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    • 5. 发明申请
    • HEAT DISSIPATING DEVICE FOR ELECTRONIC APPARATUS, AND ELECTRONIC APPARATUS
    • 电子装置用散热装置及电子装置
    • US20100091251A1
    • 2010-04-15
    • US12633018
    • 2009-12-08
    • Hiroko FUJIBAYASHIDaiki FujiwaraHiroyuki MeguroNoriyuki Hagino
    • Hiroko FUJIBAYASHIDaiki FujiwaraHiroyuki MeguroNoriyuki Hagino
    • G03B21/16H05K7/20
    • G03B21/16
    • A heat dissipating device for an electronic apparatus includes an enclosure that houses a component of the electronic apparatus which becomes hot when the electronic apparatus is in use, the enclosure being made of a heat conductive material capable of dissipating heat in the enclosure to the outside, a heat receiving member provided between the component and the enclosure and capable of receiving heat from the component and transferring the received heat, a heat insulating member provided in contact with a side of the heat receiving member opposite from the component and configured to prevent transmission of the heat received by the heat receiving member, and a heat diffusing member provided between the heat insulating member and the enclosure in contact with both the heat insulating member and the enclosure and capable of receiving heat from the heat insulating member and diffusing the received heat into the enclosure.
    • 一种用于电子设备的散热装置,包括容纳电子设备的部件的外壳,当电子设备在使用中时,电子设备的部件变热,该外壳由能够将外壳中的热量散发到外部的导热材料制成, 设置在所述部件和所述外壳之间并且能够从所述部件接收热量并传送所接收的热量的受热部件,设置成与所述热接收部件的与所述部件相对的一侧接触的隔热部件, 由热接收部件接收的热量,以及设置在隔热部件和外壳之间的与散热部件和外壳接触的热扩散部件,能够从绝热部件接收热量并使接收的热量扩散 外壳。