专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08456854B2 Method of repair of electronic device and repair system 失效
公开(公告)号：US08456854B2
公开(公告)日：2013-06-04
申请号：US12285632
申请日：2008-10-09
申请人： Shigeo Iriguchi , Kiyoyuki Hatanaka , Satoshi Watanabe , Nobuo Taketomi , Keiichi Yamamoto , Masaru Sugie
发明人： Shigeo Iriguchi , Kiyoyuki Hatanaka , Satoshi Watanabe , Nobuo Taketomi , Keiichi Yamamoto , Masaru Sugie
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K3/3494 , H05K1/0212 , H05K3/225 , H05K2203/101 , H05K2203/176 , Y10T29/49137
摘要： A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board.

2. 发明申请

US20120312586A1 FLEXIBLE PRINTED BOARD 有权
标题翻译：柔性印刷板
公开(公告)号：US20120312586A1
公开(公告)日：2012-12-13
申请号：US13590908
申请日：2012-08-21
申请人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
IPC分类号： H05K1/00
CPC分类号： H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要： A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译：柔性印刷电路板包括基材，第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸，沿假想线布置的第二导电焊盘并且以假想线的后侧的前端延伸到第二宽度，第一布线图案设置在第二导电焊盘之间，并且第三宽度延伸到连接到第一导电焊盘的后端的前端，以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层，并且在第一导电焊盘的后端的前侧具有前边缘，在后端的后侧具有后边缘的第二导电焊盘。

3. 发明申请

US20060073711A1 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US20060073711A1
公开(公告)日：2006-04-06
申请号：US11033256
申请日：2005-01-12
申请人： Kiyoyuki Hatanaka , Satoshi Watanabe , Shigeo Iriguchi , Nobuo Taketomi , Yoshitaka Muraoka
发明人： Kiyoyuki Hatanaka , Satoshi Watanabe , Shigeo Iriguchi , Nobuo Taketomi , Yoshitaka Muraoka
IPC分类号： H05K1/00
CPC分类号： H05K1/028 , H01R12/59 , H01R35/02 , H04M1/0227
摘要： A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.
摘要翻译：将主体和旋转体彼此电连接的柔性印刷电路板预先通过旋转体旋转的旋转角的一半的角度扭转。柔性印刷电路板的一端固定在主体上，另一端固定在旋转体上。旋转体沿着使柔性印刷电路板的扭曲减小的方向旋转。

4. 发明授权

US06340797B1 Printed circuit board having signal patterns of varying widths 失效
标题翻译：具有不同宽度的信号图案的印刷电路板
公开(公告)号：US06340797B1
公开(公告)日：2002-01-22
申请号：US09468295
申请日：1999-12-21
申请人： Takashi Yoshida , Masahide Watanabe , Nobuo Taketomi
发明人： Takashi Yoshida , Masahide Watanabe , Nobuo Taketomi
IPC分类号： H05K116
CPC分类号： H05K1/112 , H05K2201/09227 , H05K2201/09727 , H05K2201/10734
摘要： A printed circuit board is provided with a plurality of insulator layers and a plurality of conductor layers, and an outermost conductor layer has a plurality of foot patterns in outer and inner rows for mounting a BGA component and signal patterns. The width of at least a part of the signal pattern extending from the foot pattern in the outer row is greater than the width of the signal pattern extending from the foot pattern in the inner row. The printed circuit board further includes a protection layer for covering the signal patterns on the outermost conductor layer, and the protection layer has openings each for permitting the foot pattern to be exposed. At least a portion of the signal pattern appearing in the opening is widened.
摘要翻译：印刷电路板设置有多个绝缘体层和多个导体层，并且最外面的导体层具有用于安装BGA部件和信号图案的外排和内排中的多个脚图案。从外排中的脚图形延伸的信号图案的至少一部分的宽度大于从内排中的脚图案延伸的信号图案的宽度。印刷电路板还包括用于覆盖最外面的导体层上的信号图案的保护层，并且保护层具有各自的开口以允许脚图案露出。出现在开口中的信号图案的至少一部分变宽。

5. 发明申请

US20110240355A1 PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板单元，电子设备及制作印刷电路板的方法
公开(公告)号：US20110240355A1
公开(公告)日：2011-10-06
申请号：US13071693
申请日：2011-03-25
申请人： Naoki NAKAMURA , Nobuo TAKETOMI , Kiyoyuki HATANAKA , Shigeo IRIGUCHI
发明人： Naoki NAKAMURA , Nobuo TAKETOMI , Kiyoyuki HATANAKA , Shigeo IRIGUCHI
IPC分类号： H05K1/16 , H05K3/00
CPC分类号： H05K3/305 , H01L21/56 , H01L23/562 , H01L24/98 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/351 , Y02P70/613 , Y10T29/49124 , H01L2924/00
摘要： A printed circuit board unit includes a printed circuit board and an electronic component. The electronic component is electrically connected to a predetermined position on the printed circuit board by means of soldering while being joined to the printed circuit board using an adhesive layer. The adhesive layer, disposed between the printed circuit board and the electronic component, partially includes a multilayer laminated region including a first reinforcement resin layer and a second reinforcement resin layer. The first reinforcement resin layer is disposed on a side of the printed circuit board, whereas the second reinforcement resin layer is disposed on a side of the electronic component. The second reinforcement resin layer has adhesive strength greater than that of the first reinforcement resin layer.
摘要翻译：印刷电路板单元包括印刷电路板和电子部件。电子部件通过焊接电连接到印刷电路板上的预定位置，同时使用粘合剂层与印刷电路板接合。布置在印刷电路板和电子部件之间的粘合剂层部分地包括包括第一增强树脂层和第二增强树脂层的多层层叠区域。第一增强树脂层设置在印刷电路板的一侧，而第二增强树脂层设置在电子部件的一侧。第二增强树脂层的粘合强度大于第一增强树脂层的粘合强度。

6. 发明申请

US20100212938A1 FLEXIBLE PRINTED BOARD 有权
标题翻译：柔性印刷板
公开(公告)号：US20100212938A1
公开(公告)日：2010-08-26
申请号：US12698635
申请日：2010-02-02
申请人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
IPC分类号： H05K1/02
CPC分类号： H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要： A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译：柔性印刷电路板包括基材，第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸，沿假想线布置的第二导电焊盘并且以假想线的后侧的前端延伸到第二宽度，第一布线图案设置在第二导电焊盘之间，并且第三宽度延伸到连接到第一导电焊盘的后端的前端，以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层，并且在第一导电焊盘的后端的前侧具有前边缘，在后端的后侧具有后边缘的第二导电焊盘。

7. 发明申请

US20100200643A1 METHOD FOR PRODUCING ELECTRONIC PART UNIT 审中-公开
标题翻译：生产电子零件单元的方法
公开(公告)号：US20100200643A1
公开(公告)日：2010-08-12
申请号：US12697195
申请日：2010-01-29
申请人： Nobuo Taketomi , Shigeo Iriguchi , Kazuhisa Tsunoi , Kiyoyuki Hatanaka
发明人： Nobuo Taketomi , Shigeo Iriguchi , Kazuhisa Tsunoi , Kiyoyuki Hatanaka
IPC分类号： B23K31/02 , B23K1/00
CPC分类号： H05K3/4617 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/186 , H05K3/323 , H05K3/341 , H05K3/368 , H05K3/4069 , H05K3/4602 , H05K3/4658 , H05K2201/09481 , H05K2203/061 , H01L2224/0401
摘要： A method for producing an electronic part unit, the method includes: mounting a first electronic part on a first surface of a first substrate by reflow soldering; mounting a second electronic part on a second surface of a second substrate by reflow soldering; adhering a second surface of the first substrate to a first surface of a third substrate; and adhering a second surface of the second substrate to a second surface of the third substrate.
摘要翻译：一种电子部件单元的制造方法，所述方法包括：通过回流焊将第一电子部件安装在第一基板的第一面上; 通过回流焊将第二电子部件安装在第二基板的第二表面上; 将第一基板的第二表面粘附到第三基板的第一表面; 以及将所述第二基板的第二表面附着到所述第三基板的第二表面。

8. 发明申请

US20110240352A1 PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板和制作印刷电路板的方法
公开(公告)号：US20110240352A1
公开(公告)日：2011-10-06
申请号：US13071678
申请日：2011-03-25
申请人： Naoki NAKAMURA , Nobuo TAKETOMI , Kiyoyuki HATANAKA , Shigeo IRIGUCHI
发明人： Naoki NAKAMURA , Nobuo TAKETOMI , Kiyoyuki HATANAKA , Shigeo IRIGUCHI
IPC分类号： H05K1/02 , H05K3/34
CPC分类号： H05K3/3452 , H05K3/225 , H05K3/303 , H05K3/3436 , H05K2201/0129 , H05K2203/0574 , H05K2203/0588 , H05K2203/176 , Y02P70/613 , Y10T29/49144
摘要： A printed circuit board includes a printed circuit board body and a resin layer. The printed circuit board body includes a plurality of mounting pads. The resin layer, containing a thermoplastic resin, is formed on the surface of the printed circuit board body. The resin layer includes a plurality of holes disposed to be aligned with the positions of the mounting pads on a one-to-one basis for exposing the mounting pads therethrough. In a method of fabricating the printed circuit board, the resin layer is formed atop the printed circuit board body.
摘要翻译：印刷电路板包括印刷电路板主体和树脂层。印刷电路板主体包括多个安装焊盘。在印刷电路板主体的表面上形成含有热塑性树脂的树脂层。树脂层包括多个孔，其设置成与安装焊盘的位置一一对准地对准，以使安装焊盘从中穿过。在制造印刷电路板的方法中，树脂层形成在印刷电路板主体的顶部。

9. 发明授权

US09295155B2 Flexible printed board 有权
标题翻译：柔性印刷板
公开(公告)号：US09295155B2
公开(公告)日：2016-03-22
申请号：US13590908
申请日：2012-08-21
申请人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
IPC分类号： H05K1/00 , H05K1/11 , H05K1/02
CPC分类号： H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要： A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译：柔性印刷电路板包括基材，第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸，沿假想线布置的第二导电焊盘并且以假想线的后侧的前端延伸到第二宽度，第一布线图案设置在第二导电焊盘之间，并且第三宽度延伸到连接到第一导电焊盘的后端的前端，以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层，并且在第一导电焊盘的后端的前侧具有前边缘，在后端的后侧具有后边缘的第二导电焊盘。

10. 发明申请

US20110286188A1 MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCTURE, AND METHOD OF MAKING SAME 审中-公开
标题翻译：使用柔性互连结构的多层印刷电路板及其制造方法
公开(公告)号：US20110286188A1
公开(公告)日：2011-11-24
申请号：US13048056
申请日：2011-03-15
申请人： Ryo KANAI , Shunichi KIKUCHI , Naoki NAKAMURA , Shigeru SUGINO , Kiyoyuki HATANAKA , Nobuo TAKETOMI
发明人： Ryo KANAI , Shunichi KIKUCHI , Naoki NAKAMURA , Shigeru SUGINO , Kiyoyuki HATANAKA , Nobuo TAKETOMI
IPC分类号： H05K5/00 , H01L21/50 , H05K1/18
CPC分类号： H05K1/185 , H01L23/4985 , H01L23/5389 , H01L24/73 , H01L2224/0401 , H01L2224/06181 , H01L2224/16225 , H01L2224/32225 , H01L2224/33181 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07811 , H01L2924/12042 , H05K1/186 , H05K3/4602 , H05K3/4691 , H05K2201/10681 , H05K2201/10734 , H05K2203/063 , H05K2203/1469 , H01L2924/00
摘要： A multilayer printed circuit board includes an interior interconnect layer, and a semiconductor package including a flexible interconnect structure whose distal end is a free end, wherein the flexible interconnect structure and the interior interconnect layer are electrically connected to each other.
摘要翻译：多层印刷电路板包括内部互连层和包括其前端是自由端的柔性互连结构的半导体封装，其中柔性互连结构和内部互连层彼此电连接。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式