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1. 发明申请

US20100013067A9 Stress Mitigation in Packaged Microchips 有权
标题翻译：包装微芯片中的应力减轻
公开(公告)号：US20100013067A9
公开(公告)日：2010-01-21
申请号：US11770369
申请日：2007-06-28
申请人： Xin Zhang , Michael Judy , Kevin H.L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
发明人： Xin Zhang , Michael Judy , Kevin H.L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
摘要翻译：包装装置具有与盖连接以形成引线框封装的底座。包装具有第一和第二外表面，其具有相应的第一和第二接触图案。第一和第二接触图案基本上是电气相同的，以允许包装件垂直或水平地安装到下面的设备。

2. 发明授权

US06695457B2 Bulk silicon mirrors with hinges underneath 有权
标题翻译：散装硅镜，底部有铰链
公开(公告)号：US06695457B2
公开(公告)日：2004-02-24
申请号：US10159153
申请日：2002-05-31
申请人： Bert P. van Drieënhuizen , Nelson Kuan , Jeffrey P. Wilde
发明人： Bert P. van Drieënhuizen , Nelson Kuan , Jeffrey P. Wilde
IPC分类号： G02B7182
CPC分类号： G02B26/0841
摘要： This invention provides method and apparatus for fabricating a MEMS apparatus having a bulk element with hinges underneath. The bulk element may comprise single-crystal silicon, fabricated by way of bulk micromachining techniques. The hinges may be made of thin-films, fabricated by way of surface micromachining techniques. A distinct feature of the MEMS apparatus of the present invention is that by disposing the hinges underneath the bulk element, the surface of the bulk element can be maximized and the entire surface becomes usable (e.g., for optical beam manipulation). Such a feature would be highly advantageous in making arrayed MEMS device, such as an array of MEMS mirrors with a high optical fill factor. Further, by advantageously making use of both bulk and surface micromachining techniques, a MEMS mirror thus produced is equipped with a large and flat mirror along with flexible hinges, hence capable of achieving a substantial rotational range at modest electrostatic drive voltages.
摘要翻译：本发明提供了一种用于制造MEMS器件的方法和装置，其具有在下面具有铰链的块体元件。本体元件可以包括通过体微加工技术制造的单晶硅。铰链可以由通过表面微加工技术制造的薄膜制成。本发明的MEMS装置的一个显着特征在于，通过将铰链设置在体元件下方，可以使块体元件的表面最大化，并且整个表面变得可用（例如，用于光束操纵）。这样的特征在制造阵列MEMS器件（例如具有高光学填充因子的MEMS镜阵列）方面将是非常有利的。此外，通过有利地利用本体和表面微加工技术，由此制造的MEMS反射镜与柔性铰链一起配备大型和平面镜，因此能够在适度的静电驱动电压下实现基本的旋转范围。

3. 发明申请

US20080205025A1 Package Having a Plurality of Mounting Orientations 有权
标题翻译：具有多种安装方向的封装
公开(公告)号：US20080205025A1
公开(公告)日：2008-08-28
申请号：US11780894
申请日：2007-07-20
申请人： Timothy R. Spooner , Nelson Kuan
发明人： Timothy R. Spooner , Nelson Kuan
IPC分类号： H05K7/18 , H05K3/20
CPC分类号： H01L23/49861 , H01L23/04 , H01L24/48 , H01L2224/48091 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/19041 , Y10T29/49128 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
摘要翻译：包装装置具有与盖连接以形成引线框封装的底座。包装具有第一和第二外表面，其具有相应的第一和第二接触图案。第一和第二接触图案基本上是电气相同的，以允许包装件垂直或水平地安装到下面的设备。

4. 发明申请

US20080157298A1 Stress Mitigation in Packaged Microchips 有权
标题翻译：包装微芯片中的应力减轻
公开(公告)号：US20080157298A1
公开(公告)日：2008-07-03
申请号：US11770369
申请日：2007-06-28
申请人： Xin Zhang , Michael Judy , Kevin H.L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
发明人： Xin Zhang , Michael Judy , Kevin H.L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
摘要翻译：包装装置具有与盖连接以形成引线框封装的底座。包装具有第一和第二外表面，其具有相应的第一和第二接触图案。第一和第二接触图案基本上是电气相同的，以允许包装件垂直或水平地安装到下面的设备。

5. 发明授权

US06820988B2 Bulk silicon mirrors with hinges underneath 有权
公开(公告)号：US06820988B2
公开(公告)日：2004-11-23
申请号：US10716841
申请日：2003-11-18
申请人： Bert P. van Drieënhuizen , Nelson Kuan , Jeffrey P. Wilde
发明人： Bert P. van Drieënhuizen , Nelson Kuan , Jeffrey P. Wilde
IPC分类号： G02B7182
CPC分类号： G02B26/0841
摘要： This invention provides method and apparatus for fabricating a MEMS apparatus having a bulk element with hinges underneath. The bulk element may comprise single-crystal silicon, fabricated by way of bulk micromachining techniques. The hinges may be made of thin-films, fabricated by way of surface micromachining techniques. A distinct feature of the MEMS apparatus of the present invention is that by disposing the hinges underneath the bulk element, the surface of the bulk element can be maximized and the entire surface becomes usable (e.g., for optical beam manipulation). Such a feature would be highly advantageous in making arrayed MEMS devices, such as an array of MEMS mirrors with a high optical fill factor. Further, by advantageously making use of both bulk and surface micromachining techniques, a MEMS mirror thus produced is equipped with a large and flat mirror along with flexible hinges, hence capable of achieving a substantial rotational range at modest electrostatic drive voltages.

6. 发明授权

US08344487B2 Stress mitigation in packaged microchips 有权
标题翻译：包装微芯片中的应力减轻
公开(公告)号：US08344487B2
公开(公告)日：2013-01-01
申请号：US11770369
申请日：2007-06-28
申请人： Xin Zhang , Michael Judy , Kevin H. L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
发明人： Xin Zhang , Michael Judy , Kevin H. L. Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.
摘要翻译：封装的微芯片具有引线框架，其中芯片直接接触引线框架的至少一个连续部分。引线框架的一部分具有形成凹部并与模具接触的顶表面。封装的微芯片还具有基本上封装引线框架部分顶表面的一部分的模制材料。

7. 发明授权

US07968807B2 Package having a plurality of mounting orientations 有权
标题翻译：具有多个安装方向的包装
公开(公告)号：US07968807B2
公开(公告)日：2011-06-28
申请号：US11780894
申请日：2007-07-20
申请人： Timothy R. Spooner , Nelson Kuan
发明人： Timothy R. Spooner , Nelson Kuan
IPC分类号： H01L23/495
CPC分类号： H01L23/49861 , H01L23/04 , H01L24/48 , H01L2224/48091 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/19041 , Y10T29/49128 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
摘要翻译：包装装置具有与盖连接以形成引线框封装的底座。包装具有第一和第二外表面，其具有相应的第一和第二接触图案。第一和第二接触图案基本上是电气相同的，以允许包装件垂直或水平地安装到下面的设备。

8. 发明申请

US20090230521A2 Stress Mitigation in Packaged Microchips 有权
标题翻译：包装微芯片中的应力减轻
公开(公告)号：US20090230521A2
公开(公告)日：2009-09-17
申请号：US11770369
申请日：2007-06-28
申请人： Xin Zhang , Michael Judy , Kevin Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
发明人： Xin Zhang , Michael Judy , Kevin Chau , Nelson Kuan , Timothy Spooner , Chetan Paydenkar , Peter Farrell
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/3142 , H01L23/49503 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.
摘要翻译：封装的微芯片具有引线框架，其中芯片直接接触引线框架的至少一个连续部分。引线框架的一部分具有形成凹部并与模具接触的顶表面。封装的微芯片还具有基本上封装引线框架部分顶表面的一部分的模制材料。

9. 发明申请

US20100258348A1 INTERCONNECT AND SYSTEM INCLUDING SAME 审中-公开
标题翻译：互连和系统包括相同
公开(公告)号：US20100258348A1
公开(公告)日：2010-10-14
申请号：US12755011
申请日：2010-04-06
申请人： Joshua Ziff , Joseph R. Acquaviva , Chien Hung Wu , William Jan , Charles Buenzli , Nelson Kuan
发明人： Joshua Ziff , Joseph R. Acquaviva , Chien Hung Wu , William Jan , Charles Buenzli , Nelson Kuan
IPC分类号： H02G3/00 , H01B5/14
CPC分类号： G01J5/34 , G01J5/02 , G01J5/024 , G01J5/06 , G01J5/08 , G01J5/0834
摘要： An interconnect. The interconnect includes a thermal isolation structure and a layer of conductive material which covers the thermal isolation structure. The thermal isolation structure has a first end, a second end, and a sidewall.
摘要翻译：互连。互连包括热隔离结构和覆盖热隔离结构的导电材料层。热隔离结构具有第一端，第二端和侧壁。

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