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1. 发明申请

US20130224057A1 MANUFACTURING METHOD OF BEARING DEVICE 审中-公开
标题翻译：轴承装置的制造方法
公开(公告)号：US20130224057A1
公开(公告)日：2013-08-29
申请号：US13590199
申请日：2012-08-21
申请人： MING-HSIU CHUNG , NIEN-TIEN CHENG
发明人： MING-HSIU CHUNG , NIEN-TIEN CHENG
IPC分类号： B22F7/00
CPC分类号： B22F5/106 , B22F2998/10 , B22F3/22 , B22F3/1021 , B22F2003/247 , B22F3/1025
摘要： A method for manufacturing a bearing device includes steps: providing a hollow mold, then injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired perform of a cylindrical body and a desired perform of a cover; separating the binder from the desired perform of the body and the desired perform of the cover; sintering the desired perform of the body and the desired perform of the cover, thereby forming the body and the cover; and mounting the cover on the body, thereby forming the bearing device.
摘要翻译：一种用于制造轴承装置的方法包括以下步骤：提供中空模具，然后在压力下将粉末和熔融粘合剂的原料注入模具中，从而形成圆柱体的期望性能和所需的盖子性能; 将所述粘合剂与所述本体的所需性能和所述盖的期望性能分离; 烧结本体的所需性能和所需的盖的性能，从而形成本体和盖; 并将盖安装在主体上，从而形成轴承装置。

2. 发明申请

US20130037244A1 FLAT HEAT PIPE 审中-公开
标题翻译：平热管
公开(公告)号：US20130037244A1
公开(公告)日：2013-02-14
申请号：US13654609
申请日：2012-10-18
申请人： SHENG-LIN WU , HAI-PING SHEN , SHENG-LIANG DAI , YU-LIANG LO , NIEN-TIEN CHENG
发明人： SHENG-LIN WU , HAI-PING SHEN , SHENG-LIANG DAI , YU-LIANG LO , NIEN-TIEN CHENG
IPC分类号： F28D15/04
CPC分类号： F28D15/0233 , F28D15/046 , H01L23/427 , H01L23/49548 , H01L2924/0002 , H01L2924/00
摘要： A flat heat pipe includes a casing, a wick structure received in the casing, and a working medium contained in the casing and saturated in the wick structure. The casing has an upper plate and a bottom plate opposite to the upper plate. The wick structure is attached only to the bottom plate of the casing. The wick structure spaces from the upper plate with a vapor channel defined between the upper plate and the wick structure.
摘要翻译：平面热管包括壳体，容纳在壳体中的芯结构，以及容纳在壳体中并在芯结构中饱和的工作介质。壳体具有与上板相对的上板和底板。油绳结构仅附接到壳体的底板。来自上板的芯结构空间具有限定在上板和芯结构之间的蒸气通道。

3. 发明申请

US20120234901A1 MANUFACTURING METHOD OF A HEAT DISSIPATION DEVICE WITH GUIDING LINES AND SOLDERED HEAT PIPES 有权
标题翻译：具有引导线和焊接热管的散热装置的制造方法
公开(公告)号：US20120234901A1
公开(公告)日：2012-09-20
申请号：US13487274
申请日：2012-06-04
申请人： MING-TANG ZHANG , WEI-HSIANG CHANG , NIEN-TIEN CHENG
发明人： MING-TANG ZHANG , WEI-HSIANG CHANG , NIEN-TIEN CHENG
IPC分类号： B23K31/02
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H05K7/20318 , Y10T29/4935 , H01L2924/00
摘要： An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.
摘要翻译：制造散热装置的一个典型的方法包括：首先，提供一种包括具有平坦外表面的冷凝器部分的热管，以及提供包括限定引导线的支撑表面的散热器。引导线的宽度小于冷凝器部分的外表面的宽度。接下来，沿着引导线在支撑表面上扩展焊料量，以在支撑表面上形成焊料层。焊料层的尺寸不大于冷凝器部分的外表面的尺寸。然后将热管的冷凝器部分的外表面附着在散热片的支撑表面上的焊料层上。

4. 发明申请

US20110030923A1 THERMAL MODULE 审中-公开
标题翻译：热模块
公开(公告)号：US20110030923A1
公开(公告)日：2011-02-10
申请号：US12581173
申请日：2009-10-19
申请人： CHENG-JEN LIANG , JUI-WEN HUNG , NIEN-TIEN CHENG
发明人： CHENG-JEN LIANG , JUI-WEN HUNG , NIEN-TIEN CHENG
IPC分类号： F28D15/02 , F28D21/00 , G06F1/20
CPC分类号： G06F1/203 , F28D15/0233
摘要： A thermal module comprises a cooling fan, a heat pipe and a fin assembly. The cooling fan defines an air outlet therein. The fin assembly is mounted at the air outlet of the cooling fan. The heat pipe comprises an evaporating section attached to the cooling fan and a condensing section attached to the fin assembly. The evaporating section of the heat pipe is wholly located within an inner space of the cooling fan.
摘要翻译：热模块包括冷却风扇，热管和翅片组件。冷却风扇在其中限定出气口。翅片组件安装在冷却风扇的出风口处。热管包括连接到冷却风扇的蒸发部分和连接到散热片组件的冷凝部分。热管的蒸发部分完全位于冷却风扇的内部空间内。

5. 发明申请

US20090268392A1 NOTEBOOK COMPUTER HAVING HEAT PIPE 失效
标题翻译：具有热管的笔记本计算机
公开(公告)号：US20090268392A1
公开(公告)日：2009-10-29
申请号：US12169639
申请日：2008-07-09
申请人： NIEN-TIEN CHENG , YUNG-FA CHENG , RUNG-AN CHEN , CHENG-JEN LIANG , CHING-BAI HWANG
发明人： NIEN-TIEN CHENG , YUNG-FA CHENG , RUNG-AN CHEN , CHENG-JEN LIANG , CHING-BAI HWANG
IPC分类号： G06F1/20 , H05K7/14 , H05K7/20
CPC分类号： G06F1/203
摘要： A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.
摘要翻译：笔记本电脑包括发热部件，由导热材料制成的键盘框架和具有蒸发器和冷凝器的热管。热管的蒸发器与发热部件热连通，并且冷凝器连接到键盘框架并远离发热部件。

6. 发明授权

US07381346B2 Thermal interface material 失效
标题翻译：热界面材料
公开(公告)号：US07381346B2
公开(公告)日：2008-06-03
申请号：US11521918
申请日：2006-09-15
申请人： Ching-Tai Cheng , Nien-Tien Cheng
发明人： Ching-Tai Cheng , Nien-Tien Cheng
IPC分类号： C09K5/08 , H05K7/20 , F28F7/00
CPC分类号： H01L23/42 , F28F13/00 , F28F2013/006 , H01L23/3737 , H01L2924/0002 , H01L2924/00
摘要： A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface material includes pentaerythritol oleate as base oil and fillers filled in the pentaerythritol oleate for improving the heat conductivity of the thermal interface material. The pentaerythritol oleate is used for holding the fillers therein and filling the air interstices to achieve an intimate contact between the heat dissipating apparatus and the electronic component. The fillers include aluminum powders, zinc oxide powders and zinc oxide nano-particles.
摘要翻译：热界面材料用于施加到接触表面以消除散热装置和电子部件之间的空气间隙，以便改善电子部件的散热。热界面材料包括作为基础油的季戊四醇油酸酯和填充在油酸季戊四醇酯中的填料，用于改善热界面材料的导热性。油酸季戊四醇用于保持其中的填料并填充空气间隙以实现散热装置和电子部件之间的紧密接触。填料包括铝粉，氧化锌粉和氧化锌纳米颗粒。

7. 发明授权

US06418393B1 Thermal module inspecting device 失效
标题翻译：热模块检测装置
公开(公告)号：US06418393B1
公开(公告)日：2002-07-09
申请号：US09221648
申请日：1998-12-28
申请人： Chun-Hsin Lu , Pao-Lung Lin , Nien-Tien Cheng
发明人： Chun-Hsin Lu , Pao-Lung Lin , Nien-Tien Cheng
IPC分类号： G01K100
CPC分类号： G01M99/002
摘要： An inspecting device for a thermal module for cooling a CPU of a computer to decide whether the module can work properly is disclosed. The device includes a computer stored with preset data. A measuring unit has a heater generating heat with a predetermined temperature. A converter electrically connects the heater with the computer and converts an analogous signal corresponding to the temperature of the heater to a digital signal which is sent to the computer. A force generating mechanism is provided on the measuring unit which can generate a pressing force toward the heater. When the heater is contact with a heat-generating component contact part of the thermal module and the force generating mechanism is activated to press the part against the heater, the computer compares the data stored therein and the signal received from the converter to determine whether the thermal module can attain its required performance.
摘要翻译：公开了一种用于冷却计算机的CPU以确定模块是否能正常工作的热模块的检查装置。该设备包括存储有预设数据的计算机。测量单元具有产生具有预定温度的热量的加热器。 A转换器将加热器与计算机电连接并将对应于加热器的温度的类似信号转换为发送到计算机的数字信号。力产生机构设置在测量单元上，该力可以产生朝向加热器的按压力。当加热器与热模块的发热部件接触部分接触并且力产生机构被激活以将部件压靠在加热器上时，计算机将存储在其中的数据和从转换器接收的信号进行比较，以确定是否热模块可以达到要求的性能。

8. 发明授权

US08622117B2 Heat pipe including a main wick structure and at least one auxiliary wick structure 有权
标题翻译：热管包括主芯结构和至少一个辅助灯芯结构
公开(公告)号：US08622117B2
公开(公告)日：2014-01-07
申请号：US12491246
申请日：2009-06-25
申请人： Sheng-Lin Wu , Yu-Liang Lo , Wen-Hu Chen , Yue Liu , Nien-Tien Cheng
发明人： Sheng-Lin Wu , Yu-Liang Lo , Wen-Hu Chen , Yue Liu , Nien-Tien Cheng
IPC分类号： F28D15/00
CPC分类号： B21D53/02 , B23P15/26 , B23P2700/09 , F28D15/0233 , F28D15/046
摘要： A heat pipe includes a casing, a main wick structure received in the casing, an auxiliary wick structure received in the main wick structure, and a working fluid contained in the casing. The main wick structure is attached to an inner surface of the casing. An inner peripheral surface of the main wick structure and an outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel. The auxiliary wick structure is hollow, and extends along a longitudinal direction of the casing. A liquid channel is defined in the auxiliary wick structure. Two ends of the auxiliary wick structure are both fixed on the two ends of the casing. The working fluid is saturated in the main wick structure and the auxiliary wick structure.
摘要翻译：热管包括壳体，容纳在壳体中的主芯结构，容纳在主芯结构中的辅助芯结构以及容纳在壳体中的工作流体。主芯结构附接到壳体的内表面。主芯结构的内周表面和辅助芯结构的外周表面协同地限定蒸气通道。辅助油绳结构是中空的，并且沿壳体的纵向方向延伸。在辅助油绳结构中限定了液体通道。辅助油绳结构的两端都固定在壳体的两端。工作油在主油芯结构和辅助油绳结构中饱和。

9. 发明授权

US08578605B2 Manufacturing method of a heat dissipation device with guiding lines and soldered heat pipes 有权
标题翻译：具有引导线和焊接热管的散热装置的制造方法
公开(公告)号：US08578605B2
公开(公告)日：2013-11-12
申请号：US13487274
申请日：2012-06-04
申请人： Ming-Tang Zhang , Wei-Hsiang Chang , Nien-Tien Cheng
发明人： Ming-Tang Zhang , Wei-Hsiang Chang , Nien-Tien Cheng
IPC分类号： B21D53/02
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H05K7/20318 , Y10T29/4935 , H01L2924/00
摘要： An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.
摘要翻译：制造散热装置的一个典型的方法包括：首先，提供一种包括具有平坦外表面的冷凝器部分的热管，以及提供包括限定引导线的支撑表面的散热器。引导线的宽度小于冷凝器部分的外表面的宽度。接下来，沿着引导线在支撑表面上扩展焊料量，以在支撑表面上形成焊料层。焊料层的尺寸不大于冷凝器部分的外表面的尺寸。然后将热管的冷凝器部分的外表面附着在散热片的支撑表面上的焊料层上。

10. 发明申请

US20120292007A1 HEAT DISSPATION DEVICE AND CONTROL METHOD 审中-公开
标题翻译：加热装置和控制方法
公开(公告)号：US20120292007A1
公开(公告)日：2012-11-22
申请号：US13220641
申请日：2011-08-29
申请人： HUNG-NIEN CHIU , CHING-BAI HWANG , NIEN-TIEN CHENG
发明人： HUNG-NIEN CHIU , CHING-BAI HWANG , NIEN-TIEN CHENG
IPC分类号： F28F13/00 , F28D15/04
CPC分类号： F28D15/0275 , F28D15/0233 , F28D15/06 , F28D2021/0028 , F28F1/32
摘要： A heat dissipation device for cooling a heat generating component, includes a fins module, a heat pipe, a fan, at least two temperature sensors, and a control system. The heat pipe includes an evaporation section absorbing heat from the heat generating component, and a condensation section thermally connected to the fins module. The fan is for driving airflow towards the fins module. The at least two temperature sensors are arranged on the evaporation section of the heat pipe, for continuously sensing temperatures of their respective positions on the heat pipe. The control system adjusts the speed of the fan and/or the operating power of the heat generating component according to the sensed temperatures of the at least two temperature sensors. A method for controlling the heat dissipation device is also provided.
摘要翻译：一种用于冷却发热部件的散热装置，包括翅片模块，热管，风扇，至少两个温度传感器和控制系统。热管包括从发热部件吸收热量的蒸发部和与散热片模块热连接的冷凝部。风扇用于驱动朝向散热片模块的气流。至少两个温度传感器布置在热管的蒸发部分上，用于连续检测热管上各自位置的温度。控制系统根据感测到的至少两个温度传感器的温度来调节风扇的速度和/或发热部件的操作功率。还提供了一种用于控制散热装置的方法。

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