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1. 发明授权

US4870224A Integrated circuit package for surface mount technology 失效
标题翻译：用于表面贴装技术的集成电路封装
公开(公告)号：US4870224A
公开(公告)日：1989-09-26
申请号：US214219
申请日：1988-07-01
申请人： William D. Smith , Richard Dennis , Nicholas Brathwaite , Richard C. Blish, II
发明人： William D. Smith , Richard Dennis , Nicholas Brathwaite , Richard C. Blish, II
IPC分类号： H01L23/31 , H01L23/498 , H01L25/065 , H05K1/14 , H05K3/28 , H05K3/34
CPC分类号： H05K3/3405 , H01L23/315 , H01L23/49811 , H01L25/0655 , H01L2224/16225 , H01L2924/09701 , H01L2924/16251 , H05K1/141 , H05K2201/10386 , H05K3/284 , H05K3/3426 , Y10T29/49121
摘要： The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate surface. Conductive lines then couple the contacts to the peripheral edges of the substrate where one set of ends of a lead frame assembly mates with the conductors. An encapsulation technique is used to encapsulate the device, such that only the other set of ends of the lead frame assembly extends from the package. In an alternative embodiment, the integrated circuit is hermetically sealed by having a hermetic cover disposed over the integrated circuit. In a second alternative embodiment, the substrate is capable of having disposed upon it multiple integrated circuits. The present invention provides for a significant increase of lead count to die size ratio.
摘要翻译：本发明提供一种用于容纳集成电路装置的装置和方法。集成电路器件耦合到陶瓷衬底，其中集成电路器件的触点与衬底表面上的触点配合。导线然后将触点耦合到衬底的周边边缘，其中引线框架组件的一组端部与导体配合。使用封装技术来封装器件，使得仅引线框架组件的另一组端部从封装延伸。在替代实施例中，集成电路通过设置在集成电路上方的密封盖来密封。在第二替代实施例中，基板能够在其上放置多个集成电路。本发明提供了引线数对芯片尺寸比的显着增加。

2. 发明申请

US20070038967A1 System and method for design, procurement and manufacturing collaboration 有权
标题翻译：设计，采购和制造协作的系统和方法
公开(公告)号：US20070038967A1
公开(公告)日：2007-02-15
申请号：US11585370
申请日：2006-10-24
申请人： Nicholas Brathwaite , Ram Bommakanti , Visvanathan Ganapathy , Paul Burns , Douglas Maddox , Michael Durkan
发明人： Nicholas Brathwaite , Ram Bommakanti , Visvanathan Ganapathy , Paul Burns , Douglas Maddox , Michael Durkan
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , G06F17/50 , G06F17/5045 , G06F2217/00 , G06F2217/04 , G06F2217/74 , G06Q90/00 , G06Q99/00
摘要： A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated with the corresponding devices, presenting the devices to the designer based on the procurement data, and receiving input from the designer identifying one of the presented devices as a selected device. In a particular method, the returned devices are sorted based on one or more procurement values (e.g., manufacturer, price, availability, manufacturer status, etc.), and presented to the designer in a ranked list. Objects representative of the selected devices are then entered into a design file, and the objects are associated with the device's engineering and/or procurement data. In a particular embodiment, the objects are associated with the engineering data by embedding the engineering data in the file object. Optionally, data can be associated with the objects via links to the database. Types of engineering data that can be associated with design file objects include, but are not limited to, device footprint data, device pinout data, device physical dimension data, parametric data, and packaging data. Additionally, connection data and annotation data can be entered into the design file objects by the designer.
摘要翻译：一种用于设计电子部件的方法包括从设计者接收设备标准（例如，参数值，采购价值等），向数据库查询对应于设备标准的设备，查询数据库以获取采购数据和/或工程与相应设备相关联的数据，基于采购数据将设备呈现给设计者，以及从设计者接收将所呈现设备中的一个标识为所选设备的输入。在特定方法中，返回的设备基于一个或多个采购值（例如，制造商，价格，可用性，制造商状态等）进行排序，并以排名列表呈现给设计者。然后将所选设备的代表物体输入到设计文件中，并且对象与设备的工程和/或采购数据相关联。在特定实施例中，通过将工程数据嵌入文件对象中，对象与工程数据相关联。可选地，数据可以通过到数据库的链接与对象相关联。可以与设计文件对象相关联的工程数据的类型包括但不限于设备占用空间数据，设备引脚数据，设备物理尺寸数据，参数数据和打包数据。另外，连接数据和注释数据可以由设计者输入设计文件对象。

3. 发明申请

US20050285973A1 System and method for mounting an image capture device on a flexible substrate 有权
标题翻译：将图像捕获装置安装在柔性基板上的系统和方法
公开(公告)号：US20050285973A1
公开(公告)日：2005-12-29
申请号：US10877816
申请日：2004-06-25
申请人： Harpuneet Singh , Nicholas Brathwaite , Bhret Graydon
发明人： Harpuneet Singh , Nicholas Brathwaite , Bhret Graydon
IPC分类号： G06K9/00 , H01L27/00 , H01L27/14 , H01L27/146 , H04N5/225 , H05K1/18
CPC分类号： H01L27/14625 , H01L27/14618 , H01L2924/15192 , H04N5/2253 , H04N5/2254 , H05K1/189
摘要： A digital camera module includes an image capture device mounted on a flexible circuit substrate. In one embodiment of the digital camera module, the image capture device is mounted directly (e.g., by an adhesive) on the flexible circuit substrate. A stiffener (e.g., a piece of circuit board material) is mounted to the back of the flexible circuit substrate to support wire bonding of the image capture device onto the flexible circuit substrate and/or to support the mounting of additional components (e.g., a lens housing).
摘要翻译：数字照相机模块包括安装在柔性电路基板上的图像捕获装置。在数字照相机模块的一个实施例中，图像捕获装置直接（例如通过粘合剂）安装在柔性电路基板上。加强件（例如，一块电路板材料）安装到柔性电路基板的背面，以支持图像捕获装置的引线键合到柔性电路基板上和/或支持附加部件的安装（例如，镜头外壳）。

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