解决方案:在第一处理步骤中,将光致抗蚀剂施加到基层3.在第二处理步骤中,对光致抗蚀剂层9执行预定的掩模曝光13。 在第三处理步骤中,通过显影去除光致抗蚀剂层9的一部分,使得获得具有牺牲层区域25的初始表面图案。 在第四处理步骤中,涂覆初始表面图案的涂层29,31,特别是通过溅射法优选作为交替层系统。 在第五处理步骤中,将能量施加到初始表面图案,以使牺牲层区域25不稳定。在第六处理步骤中,使高压液体射流33以预定处理作用于初始表面图案 温度,由此覆盖牺牲层区域25的涂层29的至少部分部分被机械地去除或至少断裂,以便提供最终的表面图案。 版权所有(C)2011,JPO&INPIT
    • 5. 发明申请
    • HIGH-POWER PULSE COATING METHOD
    • 高功率脉冲涂层方法
    • US20150167153A1
    • 2015-06-18
    • US14413480
    • 2013-06-24
    • Oerlikon Trading AG, Trubbach
    • Siegfried KrassnitzerDenis Kurapov
    • C23C14/34
    • C23C14/3485C23C14/345C23C14/3464H01J37/3405H01J37/3467H01J2237/332
    • The invention relates to a method for coating substrates by sputtering of target material, the method comprising the following steps:-applying a first sputtering target made of a first material in a coating chamber to a power pulse by which, during a first time interval, a first amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 50 W/cm2 and preferably 500 W/cm2;-applying a second sputtering target made of a second material that is different from the first material in the coating chamber to a power pulse by which, during a second time interval, a second amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 50 W/cm 2 and preferably 500W/cm2, characterized in that the first amount of energy differs from the second amount of energy.
    • 本发明涉及通过溅射目标材料涂覆基板的方法,该方法包括以下步骤:将由涂覆室中的第一材料制成的第一溅射靶施加到第一时间间隔内的功率脉冲, 第一量的能量被传送到溅射靶,其中最大功率密度超过50W / cm 2,优选为500W / cm 2;使用与涂层中的第一材料不同的第二材料制成的第二溅射靶 在第二时间间隔内将第二量的能量传递到溅射靶,其中最大功率密度超过50W / cm 2,优选为500W / cm 2,其特征在于,第一量的 能量与第二量的能量不同。
    • 6. 发明申请
    • REACTIVE SPUTTERING PROCESS
    • 反应溅射法
    • US20140311892A1
    • 2014-10-23
    • US14362758
    • 2012-11-23
    • Oerlikon Trading AG, Trubbach
    • Siegfried Krassnitzer
    • C23C14/34
    • C23C14/3485C23C14/0094C23C14/3492H01J37/3467H01J37/3485
    • Reactive sputtering in which, by ion bombardment, material is ejected from the surface of a target and transitions to the gas phase. Negative voltage pulses are applied to the target to establish electric current having a current density greater than 0.5 A/cm2 at the target surface, such that the material transitioning to the gas phase is ionized. Reactive gas flow is established and reacts with the material of the target surface. Voltage pulse duration is such that, during the pulse, the target surface where the current flows is at least partly covered most of the time with a compound composed of reactive gas and target material and, consequently, the target surface is in a first intermediate state, and this covering is smaller at the end of the voltage pulse than at the start and, consequently, the target surface is in a second intermediate state at the end of the voltage pulse.
    • 反应溅射,其中通过离子轰击,材料从靶的表面喷射并转变到气相。 向目标施加负电压脉冲,以在目标表面建立电流密度大于0.5A / cm 2的电流,使得转移到气相的材料被电离。 建立反应性气体流动并与目标表面的材料反应。 电压脉冲持续时间使得在脉冲期间,电流流动的目标表面至少部分地被由反应性气体和靶材料组成的化合物大部分地覆盖,因此目标表面处于第一中间状态 并且该覆盖在电压脉冲结束时比在开始时更小,因此,目标表面在电压脉冲结束时处于第二中间状态。