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1. 发明申请

WO2008130779A1 ANTILOADING COMPOSITION FOR AN ABRASIVE ARTICLE AND ABRASIVE ARTICLE HAVING AN ANTILOADING COATING 审中-公开
标题翻译：防磨损物品的防粘组合物和具有防粘涂层的磨砂物品
公开(公告)号：WO2008130779A1
公开(公告)日：2008-10-30
申请号：PCT/US2008/058095
申请日：2008-03-25
申请人： 3M INNOVATIVE PROPERTIES COMPANY , OKA, Hitoshi , TAKINAMI, Satoru
发明人： OKA, Hitoshi , TAKINAMI, Satoru
IPC分类号： B24C11/00 , B24D3/00 , C09K3/14
CPC分类号： B24C11/00 , B24C11/005 , B24D3/346
摘要： To improve the endurance of the antiloading effect of an antiloading composition for an abrasive article. The antiloading composition for an abrasive article, comprising a metal salt of a fatty acid and a binding resin, wherein a coating formed therefrom has wetting tension of more than 44 mN/m.
摘要翻译：为了提高磨料制品的抗载荷组合物的抗荷载作用的耐久性。用于磨料制品的抗负荷组合物，其包含脂肪酸的金属盐和粘合树脂，其中由其形成的涂层具有大于44mN / m的润湿张力。

2. 发明申请

WO1998007186A1 METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于制造半导体器件的方法和装置
公开(公告)号：WO1998007186A1
公开(公告)日：1998-02-19
申请号：PCT/JP1997002731
申请日：1997-08-06
申请人： HITACHI, LTD. , SAITO, Akio , OKA, Hitoshi , TAKAMATSU, Akira , YOSHIDA, Tadanori , TANAKA, Katsuhiko , FURUKAWA, Ryouichi
发明人： HITACHI, LTD.
IPC分类号： H01L21/304
CPC分类号： H01L21/3065
摘要： The contaminant which hinders the improvement of the yield of semiconductor devices becomes finer in size as the packing density of an integrated circuit formed on the surface of a substrate, such as the semiconductor wafer, etc., increases. In addition, it frequently occurs that adhering matters are formed on the internal surface of a film forming device, dry etching device, etc., and, when the matters come off the internal surface, adhere to the surface of a wafer as foreign matters. Therefore, it becomes necessary to clean the surface of the wafer and the internal surface of the device and this cleaning drops the throughput of the device. The above-mentioned problem is solved by controlling the temperatures of the wafer and internal surface of the device, the distribution of plasma, the flow rate and component of a gas, etc., so that the wafer and internal surface of the device can be cleaned simultaneously under the optimum condition.
摘要翻译：随着形成在诸如半导体晶片等的基板的表面上的集成电路的堆积密度的增加，妨碍半导体器件的产量提高的污染物的尺寸变得越来越细小。此外，经常发生在成膜装置，干蚀刻装置等的内表面上形成附着物，并且当物质从内表面脱落时，作为异物附着在晶片的表面上。因此，需要清洁晶片的表面和器件的内表面，并且这种清洁降低了器件的吞吐量。通过控制晶片的温度和器件的内表面，等离子体的分布，气体的流量和分量等来解决上述问题，使得晶片和器件的内表面可以是在最佳条件下同时清洁。

3. 发明申请

WO2006113143A2 DUST-COLLECTING ABRASIVE BACKUP PAD 审中-公开
标题翻译：集尘抛光垫
公开(公告)号：WO2006113143A2
公开(公告)日：2006-10-26
申请号：PCT/US2006012816
申请日：2006-04-06
申请人： 3M INNOVATIVE PROPERTIES CO , TAKINAMI SATORU , OKA HITOSHI
发明人： TAKINAMI SATORU , OKA HITOSHI
IPC分类号： B24B55/10 , B24D9/08
CPC分类号： B24D9/08 , B24B55/10
摘要： To make it unnecessary to align holes and thus reduce efforts to replace an abrasive material when an abrasive material having dust-collecting holes is installed in a dust-collecting abrasive backup pad. A dust-collecting abrasive backup pad comprising: a substrate sheet material having a sander fitting surface, a major surface and at least one dust-collecting holes; a bridge-like support material having at least one bridge piers fixed on the major surface; a mesh material fixed on the bridge-like support material so as to be parallel to the major surface; and a dust pocket formed between the substrate sheet material and the mesh material for communicating plural mesh holes of the mesh material with at least one dust-collecting holes of the substrate sheet material.
摘要翻译：当在集尘研磨备用垫中安装具有集尘孔的研磨材料时，不需要对准孔并因此减少更换研磨材料的努力。一种集尘研磨备用垫，包括：具有砂光装配表面，主表面和至少一个集尘孔的基材片材; 具有固定在主表面上的至少一个桥墩的桥状支撑材料; 固定在所述桥状支撑材料上以与所述主表面平行的网状材料; 以及形成在所述基材片材和所述网状材料之间的用于使所述网状材料的多个网眼孔与所述基材片材的至少一个集尘孔连通的集尘袋。

4. 发明申请

WO2006113374A1 SHEET-FORM COATED ABRASIVE ARTICLE 审中-公开
标题翻译：表面涂层磨砂制品
公开(公告)号：WO2006113374A1
公开(公告)日：2006-10-26
申请号：PCT/US2006/013938
申请日：2006-04-12
申请人： 3M INNOVATIVE PROPERTIES COMPANY , OKA, Hitoshi , TAKINAMI, Satoru
发明人： OKA, Hitoshi , TAKINAMI, Satoru
IPC分类号： B24D11/04
CPC分类号： B24D11/04
摘要： To provide a sheet-form coated abrasive article which is excellent in removing abrasive swarf, yet provide a fine, uniformly textured surface, during the roughening process of autobody repair. A sheet-form coated abrasive article having two kinds of effective abrasive faces on an abrasive surface, the one being an effective abrasive face which has a plurality of perforations, and the other being an effective abrasive face which is non-perforated, wherein an effective abrasive face at peripheral part reaches to an end of the abrasive article.
摘要翻译：提供在自动修复的粗糙化过程中，除去磨料切屑，同时提供细小的均匀纹理表面的片状涂层磨料制品。一种片状涂覆的磨料制品，在研磨表面上具有两种有效的研磨面，一个是有效的研磨面，其具有多个穿孔，另一个是非穿孔的有效研磨面，周边部分的研磨面到达磨料制品的一端。

5. 发明申请

WO2006113143A3 DUST-COLLECTING ABRASIVE BACKUP PAD 审中-公开
公开(公告)号：WO2006113143A3
公开(公告)日：2006-10-26
申请号：PCT/US2006/012816
申请日：2006-04-06
申请人： 3M INNOVATIVE PROPERTIES COMPANY , TAKINAMI, Satoru , OKA, Hitoshi
发明人： TAKINAMI, Satoru , OKA, Hitoshi
IPC分类号： B24B55/10 , B24D9/08
摘要： To make it unnecessary to align holes and thus reduce efforts to replace an abrasive material when an abrasive material having dust-collecting holes is installed in a dust-collecting abrasive backup pad. A dust-collecting abrasive backup pad comprising: a substrate sheet material having a sander fitting surface, a major surface and at least one dust-collecting holes; a bridge-like support material having at least one bridge piers fixed on the major surface; a mesh material (4) fixed on the bridge-like support material so as to be parallel to the major surface; and a dust pocket formed between the substrate sheet material and the mesh material (4) for communicating plural mesh holes of the mesh material with at least one dust-collecting holes of the substrate sheet material .

6. 发明申请

WO1997016847A1 SAMPLE RETAINING METHOD, SAMPLE ROTATING METHOD, SAMPLE SURFACE FLUID TREATMENT METHOD AND APPARATUSES FOR THESE METHODS 审中-公开
标题翻译：样品保留方法，样品旋转方法，样品表面流体处理方法和这些方法的装置
公开(公告)号：WO1997016847A1
公开(公告)日：1997-05-09
申请号：PCT/JP1996003178
申请日：1996-10-30
申请人： HITACHI, LTD. , OKA, Hitoshi , SATOH, Takao , TAKAHARA, Yoichi , SAEKI, Tomonori , SAITO, Akio
发明人： HITACHI, LTD.
IPC分类号： H01L21/304
CPC分类号： H01L21/6838
摘要： In order to attain a fluid treatment apparatus of small dimensions and a high cleaness by retaining a sample stably by simple retainer guides in a Bernoulli's retainer and rotating the sample by a fluid jet, the retainer guides are formed so as to be mechanically separated from a sample retaining surface, and the sample is retained in a contacting state by ejecting a fluid thereto, the sample guides being rotated in a non-contacting state by a jet of the fluid. A plurality of fluid supply sources are connected to the retainer, and not less than one kind of fluid is supplied to the sample. Since the sample guides (8) prevent the tangential displacement of the sample (1), a continuous treatment using various kinds of fluids can be conducted in a non-air-contacting state by one mechanism. Since these sample guides (8) are rotated by a jet of a fluid, a driving motor and certain kinds of parts of the mechanism are not required, and a great reduction of the dimensions of the apparatus can be attained.
摘要翻译：为了通过简单的保持器引导件在伯努利的保持器中保持样品并通过流体射流旋转样品来获得小尺寸和高清洁度的流体处理设备，形成保持器引导件以与机械分离样品保持表面，并且样品通过喷射流体而保持在接触状态，样品引导件通过流体的射流在非接触状态下旋转。多个流体供应源连接到保持器，并且不少于一种流体供应到样品。由于样品引导件（8）防止样品（1）的切向位移，因此可以通过一种机构在非空气接触状态下进行使用各种流体的连续处理。由于这些样品引导件（8）通过流体的流动旋转，所以不需要驱动电机和机构的某些类型的部件，并且可以实现装置的尺寸的大大减小。

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