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    • 1. 发明申请
    • STACKED MICROELECTRONIC ASSEMBLY HAVING INTERPOSER CONNECTING ACTIVE CHIPS
    • 具有连接主动插座的插座的堆叠式微电子组件
    • WO2012075371A1
    • 2012-06-07
    • PCT/US2011/063025
    • 2011-12-02
    • TESSERA, INC.HABA, BelgacemOGANESIAN, VageMOHAMMED, IlyasSAVALIA, PiyushMITCHELL, Craig
    • HABA, BelgacemOGANESIAN, VageMOHAMMED, IlyasSAVALIA, PiyushMITCHELL, Craig
    • H01L25/065H01L23/48H01L25/16
    • H01L25/0657H01L21/486H01L21/76898H01L23/36H01L23/481H01L23/49822H01L23/49827H01L25/16H01L2224/16225H01L2225/06513H01L2225/06517H01L2225/06541H01L2225/06572H01L2924/15311
    • A microelectronic assembly (100) can include first and second microelectronic elements (102, 112) each embodying active semiconductor devices adjacent a front surface (104, 114) thereof, and an interposer (120) of a material having a CTE less than 10 ppm/°C. Each microelectronic element (102, 112) can have a conductive pad (106, 116) exposed at the respective front surface (104, 114). The interposer (120) can have a second conductive element (118) extending within an opening (222) in the interposer and exposed at first and second surfaces (227, 229) of the interposer. The first and second surfaces (227, 229) can face the front surface (104, 114) of the respective first and second microelectronic elements (102, 112). Each microelectronic element (102, 112) can include a first conductive element (236, 238) extending within an opening (206, 216) extending from a rear surface (237, 239) towards the front surface (104, 114) of the respective microelectronic element. At least one of the first conductive elements (236, 238) can extend through the conductive pad (204, 214) of the respective first or second microelectronic element (102, 112).
    • 微电子组件(100)可以包括第一和第二微电子元件(102,112),每个微电子元件(102,112)各自体现邻近其前表面(104,114)的有源半导体器件,以及具有CTE小于10ppm的材料的插入件(120) /C。 每个微电子元件(102,112)可以具有在相应的前表面(104,114)处暴露的导电垫(106,116)。 插入器(120)可以具有在插入器中的开口(222)内延伸并在插入件的第一和第二表面(227,229)处露出的第二导电元件(118)。 第一和第二表面(227,229)可面对相应的第一和第二微电子元件(102,112)的前表面(104,114)。 每个微电子元件(102,112)可以包括第一导电元件(236,238),该第一导电元件(236,238)在从后表面(237,239)朝向相应的后表面(227,119)的前表面(104,114)延伸的开口(206,216)内延伸 微电子元件。 第一导电元件(236,238)中的至少一个可以延伸通过相应的第一或第二微电子元件(102,112)的导电焊盘(204,214)。