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1. 发明申请

US20060042502A1 Composition for polishing metal, polishing metod for metal layer, and production method for wafer 审中-公开
标题翻译：用于抛光金属的组合物，金属层的抛光及其制造方法
公开(公告)号：US20060042502A1
公开(公告)日：2006-03-02
申请号：US10532966
申请日：2003-10-31
申请人： Takashi Sato , Ayako Nishioka , Novuo Uotani
发明人： Takashi Sato , Ayako Nishioka , Novuo Uotani
IPC分类号： C09G1/08
CPC分类号： C09G1/14 , C09G1/02 , H01L21/3212
摘要： A metal polishing composition is used for polishing a metal layer and comprises a film forming compound which polymerizes on a surface of the metal layer, forming a polymer film on the surface of the metal layer. A polishing method for the metal layer comprises a step of polishing and planarizing the metal layer using the metal polishing composition. A production method for a wafer comprises a step of polishing and planarizing a metal layer which is formed on top of a wafer that contains recesses so as to fill and cover the recesses, by the polishing method for a metal layer. According to the composition and polishing method, dishing is prevented to improve the planarity, and the polishing rate for polishing metal layers, and particularly copper layers, is improved, enabling high speed polishing at low pressure. Furthermore, because scratching of the metal layer is also prevented, the yield improves.
摘要翻译：金属抛光组合物用于抛光金属层，并且包括在金属层的表面上聚合的成膜化合物，在金属层的表面上形成聚合物膜。金属层的抛光方法包括使用金属抛光组合物抛光和平坦化金属层的步骤。用于晶片的制造方法包括通过金属层的抛光方法来研磨和平面化金属层的步骤，该金属层形成在包含凹部的晶片顶部以填充和覆盖凹部。根据组成和抛光方法，防止了凹陷以提高平面度，并且提高了用于研磨金属层，特别是铜层的抛光速率，使得能够在低压下进行高速抛光。此外，由于也防止了金属层的划伤，所以产率提高。

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